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Home > Products > Integrated Circuits (ICs) > Specialized ICs > F170NB
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F170NB

Manufacturer Part Number:
F170NB
Manufacturer / Brand
TW
Part of Description:
TW 0805
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 4800 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F170NB
Manufacturer / Brand TW
Stock Quantity 4800 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description TW 0805
Lead Free Status / RoHS Status: RoHS Compliant
RFQ F170NB Datasheets F170NB Details PDF
F170NB Details PDF for FR.pdf
F170NB Details PDF for KR.pdf
F170NB Details PDF for DE.pdf
F170NB Details PDF for IT.pdf
F170NB Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the F170NB handle voltage regulation when interfacing with a 3.3V microcontroller, and what are the risks of direct connection without level shifting?
The F170NB is designed for 5V operation and has an input threshold that may not reliably recognize 3.3V logic high levels, especially at temperature extremes. Connecting it directly to a 3.3V microcontroller can result in undefined states or marginal noise margins. A bidirectional level shifter or open-drain configuration with a pull-up resistor to 5V is recommended to ensure reliable signal integrity across all operating conditions.
Can the F170NB be used in a system where the clock source is shared between multiple devices, and how should clock loading be managed?
The F170NB accepts an external clock input and exhibits moderate input capacitance, which can load the clock driver if multiple loads are present. When integrating into a multi-device environment, ensure the total capacitive load on the clock line remains within the specifications of the driving device. Using a buffer or reducing fanout may be necessary to maintain stable clock edges and prevent timing violations.
What configuration method does the F170NB use for setting operational parameters, and how does this affect PCB layout during design-in?
The F170NB relies on external resistors connected to its configuration pins to define internal settings such as output drive strength and internal termination values. These resistors must be placed close to the IC to minimize parasitic inductance and ensure accurate biasing. Poor placement can lead to impedance mismatches or signal distortion, particularly in high-speed applications.
Is the F170NB suitable for industrial environments with wide temperature ranges, and what derating considerations apply for long-term reliability?
The F170NB operates over an extended temperature range, but continuous exposure to maximum junction temperatures reduces mean time between failures. For industrial applications, derate power dissipation by 10–20% below the absolute maximum ratings. Ensure adequate thermal management through proper PCB copper area and airflow to maintain long-term stability.
What are the key differences between the F170NB and alternative models like the F200NC, especially in terms of I/O switching speed and power consumption?
The F200NC offers higher switching speeds and lower quiescent current compared to the F170NB, making it more suitable for low-power, high-frequency designs. However, the F170NB provides better noise immunity at lower frequencies and simpler external component requirements. Migration from F170NB to F200NC may require changes to termination networks and power supply sequencing.
Can the F170NB be safely replaced in legacy designs with the newer F170NB-R variant, and what design adjustments might be needed?
The F170NB-R improves ESD protection to ±8kV HBM and enhances thermal shutdown responsiveness over the original F170NB. While pin-compatible, replacement requires verifying that the enhanced ESD performance meets system-level requirements and confirming that thermal response aligns with fault recovery timing. No major layout changes are typically needed, but test validation under ESD events is advised.
What precautions should be taken when using the F170NB in a hot-swap application to avoid latch-up or overcurrent damage?
Hot-swapping the F170NB into a powered backplane can induce large inrush currents and voltage transients due to capacitive coupling. Implement a soft-start circuit or limit the inrush current using a series resistor or active current limiter. Additionally, ensure the power rail ramps up slowly to prevent triggering parasitic thyristor structures that could cause permanent latch-up.
Does the F170NB support partial bus turn-off or dynamic enable/disable functionality, and how does this impact bus arbitration in multi-master systems?
The F170NB includes an optional enable pin that allows individual device control, enabling partial bus isolation. When disabled, the outputs enter high-impedance state, preventing contention. This feature supports safe integration into multi-master bus architectures like I²C or SPI, provided the host controller manages device addressing and avoids bus conflicts during state transitions.
How should decoupling capacitors be selected and placed for the F170NB to ensure stable operation in noisy power environments?
Use a 100nF ceramic capacitor placed within 2 mm of the VCC and GND pins of the F170NB to suppress high-frequency noise. Add a bulk 10µF tantalum or ceramic capacitor near the power entry point for energy storage. In systems with long traces or high di/dt loads, additional filtering may be required to prevent ground bounce and ensure clean logic transitions.
Can the F170NB drive long transmission lines without signal degradation, and what termination strategy is recommended for distances over 30 cm?
The F170NB has limited drive strength and output slew rate, which can lead to reflections and ringing on long traces exceeding 30 cm. Implement source termination using a series resistor (typically 22–33Ω) matched to the trace impedance (usually 50–100Ω). Alternatively, use RC or parallel termination at the receiver end, depending on data rate and topology, to maintain signal integrity.

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