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Home > Products > Integrated Circuits (ICs) > Specialized ICs > EZFC902C947N
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EZFC902C947N

Manufacturer Part Number:
EZFC902C947N
Manufacturer / Brand
N
Part of Description:
N/A SMD
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5872 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number EZFC902C947N
Manufacturer / Brand N
Stock Quantity 5872 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description N/A SMD
Lead Free Status / RoHS Status: RoHS Compliant
RFQ EZFC902C947N Datasheets EZFC902C947N Details PDF
EZFC902C947N Details PDF for FR.pdf
EZFC902C947N Details PDF for KR.pdf
EZFC902C947N Details PDF for DE.pdf
EZFC902C947N Details PDF for IT.pdf
EZFC902C947N Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key power supply design considerations when integrating the EZFC902C947N into a mixed-voltage system where I/O pins operate at 3.3V while the core logic requires 1.8V?
The EZFC902C947N supports dual-supply operation, but careful decoupling and voltage sequencing are required to avoid latch-up when interfacing between 3.3V I/O domains and the 1.8V core. Ensure that both VDD and VDDIO rails are independently regulated, use adequate bypass capacitors near each power pin, and follow recommended start-up sequences in the application note to prevent transient current surges that could compromise stability.
Can the EZFC902C947N be used as a direct replacement for the EZFC901C947M in existing PCB layouts without modifying clock routing or termination networks?
While pin compatibility is maintained, differences in internal oscillator tolerance and output drive strength between the EZFC902C947N and EZFC901C947M may affect signal integrity on high-speed traces. Verify that the load capacitance and trace impedance match the original design assumptions; otherwise, marginal timing margins or overshoot issues could arise in sensitive applications such as LVDS links or DDR interfaces.
How does temperature derating affect the maximum operating frequency of the EZFC902C947N in extended industrial environments above 85°C?
The EZFC902C947N’s internal phase-locked loop (PLL) exhibits reduced lock time and increased jitter at elevated temperatures due to slower transistor response in the feedback divider chain. In systems requiring sustained operation above 85°C, it is advisable to reduce the target output frequency by up to 10% and implement active thermal management to maintain timing accuracy within ±50 ppm over the full industrial temperature range.
Is it safe to cascade multiple EZFC902C947N devices for frequency multiplication in a multi-clock domain system, and what synchronization mechanisms must be applied?
Cascading the EZFC902C947N for integer or fractional-N synthesis is possible only if the reference input is derived from a common, low-jitter source. Without careful phase alignment, accumulated jitter and potential phase discontinuities can corrupt synchronous data transfers between clock domains. Use a shared reference oscillator and enable the device’s internal spread spectrum control sparingly, as aggressive modulation may degrade timing margins in downstream logic.
What configuration method should be used to set the output frequency of the EZFC902C947N when space-constrained firmware prevents storing multiple trim values in flash memory?
The EZFC902C947N supports one-time programmable (OTP) registers via its internal configuration interface, allowing permanent frequency selection during manufacturing or first boot. For field-programmable applications, use the serial programming interface with volatile memory retention; however, ensure backup power or capacitor hold-up circuits exist to prevent reconfiguration loss during brown-out events.
Are there known reliability concerns with the SMD packaging of the EZFC902C947N under repeated thermal cycling typical in automotive-grade assemblies?
The standard SMD package of the EZFC902C947N uses lead-free solder joints that meet RoHS compliance but exhibit higher coefficient of thermal expansion mismatch compared to through-hole alternatives. Under extreme thermal cycling (-40°C to +125°C), solder fatigue cracking may develop after >1,000 cycles. Implementing conformal coating and avoiding mechanical stress concentrations near bond pads can mitigate this risk in harsh environments.
Can the EZFC902C947N drive legacy TTL loads directly, or do I need level-shifting circuitry for 5V-tolerant inputs?
The EZFC902C947N features 3.3V CMOS-compatible outputs that are not 5V-tolerant. Direct connection to 5V TTL inputs risks damaging the device due to overvoltage on input pins. Use open-drain buffers with external pull-ups to 5V or employ dedicated level translators such as SN74AVC4T245 to safely interface with mixed-voltage systems without compromising signal integrity.
What trade-offs exist between using the EZFC902C947N versus discrete crystal oscillators in terms of board area, power consumption, and long-term stability for battery-powered IoT nodes?
The EZFC902C947N consumes approximately 1.2 mA at 16 MHz with all PLL stages active, whereas discrete solutions typically draw less than 0.5 mA but require additional filtering and layout space for crystals. However, the integrated solution offers superior phase noise performance and eliminates external component drift, making it preferable when precise timing is critical despite slightly higher quiescent current. Evaluate total system power budget before finalizing the choice.
How should I handle clock output termination when driving long PCB traces (>15 cm) with the EZFC902C947N to minimize reflections and EMI emissions?
For traces exceeding 15 cm, series termination resistors (typically 22–33 Ω) should be placed close to the EZFC902C947N output to dampen reflections caused by impedance mismatches. Additionally, route differential pairs with controlled impedance (e.g., 100 Ω for LVDS) and avoid vias near clock lines to preserve signal fidelity. Ferrite beads on the clock path can further suppress radiated emissions in EMC-sensitive designs.
What precautions are necessary when migrating from an analog crystal-based reference clock to the digitally synthesized output of the EZFC902C947N in a legacy medical device platform?
Digital clocks like the EZFC902C947N introduce quantization noise and spurious tones that may alias into critical signal bands in analog front-ends. Perform spectral analysis using FFT to identify sideband energy below -60 dBc, especially around harmonics of the output frequency. If aliasing is detected, consider adding a low-pass anti-imaging filter at the receiver input or switching to a lower synthesis ratio to push spurs out of band.

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EZFC902C947N

N

N/A SMD

In Stock: 5872

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