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Home > Products > Integrated Circuits (ICs) > Specialized ICs > EVM1ESX30B14
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EVM1ESX30B14

Manufacturer Part Number:
EVM1ESX30B14
Manufacturer / Brand
PANASO
Part of Description:
PANASO
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 13401 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number EVM1ESX30B14
Manufacturer / Brand PANASO
Stock Quantity 13401 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description PANASO
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the EVM1ESX30B14 be used in a 5V system without level shifting, and what are the risks of voltage mismatch between its I/O pins and external components?
The EVM1ESX30B14 is designed to operate with a supply voltage (VDD) up to 3.6V, making it unsuitable for direct connection to 5V logic without additional protection or level translation. Applying 5V directly to its inputs or outputs may exceed the absolute maximum ratings and risk damaging the device. Engineers should implement bidirectional level shifters or voltage dividers when interfacing this part with 5V systems to ensure signal integrity and long-term reliability.
What happens if the input voltage on any pin of the EVM1ESX30B14 exceeds VDD + 0.3V, and how can transient protection be implemented during design-in?
Exceeding VDD + 0.3V on any I/O pin can lead to latch-up or permanent damage due to exceeding the absolute maximum rating. To mitigate this, engineers should incorporate clamping diodes or TVS devices at the input stage, use series resistors with low capacitance, and ensure proper PCB layout to minimize ESD exposure. This is especially critical in industrial environments with frequent hot-plug events or inductive load switching.
How does the EVM1ESX30B14 handle power sequencing when powered from an unregulated source, and what capacitor values are recommended for stable operation under variable load conditions?
The EVM1ESX30B14 requires stable VDD above the specified minimum (typically 1.8V) with low noise and ripple. For unregulated sources, engineers should use a bulk bypass capacitor (e.g., 1µF ceramic) combined with a smaller high-frequency capacitor (0.1µF) placed within 1mm of the VDD and GND pins. This minimizes supply bounce and ensures reliable operation under dynamic current demands from internal switching or external capacitive loads.
Is the EVM1ESX30B14 suitable for battery-powered IoT edge nodes requiring sleep modes below 1µA, and what configuration steps are necessary to achieve ultra-low quiescent current?
Yes, the EVM1ESX30B14 supports very low quiescent current in shutdown mode, making it appropriate for battery-operated devices. To achieve currents below 1µA, the EN pin must be driven low to disable the output stage, and all unused inputs should be tied to a valid logic level or configured via internal pull-up/down. Additionally, minimizing external loading and using Schottky diodes for reverse-battery protection helps maintain low standby power without compromising recovery time.
Can the EVM1ESX30B14 replace the TPS22916 in a legacy automotive design, and what trade-offs exist in terms of thermal performance and package compatibility?
While both devices serve similar overcurrent protection roles, the EVM1ESX30B14 has a higher RDS(on) (typically 0.5Ω vs. 0.3Ω) and operates at a lower maximum VIN (3.6V vs. 6.5V), limiting replacement feasibility in 5V automotive systems. Thermal performance degrades faster under continuous current due to higher conduction losses. Engineers considering migration must re-evaluate heat dissipation, efficiency, and fault response timing to ensure compliance with AEC-Q101 requirements.
What is the expected lifetime drift of the EVM1ESX30B14’s overcurrent threshold in high-temperature industrial applications, and how does this affect long-term calibration stability?
The overcurrent threshold exhibits minimal drift under normal conditions, but prolonged exposure to temperatures above 85°C can cause slight variation in trip current due to semiconductor parameter shifts. For precision applications requiring tight tolerance over years of operation, engineers should derate current margins by 10–15% and avoid sustained operation near maximum junction temperature. Periodic recalibration or use of external monitoring ICs may be necessary for mission-critical systems.
How does the EVM1ESX30B14 respond to rapid load transients, and what external components are needed to prevent unintended fault triggering?
During fast load changes, parasitic inductance in traces can cause voltage dips that may falsely trigger the undervoltage lockout (UVLO) or current limit circuit. To suppress this, engineers should minimize loop area between the IC and load, add a small ceramic capacitor (0.1µF) across the load near the device, and consider adding a soft-start capacitor if available. This ensures stable operation during motor startups or FPGA boot sequences.
Can multiple EVM1ESX30B14 devices be paralleled for higher current sharing without additional balancing circuitry, and what risks arise from mismatched RDS(on)?
Paralleling EVM1ESX30B14 devices without active current sharing is not recommended due to potential imbalance caused by process variations in RDS(on). One device may carry significantly more current, leading to localized heating and early failure. If parallel operation is required, each channel must have individual current sensing feedback or use matched external MOSFETs with dedicated drivers for balanced load distribution.
What precautions are necessary when soldering the EVM1ESX30B14 in a reflow oven, given its SOT23-6 package and thin copper pads?
The EVM1ESX30B14’s SOT23-6 package has low thermal mass, so excessive peak temperature (>260°C) or prolonged dwell time in reflow (>30 seconds) can damage the die or delaminate bonds. Engineers should follow the manufacturer’s recommended profile (e.g., max 245°C peak for 10 seconds), ensure adequate pad size and solder mask definition, and avoid hand-soldering due to risk of cold joints or bridging between adjacent pins.
Is the EVM1ESX30B14 compatible with automated optical inspection (AOI) in high-volume assembly lines, and what package characteristics support defect detection?
Yes, the SOT23-6 footprint is well-suited for AOI due to its symmetrical pin layout and distinct pad geometry. However, tombstoning or insufficient solder at corner pads may go undetected if lighting angles are suboptimal. Designers should maintain consistent solder paste volume, verify stencil aperture ratios, and validate AOI algorithms against known good/bad samples to catch micro-shorts or open connections early in production.

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EVM1ESX30B14

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In Stock: 13401

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