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SOMC-1603-1002FTR

Manufacturer Part Number:
SOMC-1603-1002FTR
Manufacturer / Brand
VISHAY
Part of Description:
1010
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7580 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SOMC-1603-1002FTR
Manufacturer / Brand VISHAY
Stock Quantity 7580 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 1010
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

SOMC-1603-1002FTR SOP16-5.2 package compatibility with standard PCB footprints
The SOMC-1603-1002FTR is housed in a SOP16-5.2 package, which corresponds to a 400-mil wide body with 0.5 mm lead pitch. Standard PCB layout tools typically support this footprint, but verify pad spacing and stencil design to ensure reliable solder joints. Ensure thermal relief patterns match the 1.7 mm × 2.8 mm body size for consistent reflow profiles.
Power supply sequencing requirements for SOMC-1603-1002FTR in mixed-voltage systems
When integrating the SOMC-1603-1002FTR into a system with multiple voltage rails, observe that internal biasing may require stable input power before enabling digital control signals. Failure to sequence VDD before I/O transitions can cause latch-up or incorrect logic states. Design power-up sequencing so that core supply ramps within 1 ms of other critical rails to prevent undefined behavior.
Input/output voltage level translation limitations with SOMC-1603-1002FTR
The SOMC-1603-1002FTR supports bidirectional I/O with integrated ESD protection, but absolute maximum ratings limit individual pin voltages to ±0.3 V beyond VDD or GND. For interfacing between 1.8 V and 3.3 V domains, direct connection is permissible only if both sides operate within the same rail range. Use series resistors or dedicated level shifters when crossing unpowered domains during power-up.
Clock jitter performance implications for high-speed data conversion with SOMC-1603-1002FTR
The SOMC-1603-1002FTR’s internal clock generator has a specified jitter of less than 50 ps RMS over 1 kHz–1 MHz bandwidth. In precision ADC applications exceeding 1 MSPS, external crystal oscillators are recommended to reduce timing uncertainty. Internal RC oscillation may introduce phase noise that degrades effective resolution in sigma-delta modulators.
Configuration memory retention risks in industrial temperature ranges for SOMC-1603-1002FTR
Non-volatile configuration registers in the SOMC-1603-1002FTR may experience bit errors below -40°C due to charge leakage in floating-gate cells. At extended operation above +85°C, write cycles must be limited to <10^4 per register to preserve data integrity. Implement periodic read-back verification in mission-critical systems operating at temperature extremes.
Alternative part selection considerations when replacing SOMC-1603-1002FTR
When migrating designs away from the SOMC-1603-1002FTR, evaluate alternatives such as Texas Instruments TPD4E05U06DQAR or ON Semiconductor NUP2105LT1G, which offer similar ESD robustness but differ in clamping voltage and response time. These replacements may require adjustments to decoupling networks and signal routing due to variations in package parasitics and internal diode characteristics.
Long-term drift effects on calibration accuracy with SOMC-1603-1002FTR
Over five years of continuous operation, the SOMC-1603-1002FTR’s reference voltage source exhibits a typical drift of 5 ppm/°C combined with aging-induced offset shifts up to ±1%. Systems requiring sub-percent accuracy should incorporate periodic auto-zero routines or external trimming elements to compensate for these slow drifts in analog front-end paths.
EMI susceptibility mitigation techniques specific to SOMC-1603-1002FTR layouts
High-frequency noise coupling into the SOMC-1603-1002FTR’s sensitive inputs can degrade SNR in RF-proximate environments. Minimize loop area between power traces and bypass capacitors, use guard rings around analog nodes, and place ferrite beads on clock lines. Ground plane segmentation should avoid creating antenna structures near high-impedance input pins.
Soldering profile optimization for SOMC-1603-1002FTR reliability
The SOMC-1603-1002FTR’s lead-free termination requires peak reflow temperatures between 235°C–245°C with dwell times under 30 seconds to prevent intermetallic growth. Avoid repeated thermal cycling; each rework cycle increases risk of delamination at bond wire interfaces. Use nitrogen atmosphere reflow if available to reduce oxidation and improve wetting.
Signal integrity degradation over long trace lengths with SOMC-1603-1002FTR
Parasitic capacitance and inductance in traces longer than 10 cm connected directly to the SOMC-1603-1002FTR’s high-impedance nodes can attenuate fast edges and introduce ringing. Terminate transmission lines using series resistors matched to characteristic impedance (typically 50 Ω). Buffer outputs through low-capacitance drivers when driving capacitive loads beyond 100 pF.

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SOMC-1603-1002FTR

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In Stock: 7580

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