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MM54C151J/883

Manufacturer Part Number:
MM54C151J/883
Manufacturer / Brand
NS
Part of Description:
MM54C151J/883 NS DIP-16P
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 12737 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number MM54C151J/883
Manufacturer / Brand NS
Stock Quantity 12737 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MM54C151J/883 NS DIP-16P
Lead Free Status / RoHS Status: RoHS Compliant
RFQ MM54C151J/883 Datasheets MM54C151J/883 Details PDF
MM54C151J/883 Details PDF for IT.pdf
MM54C151J/883 Details PDF for ES.pdf
MM54C151J/883 Details PDF for DE.pdf
MM54C151J/883 Details PDF for KR.pdf
MM54C151J/883 Details PDF for FR.pdf
Package DIP-16P
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the MM54C151J/883 be used as a direct replacement for legacy TTL-compatible shift registers in industrial control systems without modifying existing PCB layouts or signal conditioning circuits?
The MM54C151J/883 is a CMOS-based 4-bit parallel-in/serial-out shift register and can be directly substituted into DIP-16P sockets designed for TTL logic, provided that the host system operates at compatible voltage levels and the fan-out requirements are within CMOS drive capabilities. However, differences in input threshold voltages and output swing compared to traditional TTL may necessitate level-shifting circuitry if interfacing with older TTL devices. Engineers should verify noise margins and propagation delays under worst-case operating conditions before committing to a design.
What are the critical timing constraints when cascading multiple MM54C151J/883 units for extended serial data paths in high-reliability embedded applications?
When cascading multiple MM54C151J/883 chips, the total propagation delay accumulates through each stage, potentially limiting maximum clock frequency. Each chip contributes approximately 30 ns of typical propagation delay at 5 V operation, so for N stages, the cumulative delay must be factored into system timing budgets. Additionally, setup and hold times relative to the clock edge must be respected across all stages, especially under temperature extremes or supply voltage variations. Designers should simulate or prototype long chains to validate data integrity under real-world noise and skew conditions.
Is it safe to operate the MM54C151J/883 near its absolute maximum ratings in harsh industrial environments without risking latch-up or functional failure?
Operating near absolute maximum ratings—such as VCC = 7 V or junction temperatures above 125°C—increases susceptibility to electrostatic discharge (ESD) damage and potential latch-up events in CMOS devices like the MM54C151J/883. While the device is designed with built-in protection diodes, sustained exposure to overvoltage or thermal stress beyond datasheet specifications compromises long-term reliability. For industrial deployments, it is advisable to derate supply voltage and implement proper PCB layout practices, including guard rings and decoupling, to maintain margin against transient conditions.
How does the power consumption of the MM54C151J/883 compare to modern low-power alternatives, and what impact does this have on battery-operated or thermally constrained designs?
The MM54C151J/883 consumes significantly more static power than contemporary CMOS shift registers due to its process technology; typical quiescent current can reach tens of microamps per MHz of switching activity at 5 V. In battery-powered systems or compact enclosures where heat dissipation is limited, this elevated power draw reduces operational lifetime and may require additional thermal management. Engineers considering migration should evaluate newer parts with sub-microamp standby currents and lower dynamic power profiles unless legacy compatibility mandates use of this specific model.
Are there known compatibility issues between the MM54C151J/883 and FPGA-based serial interface controllers when implementing bidirectional data flow or feedback loops?
Direct compatibility is generally acceptable since both sides operate at standard logic levels, but bidirectional communication requires open-drain outputs or tri-state buffers on the MM54C151J/883 side to prevent bus contention. Without such precautions, driving high impedances while another device asserts a strong logic level can cause undefined states or excessive current draw. Additionally, FPGA input thresholds may not fully align with the MM54C151J/883’s VIH/VIL specifications, especially at reduced supply voltages, necessitating pull-up resistors or level translation for robust interoperability.
What configuration considerations apply when using the MM54C151J/883 as part of a daisy-chained SPI-like protocol with automatic load strobe generation?
The MM54C151J/883 lacks an internal clock divider or automatic load function, so generating a synchronized strobe requires external logic to sample the Q4 output after sufficient settling time post-clock edge. Misalignment between shift completion and strobe assertion can corrupt latched data. Designers should ensure that the strobe pulse width meets minimum requirements (typically > 25 ns) and that inter-chip propagation delays are accounted for in timing diagrams. Using Schmitt-trigger inputs on clock lines helps mitigate noise-induced false triggering during critical transitions.
Can the MM54C151J/883 reliably support long-distance serial communication (> 1 meter) in noisy factory floor environments without additional signal conditioning?
Due to limited output drive strength and susceptibility to capacitive loading and electromagnetic interference, the MM54C151J/883 alone is not suitable for unshielded long-distance transmission. Signal degradation, ringing, and ground bounce become significant beyond short traces or small loads. Implementing line drivers such as RS-422 transceivers or optoisolators improves robustness, but increases board complexity and cost. For distances exceeding 30 cm in industrial settings, alternative architectures like differential signaling or fiber optics are preferred over direct CMOS-level extension.
What are the risks associated with hot-swapping the MM54C151J/883 into a powered circuit, and how should ESD mitigation be handled during field maintenance?
Hot-swapping the MM54C151J/883 without protective measures risks damaging input/output pins due to transient currents from parasitic capacitance discharge and potential reverse-bias breakdown of ESD diodes. Although equipped with basic clamping structures, repeated insertion under live power accelerates wear-out. To minimize risk, always disable VCC before component exchange, use grounded wrist straps, and consider adding series resistors (e.g., 100 Ω) on sensitive lines. Some engineers incorporate TVS diodes for added surge protection in mission-critical installations.
When migrating from the MM54C151J/883 to a modern equivalent, which parameters must be revalidated to ensure consistent performance across temperature, voltage, and process corners?
Key parameters requiring revalidation include propagation delay variation with temperature (±15% typical), input hysteresis behavior, output rise/fall times under capacitive loads, and noise immunity margins. Supply current scaling with voltage also changes between generations—older CMOS devices like the MM54C151J/883 exhibit higher leakage at elevated temperatures compared to advanced-node parts. Design verification should include corner-case simulations at min/max VCC and extreme ambient temperatures to confirm timing closure and functional stability post-migration.
Does the MM54C151J/883 support synchronous reset functionality, and if not, what workaround is recommended for initializing shift register contents during system boot-up?
The MM54C151J/883 does not feature a dedicated asynchronous clear input. Instead, initialization must rely on external circuitry—typically a microcontroller asserting a reset line connected to the SER input with appropriate clock pulses to flush out residual data. Alternatively, a manual toggle of the master clear pin (if present in variant models) followed by a clock cycle can force all flip-flops into a known state. Care must be taken to ensure complete clearing under worst-case initial conditions, including metastability during power-up sequences.

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