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Home > Products > Integrated Circuits (ICs) > Specialized ICs > MM5625BN
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MM5625BN

Manufacturer Part Number:
MM5625BN
Manufacturer / Brand
NS
Part of Description:
NS DIP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 15255 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number MM5625BN
Manufacturer / Brand NS
Stock Quantity 15255 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description NS DIP
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the MM5625BN handle power sequencing when used in a mixed-voltage industrial control system with both 3.3V and 5V I/O domains?
The MM5625BN supports standard TTL logic levels and is designed to operate from a 5V supply, making it compatible with legacy 5V systems but requiring level-shifting or voltage translation when interfacing directly with 3.3V I/O without additional circuitry due to its input high threshold exceeding typical 3.3V logic high minimums.
Can the MM5625BN be safely used as a clock buffer in a high-reliability temperature cycling environment ranging from -40°C to +85°C?
While the MM5625BN is specified for commercial temperature operation, its long-term reliability in extreme thermal cycling may be limited by the aging characteristics of its internal pass transistors and bond wires; industrial-grade alternatives should be considered for mission-critical applications involving frequent thermal stress.
What are the implications of using the MM5625BN in place of a modern CMOS buffer like the SN74LVC1G125 for low-power battery-operated devices?
Replacing the MM5625BN with a CMOS variant reduces static power consumption significantly—CMOS buffers consume microamps versus milliamps in active mode—but introduces higher propagation delay skew under light loads and requires attention to output enable sequencing, which may affect timing budgets in precision analog-digital coexistence designs.
When integrating the MM5625BN into a legacy PCB layout originally designed for a similar DIP buffer, what decoupling capacitor configuration ensures stable operation at 10 MHz switching frequencies?
A 0.1 µF ceramic capacitor placed within 5 mm of the VCC pin and a 10 µF tantalum bulk capacitor near the power entry point are recommended to suppress transient current demands during fast edge transitions, preventing voltage droop that could cause oscillation or false triggering in downstream logic.
Is the MM5625BN suitable for driving capacitive loads such as unterminated transmission lines or long ribbon cables exceeding 20 cm in length?
The MM5625BN lacks controlled slew rate limiting and has relatively high output impedance compared to dedicated line drivers; driving capacitive loads beyond 50 pF may result in ringing, overshoot, or excessive power dissipation, necessitating series termination resistors or use of a buffer with current gain.
How should the MM5625BN be configured if used as an address latch in a microcontroller memory expansion system where multiple devices share the same data bus?
Connect the enable (OE) pin to a GPIO-controlled strobe signal derived from the chip select logic, ensuring OE remains asserted only during valid address windows to prevent contention; floating OE pins risk undefined output states, which can lead to bus conflicts in multi-drop configurations.
What precautions must be taken when substituting the MM5625BN in a design previously using a Texas Instruments SN74LS244N due to footprint constraints?
Although both are DIP-16 packages, the LS244N operates from a lower supply voltage (max 5.25V vs. 5.5V absolute max) and has different input thresholds; verify that 3.3V TTL-compatible inputs do not violate the MM5625BN’s VIH(min) of 2.0V when powered from 4.5V, and ensure output fan-out meets current requirements per datasheet.
Does the MM5625BN exhibit any known susceptibility to latch-up when exposed to transient overvoltage events on its I/O pins during hot-plug operations?
The MM5625BN is not specifically rated for hot-swappable interfaces and lacks ESD protection diodes on individual outputs; applying voltages above VCC + 0.5V or below GND - 0.3V may trigger parasitic thyristor structures, leading to destructive latch-up unless external clamping circuits such as TVS diodes are implemented.
In what scenarios would the MM5625BN be preferable over a tri-state buffer with integrated pull-down resistors for bidirectional bus management?
The MM5625BN provides no internal pull-downs, making it unsuitable for open-collector or weakly driven lines requiring defined DC levels when disabled; however, it offers higher drive strength than many integrated pull-down variants, making it ideal for point-to-point signaling where output slew and load handling are critical.
What derating considerations apply to the output current capability of the MM5625BN when operated continuously at elevated ambient temperatures above 60°C?
Per NEC Class II guidelines, continuous output current should be derated by approximately 0.5% per °C above 25°C; thus, at 85°C ambient, maximum sink/source current drops from 24 mA to about 18 mA to avoid junction temperature exceeding 150°C under worst-case conduction duty.

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