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MM54C175J/883B

In Stock 9001 pcs Reference Price(In US Dollars)
1+
$3.768
Manufacturer Part Number:
MM54C175J/883B
Manufacturer / Brand
NS
Part of Description:
MM54C175J/883B NS DIP16L
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 9001 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
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DHL/Fedex/TNT/UPS

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Part Number MM54C175J/883B
Manufacturer / Brand NS
Stock Quantity 9001 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MM54C175J/883B NS DIP16L
Lead Free Status / RoHS Status: RoHS Compliant
RFQ MM54C175J/883B Datasheets MM54C175J/883B Details PDF
MM54C175J/883B Details PDF for FR.pdf
MM54C175J/883B Details PDF for KR.pdf
MM54C175J/883B Details PDF for IT.pdf
MM54C175J/883B Details PDF for ES.pdf
MM54C175J/883B Details PDF for DE.pdf
Package DIP16L
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
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Shipping by DHL / Fedex / UPS / TNT
Port HongKong
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Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

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Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
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MM54C175J/883B Product Details:

The MM54C175J/883B is a specialized integrated circuit (IC) manufactured by Luminary Micro/Texas Instruments, designed for advanced electronic applications requiring precise signal processing and reliability. This device belongs to the specialized ICs category, featuring a dual in-line package (DIP16L) that enables compact and efficient integration into various electronic systems.

The IC is engineered to meet stringent military and aerospace grade specifications, as indicated by the "/883B" suffix, which suggests enhanced durability and performance under extreme environmental conditions. Its robust construction makes it suitable for critical applications where reliability and precision are paramount, such as aerospace, military communications, industrial control systems, and high-performance electronic equipment.

The DIP16L package configuration provides versatile mounting options, allowing for straightforward PCB integration and compatibility with standard IC sockets. This design approach facilitates easier circuit board assembly and potential component replacement, which is crucial in complex electronic systems.

While specific detailed electrical characteristics are not fully disclosed in the provided specifications, the part's classification and manufacturer suggest it is likely a specialized logic or interface component designed for complex signal management, potentially involving functions like data conversion, signal conditioning, or logic state management.

Key advantages of this IC include its military-grade reliability, compact packaging, and specialized design that meets demanding technical requirements. The component's availability in a quantity of 1338 units indicates it is currently in production and readily accessible for engineering and manufacturing purposes.

Equivalent or alternative models might include similar military-grade ICs from manufacturers like Texas Instruments, Analog Devices, or Intersil, though precise direct replacements would require detailed technical comparison of electrical and mechanical specifications.

Professional engineers and system designers in fields requiring high-reliability electronic components would find this IC particularly valuable for applications demanding precise, robust signal processing capabilities.

MM54C175J/883B Key Technical Attributes

- Manufacturer Part Number MM54C175J/883B

- Manufacturer Luminary Micro/Texas Instruments (legacy National Semiconductor line)

- Main Category Integrated Circuits (ICs); Small Classification Specialized ICs

- Logic Function Quad D-type edge-triggered flip-flops with asynchronous active-low clear and complementary outputs

- Logic Family 54C CMOS; screened to MIL-STD-883B test methods

- Package DIP16L; Package/Case code 607; through-hole ceramic J-form

- Temperature Grade Military wide-temperature performance

- Stock Quantity 1338 units available

MM54C175J/883B Packing Size

- Type 16-lead Dual In-Line Package (through-hole)

- Material Hermetic ceramic J-package for high-reliability use

- Size Standard DIP-16 footprint with 2.54 mm lead pitch and typical 0.3-inch body width

- Pin configuration Standard 74175-style assignment: CLK, CLR, D0–D3, Q0–Q3, /Q0–/Q3, VCC, GND

- Thermal characteristics Ceramic body provides stable operation across extreme temperatures; design with adequate airflow and derating in high-ambient environments

- Electrical properties CMOS low-power operation with high noise immunity and complementary outputs; wide supply-voltage capability typical of 54C CMOS

MM54C175J/883B Application

- Military and aerospace-grade logic storage elements

- Synchronous registers, data latches, pipeline stages, and state memory

- Control and timing subsystems requiring global asynchronous reset

- Buffered data storage with complementary outputs for counter and sequence logic

- Mixed-signal and digital systems needing robust, low-power CMOS flip-flops in harsh environments

- Socketed serviceable designs where through-hole ceramic DIP is preferred for maintenance and reliability

MM54C175J/883B Features

This device implements four edge-triggered D-type flip-flops that share a common clock and an asynchronous active-low clear, making it ideal for global reset schemes and synchronized data capture. Each bit provides both Q and inverted /Q outputs, which reduces external logic and enables straightforward construction of counters, shift registers, and complementary drive paths. As a 54C-series CMOS part, it offers low static power consumption and high noise margins, supporting reliable operation across a wide supply-voltage range characteristic of the 54C family. The hermetic ceramic DIP16L J-package is mechanically robust, moisture-resistant, and suited to high-temperature, high-vibration environments typical of mil/aero applications. The through-hole format simplifies socketing and field replacement, ensuring serviceability in long-life systems. The design’s asynchronous clear allows immediate fail-safe reset independent of the clock, and the common clock provides deterministic edge-triggered sampling for synchronous digital designs. The part traces back to National Semiconductor (NS) and is supported under Texas Instruments stewardship, providing continuity of documentation and high-reliability screening.

MM54C175J/883B Quality and Safety Features

MIL-STD-883B screening provides enhanced reliability through standardized environmental and electrical test methods appropriate for mission-critical use. The hermetic ceramic J-package mitigates moisture ingress and improves thermal stability under temperature extremes. CMOS construction yields inherently low self-heating and strong noise immunity, contributing to dependable operation in electrically noisy environments. Asynchronous clear facilitates immediate system-safe reset behavior. Through-hole leads support secure mechanical retention and high-temperature soldering processes used in defense and aerospace manufacturing. ESD-sensitive device handling is required; shipment and storage are controlled to maintain device integrity and traceability.

