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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ETS.7502B
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ETS.7502B

Manufacturer Part Number:
ETS.7502B
Manufacturer / Brand
EST
Part of Description:
EST DIP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 10405 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ETS.7502B
Manufacturer / Brand EST
Stock Quantity 10405 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description EST DIP
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ETS.7502B Datasheets ETS.7502B Details PDF
ETS.7502B Details PDF for FR.pdf
ETS.7502B Details PDF for KR.pdf
ETS.7502B Details PDF for DE.pdf
ETS.7502B Details PDF for IT.pdf
ETS.7502B Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the ETS.7502B be used in a 3.3V microcontroller-based system without voltage level translation?
The ETS.7502B is based on a DIP (Dual In-line Package) configuration and does not specify inherent voltage level compatibility with 3.3V logic in its documentation. Engineers integrating the ETS.7502B into 3.3V control systems should verify input voltage thresholds and consider potential signal integrity risks when interfacing with modern microcontrollers. A level-shifting buffer or translator may be necessary to ensure reliable operation and prevent marginal logic detection, especially if driving from 3.3V outputs to inputs on the ETS.7502B operating near 5V signaling thresholds.
What are the thermal dissipation limitations of the ETS.7502B in a sealed industrial enclosure?
The ETS.7502B utilizes a standard DIP package without an integrated heat spreader or thermal pad, limiting its ability to dissipate heat under continuous load in confined environments. In sealed industrial enclosures where ambient temperatures exceed 50°C, the absence of forced airflow or thermal vias in the PCB layout may lead to elevated junction temperatures. Designers should calculate worst-case power dissipation based on duty cycle and load conditions, and consider derating performance or adding local ventilation to maintain long-term reliability.
Is the ETS.7502B a direct replacement for Texas Instruments' ISO7502 in isolated digital applications?
While the ETS.7502B shares a similar naming convention and package outline with the ISO7502, there is no public data confirming functional or pin-to-pin equivalence. Substituting the ETS.7502B for the ISO7502 requires verification of key parameters such as propagation delay, channel isolation rating, common-mode transient immunity, and power supply requirements. Without confirmed isolation ratings or safety certifications (e.g., UL, VDE), the ETS.7502B may not meet the design-in criteria for high-voltage or safety-isolated systems where the ISO7502 is typically deployed.
How should unused input pins be handled on the ETS.7502B to avoid unpredictable behavior?
In designs where not all channels of the ETS.7502B are utilized, floating inputs can introduce noise susceptibility or unintended switching due to electromagnetic coupling. Each unused input should be terminated to a defined logic level—either ground or VCC—using a pull-down or pull-up resistor in the 10kΩ to 100kΩ range. The choice of termination should align with the expected default state required by the system logic. Leaving inputs unconnected may degrade signal integrity and increase static current consumption under certain conditions.
Can the ETS.7502B support bidirectional signal transmission in a multipoint communication bus?
The ETS.7502B does not specify bidirectional functionality in its description, and the DIP package typically implies a unidirectional or fixed-direction channel configuration. Attempting to use it in a bidirectional bus without external control logic may result in signal contention or latch-up. For applications requiring bidirectional isolation, a dedicated bidirectional isolator with controlled enable/disable timing or auto-direction sensing is recommended. Integration of the ETS.7502B in such systems would require additional multiplexing or direction control circuitry.
What PCB layout practices are critical when designing-in the ETS.7502B for noise-sensitive precision circuits?
When placing the ETS.7502B on a PCB for use in precision or mixed-signal applications, maintaining a clean ground plane and minimizing trace lengths for high-speed signals are essential. Due to the through-hole DIP package, parasitic inductance and capacitance may be higher compared to surface-mount isolators, increasing susceptibility to ground bounce and crosstalk. It is advisable to isolate analog and digital ground planes under the ETS.7502B and connect them at a single point, while also decoupling the supply pin with a 100nF ceramic capacitor placed as close as possible to the device.
What are the long-term availability and obsolescence risks when selecting the ETS.7502B for a new product design?
The ETS.7502B is listed without a defined series or detailed manufacturer support documentation, which introduces uncertainty regarding production lifespan and lifecycle management. Components in this category may lack formal obsolescence notices or second-source alternatives, increasing supply chain risk for products intended for manufacturing beyond 3–5 years. Engineers should evaluate whether the ETS.7502B is actively recommended for new designs by EST and request lifecycle data or authorized distributor inventory reports to assess procurement stability before full-scale integration.

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ETS.7502B

EST

EST DIP

In Stock: 10405

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