Choose your country or region.

Image may be representation.
See specs for product details.

SOMC1603330G

Manufacturer Part Number:
SOMC1603330G
Manufacturer / Brand
VISHAY
Part of Description:
697
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 64070 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number SOMC1603330G
Manufacturer / Brand VISHAY
Stock Quantity 64070 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 697
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the VISHAY SOMC1603330G resistor network into a high-density PCB layout originally designed for SOT23-6 components?
The SOMC1603330G is packaged in a SOP16 case, which differs significantly in footprint and pinout from the SOT23-6 form factor. Engineers must re-evaluate trace routing, thermal relief, and spacing to adjacent components due to the larger body size and increased pin count. Additionally, the SOP16 package may require adjustments in solder paste stencil design and reflow profile to prevent tombstoning or bridging, especially when migrating from smaller packages like SOT23-6.
Can the SOMC1603330G be used as a drop-in replacement for a 16-pin resistor network from another manufacturer with identical resistance values but different tolerance specifications?
While the pin count and resistance values may match, direct substitution depends on matching critical parameters such as temperature coefficient, power rating per element, and package thermal characteristics. The SOMC1603330G’s performance under thermal cycling or high ambient temperatures may differ from alternatives, potentially affecting long-term stability in precision applications. Always verify derating curves and TCR matching across the full operating range before substitution.
How does the SOP16 package of the SOMC1603330G impact thermal management in confined industrial control modules with limited airflow?
The SOP16 package offers improved thermal dissipation compared to smaller surface-mount packages due to its larger copper pad contact area and body mass. However, in tightly packed enclosures, heat accumulation from adjacent components can reduce effective power handling. Designers should conduct thermal modeling or empirical testing to ensure the SOMC1603330G operates within safe junction temperatures, particularly when mounted on thin PCBs with minimal thermal vias.
What are the risks of using the SOMC1603330G in a 5V digital I/O pull-up configuration where signal rise time is critical?
The parasitic capacitance inherent in resistor network arrays like the SOMC1603330G can slow signal edges when used in high-speed pull-up applications. Although the individual resistor elements are not specified with capacitance values, the close proximity of conductive paths in the network introduces inter-element capacitance that may affect rise times on fast digital lines. For signals exceeding 10 MHz, consider discrete resistors or networks with explicitly low-capacitance designs.
Is the SOMC1603330G suitable for automotive under-hood applications requiring AEC-Q200 compliance?
The SOMC1603330G is not specified as AEC-Q200 qualified, which limits its use in automotive environments subject to high vibration, temperature extremes, or long-term reliability requirements. For under-hood applications, engineers should select resistor networks with documented automotive-grade qualification, as the SOMC1603330G may lack the necessary screening, materials validation, and long-term drift performance required for such conditions.
How should the SOMC1603330G be configured when replacing a failed dual-inline package (DIP) resistor array in an existing through-hole design?
Migrating from a through-hole DIP to the surface-mount SOMC1603330G requires a redesign of the PCB footprint and potential adjustment of ground/power plane clearances. The SOP16 package has a lower profile, which may affect mechanical stability in high-vibration environments. Additionally, ensure the new layout maintains equivalent current paths and avoids introducing parasitic inductance that could affect signal integrity in analog or mixed-signal circuits.
What are the long-term reliability implications of operating the SOMC1603330G at 80% of its maximum rated power in a 70°C ambient environment?
Operating the SOMC1603330G near its power rating accelerates resistance drift due to thermal stress on the thin-film elements. While Vishay’s thin-film technology offers good stability, sustained high-temperature operation can lead to gradual resistance shifts over time, particularly in humidity-prone environments. For mission-critical systems, derating to 50% of maximum power and incorporating periodic calibration is recommended to maintain accuracy over the product lifecycle.
Can the SOMC1603330G be used in a precision voltage divider for a 24-bit ADC front end, and what layout practices are essential?
The SOMC1603330G can be used in precision dividers if its tolerance, TCR, and long-term stability meet the ADC’s reference requirements. However, layout symmetry, thermal uniformity, and guarding techniques are critical to minimize thermoelectric offsets and leakage currents. Place the network away from heat sources and ensure matched trace lengths to maintain ratio accuracy. Verify that the network’s TCR tracking between elements is sufficient for the required system-level precision.
What alternatives exist if the SOMC1603330G is discontinued, and how do they compare in terms of performance and footprint?
Potential replacements include the Bourns 4310M series or TE Connectivity’s CPF series, both available in SOP16-like footprints. However, differences in resistance range, power rating, and TCR may require circuit recalibration. The 4310M offers tighter tolerance options but lower power per element, while the CPF series provides better high-temperature performance. Always compare full datasheet parameters and conduct prototype validation before finalizing a migration path.
How does the input-to-output isolation of the SOMC1603330G compare to isolated resistor networks when used in medical equipment with patient-connected circuits?
The SOMC1603330G provides no galvanic isolation between elements and is not rated for medical isolation requirements such as IEC 60601-1. In patient-connected applications, even small leakage currents across resistor elements can pose safety risks. For such use cases, opt for medically certified isolated components or implement additional isolation barriers upstream, as the SOMC1603330G alone does not meet the necessary creepage, clearance, or insulation standards.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


SOMC1603330G

VISHAY

697

In Stock: 64070

SUBMIT RFQ