MM54C175J/883B Compatibility

Pin-compatible with the classic 74175/74C175 logic family across multiple manufacturers, including legacy National Semiconductor and Texas Instruments equivalents. Also pin-compatible with CD54HC175 and other HC/HCT variants in terms of physical pinout; note that electrical thresholds differ among CMOS, HC, and HCT families, so ensure supply voltage and input-level compatibility when mixing families. Suitable as a drop-in for designs calling for MM54C175J-class parts in ceramic DIP-16 with MIL-STD-883 screening. Always verify the exact pin assignment and supply-voltage requirements against the datasheet before substitution.

MM54C175J/883B Datasheet PDF

Our website hosts the most authoritative, up-to-date datasheet for MM54C175J/883B, including legacy NS documentation and TI stewardship notes. For complete electrical characteristics, timing diagrams, pin assignments, test conditions, and MIL-STD-883 screening details, download the PDF from this current product page. Referencing the official datasheet ensures correct design-in and qualification.

Quality Distributor

IC-Components is a premium, trusted distributor for Texas Instruments and its legacy product lines. We offer genuine, traceable inventory, competitive pricing, and responsive global fulfillment for MM54C175J/883B. Take advantage of our professional sourcing support—request a quote directly on our website today and secure the parts you need with confidence.

Frequently Asked Questions

How can I ensure proper power supply design when integrating the Luminary Micro/Texas Instruments MM54C175J/883B into my digital system?
The MM54C175J/883B operates with standard logic supply voltages typical for DIP16L packages. Ensure your power supply provides a stable VCC within the recommended range (usually 5V for such devices) with proper decoupling and filtering. Verify that the supply current specifications are met under maximum load conditions to prevent voltage dips that could lead to malfunction or data corruption.
Is the MM54C175J/883B suitable for high-speed applications, and what considerations should I keep in mind regarding its timing parameters?
The MM54C175J/883B is designed for moderate-speed applications with standard propagation delays. For high-speed digital designs, ensure your clock or data transition rates are within the device’s recommended maximums. Pay attention to setup and hold times, and incorporate proper PCB layout techniques to minimize parasitic inductance and capacitance that could affect signal integrity.
Can I replace the MM54C175J/883B with a similar IC from another manufacturer, and what are the critical factors to consider?
Replacing the MM54C175J/883B with an alternative requires matching key parameters such as logic function, package type (DIP16L), supply voltage, and timing specifications. Consider differences in drive strength, voltage thresholds, and temperature range, as these can impact circuit stability. Check datasheets thoroughly to ensure compatibility and avoid unintended performance issues.
What are the main design challenges when integrating the MM54C175J/883B into a legacy system requiring electrical compatibility with older logic families?
When integrating the MM54C175J/883B into a legacy system, verify that its input and output voltage levels are compatible with existing logic levels. The device generally operates at 5V logic, so if your system uses TTL or CMOS compatible voltages, ensure voltage translation or level-shifting is implemented if necessary. Also, review compatibility with existing timing and signal propagation constraints.
How does the package type (DIP16L, 607 case) influence the reliability and long-term operation of the MM54C175J/883B in industrial applications?
The DIP16L package offers ease of manual prototyping and robust mechanical stability suitable for industrial environments. Ensure proper handling, adequate heat dissipation, and secure mounting to prevent mechanical stress. For long-term reliability, maintain a controlled operating temperature and avoid exposure to excessive vibration or humidity, which could impact contact integrity and device lifespan.
Are there any specific application environments or conditions under which the MM54C175J/883B should not be used?
The MM54C175J/883B is best suited for standard commercial applications. It may not be suitable for extended operation in extreme temperature environments, high-radiation settings, or where significant exposure to moisture or corrosive substances occurs without proper protective measures. Always verify that the operating temperature and environmental conditions align with the device’s specifications.
What are the key considerations for clocking and data setup/hold times when deploying the MM54C175J/883B in synchronous circuit designs?
To ensure reliable operation, match your clock and data signals within the rising edge and setup/hold time limits specified by the datasheet for the MM54C175J/883B. Use proper PCB layout practices, such as minimizing trace lengths and avoiding noise coupling, to maintain signal integrity. Incorporate sufficient margin for timing variations under different operating conditions.
How can I verify that the MM54C175J/883B will operate reliably over its expected lifespan in an industrial deployment?
Conduct thorough testing under your specific operating conditions, including temperature cycling, voltage variation, and vibration simulations. Implement supply decoupling, proper grounding, and environmental controls. Additionally, incorporate periodic maintenance and health monitoring to detect early signs of device degradation before failure.
What are the main differences between the MM54C175J/883B and newer logic ICs, and should I consider migrating to a more modern component?
The MM54C175J/883B is an older, proven design, typically offering lower cost and easier handling but potentially lacking features like low power consumption or high-speed performance found in newer logic families. Consider migration if your application demands faster speeds, lower power, or improved reliability. Evaluate trade-offs including compatibility, cost, and replacement complexity.
In designing a PCB for the MM54C175J/883B, what layout best practices should I follow to optimize performance and prevent signal integrity issues?
Use short, direct signal traces, keep input/output lines away from high-frequency or noisy elements, and implement proper decoupling capacitors close to power pins. Maintain consistent ground planes and avoid crossing sensitive signal lines with noisy ones. Proper layout reduces reflections, crosstalk, and ensures stable operation throughout the device’s lifespan.

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