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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP3078ECN
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SP3078ECN

Manufacturer Part Number:
SP3078ECN
Manufacturer / Brand
EXAR
Part of Description:
SP3078ECN SIPEX SOP8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 14761 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP3078ECN
Manufacturer / Brand EXAR
Stock Quantity 14761 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP3078ECN SIPEX SOP8
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP3078ECN Datasheets SP3078ECN Details PDF
SP3078ECN Details PDF for FR.pdf
SP3078ECN Details PDF for KR.pdf
SP3078ECN Details PDF for IT.pdf
SP3078ECN Details PDF for ES.pdf
SP3078ECN Details PDF for DE.pdf
Package SOP8
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key power supply considerations when integrating the SP3078ECN into an industrial control system with a 24V nominal input?
The SP3078ECN is designed for robust industrial environments and supports a wide operating voltage range from 3.0V to 5.5V on its VCC pin. When interfacing with a 24V DC input, an external LDO or switching regulator must be used to step down the voltage to within this range before connecting to the SP3078ECN’s power rail. Failure to do so may result in device damage due to overvoltage. Ensure adequate thermal management at the regulator stage, as continuous operation near the upper voltage limit increases power dissipation.
Can the SP3078ECN directly interface with 3.3V microcontroller I/O pins without level shifting?
Yes, the SP3078ECN accepts TTL-level logic inputs (0–3.6V) and is fully compatible with 3.3V CMOS logic. Its receiver inputs have built-in hysteresis and threshold levels that align with 3.3V systems, allowing direct connection to 3.3V microcontrollers such as ARM Cortex-M series or ESP32 devices without additional level-shifting circuitry.
Is the SP3078ECN suitable for use in automotive applications requiring ISO 7637-2 compliance?
No, the SP3078ECN is not qualified for automotive environments under AEC-Q100 and lacks transient protection features required by ISO 7637-2. While it can tolerate brief voltage spikes up to ±25V on the receiver inputs, sustained exposure to load dump events or fast transients typical in automotive systems may compromise reliability. For automotive use, consider dedicated transceivers like the TJA1042T or ISO1050-based solutions.
How does the SP3078ECN handle bus contention during hot-plug scenarios in multi-device RS-485 networks?
The SP3078ECN includes ±15kV ESD protection on all pins and supports true differential signaling, which mitigates bus contention risks. However, during hot insertion, internal MOSFET drivers may temporarily drive both A and B lines high simultaneously, causing current surges. To prevent damage, ensure pull-up/pull-down resistors are present on the A/B lines and consider using a hot-swap controller if frequent plugging is expected.
What configuration options exist for enabling or disabling the SP3078ECN’s internal termination resistors?
The SP3078ECN integrates selectable internal 120Ω termination resistors between the A and B differential lines. These can be enabled via the TE (Termination Enable) pin. When TE is pulled low, termination is active; when high or left floating, it is disabled. This allows flexible matching only when needed—such as at segment ends—reducing parasitic loading on long buses.
Can the SP3078ECN operate reliably in ambient temperatures exceeding 85°C without derating?
The SP3078ECN has an industrial temperature grade rating from -40°C to +85°C. Operation at the upper end of this range requires careful attention to power dissipation, especially when driving capacitive loads or operating at higher data rates. Thermal resistance (θJA) in SOP8 packaging is approximately 100°C/W, so layout considerations—including ground plane proximity and airflow—are essential to maintain junction temperature below maximum limits.
What are the implications of replacing the SP3078ECN with the SP3078EN in a legacy design?
The SP3078EN is functionally equivalent but packaged in DIP-8 instead of SOP8. Replacing the SP3078ECN with the EN variant requires PCB footprint redesign unless a breakout adapter is used. Additionally, the DIP package has higher thermal resistance, which may affect performance in compact designs. Signal integrity remains unchanged, but mechanical mounting and space constraints should be reevaluated during migration.
Does the SP3078ECN support half-duplex communication with automatic driver enable/disable?
Yes, the SP3078ECN supports full-duplex RS-485 communication. For half-duplex applications, the DE (Driver Enable) and RE (Receiver Enable) pins must be externally controlled by a GPIO or logic circuit. There is no automatic direction control—designers must manage timing between transmit and receive modes to avoid data collisions, particularly at high baud rates.
Are there any known limitations when cascading multiple SP3078ECN nodes on a single RS-485 bus beyond the standard 32-unit load specification?
The SP3078ECN is rated for one unit load, supporting up to 256 nodes on a single bus per TIA/EIA-485-A. However, practical limits arise from capacitance accumulation, skew, and signal degradation over distance. Beyond 16–20 nodes, additional buffering or repeaters like the SP3485 may be necessary. Termination strategy becomes critical: always terminate at both ends for buses longer than 1 meter to prevent reflections.
How should the SP3078ECN be protected against electrostatic discharge (ESD) during board assembly and field servicing?
Although the SP3078ECN provides ±15kV HBM ESD protection per JEDEC standards, robust handling practices are still recommended. Use grounded wrist straps, ESD-safe workstations, and conformal coating after assembly to shield exposed traces. In field-replaceable modules, add TVS diodes (e.g., SMBJ6.5CA) close to connector interfaces to shunt fast transients not captured by IC-level protection.

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