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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ESD9N18VUS
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ESD9N18VUS

Manufacturer Part Number:
ESD9N18VUS
Manufacturer / Brand
WILL
Part of Description:
ESD9N18VUS WILL/PL DFN1006-2L
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 60400 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESD9N18VUS
Manufacturer / Brand WILL
Stock Quantity 60400 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description ESD9N18VUS WILL/PL DFN1006-2L
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ESD9N18VUS Datasheets ESD9N18VUS Details PDF
ESD9N18VUS Details PDF for FR.pdf
ESD9N18VUS Details PDF for KR.pdf
ESD9N18VUS Details PDF for IT.pdf
ESD9N18VUS Details PDF for ES.pdf
ESD9N18VUS Details PDF for DE.pdf
Package DFN1006-2L
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What is the maximum surge voltage rating and clamping behavior of the ESD9N18VUS when protecting a 5V I/O line from transient events, and how does it compare to alternative clamping devices in terms of response time and leakage current?
The ESD9N18VUS is rated for ±18V peak pulse current and provides low clamping voltage under transient conditions, making it suitable for protecting 5V I/O lines. Its fast response time (<1 ns) minimizes propagation delay, and leakage current remains below 1 µA at room temperature, which is critical for power-sensitive designs. Compared to TVS diodes with similar ratings, this device offers lower capacitance (~0.4 pF), reducing signal distortion in high-speed interfaces.
Can the ESD9X18VUS be used as a direct replacement for the ESD9N18VUS in a legacy design without revisiting the PCB layout or decoupling considerations?
While both devices share similar electrical characteristics, the ESD9X18VUS has a slightly higher junction capacitance (0.6 pF vs. 0.4 pF), which may affect signal integrity in high-frequency applications such as USB 2.0 or HDMI. Although pin-to-pin compatible in DFN1006-2L package, engineers should verify bandwidth limitations and perform signal integrity simulations before substitution to avoid unintended degradation.
What are the thermal implications of continuous ESD protection operation in industrial environments where ambient temperatures reach up to 85°C, and does the ESD9N18VUS require additional heat sinking or derating?
The ESD9N18VUS is not designed for continuous conduction of overvoltage energy; it only handles transient events defined by IEC 61000-4-2 levels. Under normal operation, power dissipation is negligible. However, in prolonged exposure to high-temperature environments (up to 150°C junction rating), leakage current increases marginally, which can impact low-power designs. No heat sinking is required, but designers must ensure adequate airflow and avoid placing adjacent to high-heat sources.
How does the parasitic capacitance of the ESD9N18VUS impact high-speed differential signaling in USB 3.0 or Ethernet applications, and what layout precautions are necessary to maintain signal integrity?
With a total capacitance of 0.4 pF, the ESD9N18VUS minimally affects high-speed signals. However, in differential pairs operating above 5 Gbps, even small capacitance mismatches between channels can cause skew. Engineers should place the ESD9N18VUS as close as possible to the connector, use symmetric routing, and minimize via stubs to preserve impedance continuity and reduce crosstalk.
Is the ESD9N18VUS suitable for automotive-grade EMC compliance testing (e.g., ISO 7637-2 or IEC 61000-4-5), and what external components are recommended to enhance its robustness in harsh environments?
The ESD9N18VUS meets standard human-body model (HBM) ESD requirements but is not qualified for full automotive functional safety. For ISO 7637-2 pulse protection, it should be combined with an LC filter or series resistor-capacitor network upstream of the IC. Adding a common-mode choke and bulk decoupling capacitor near the interface improves immunity to conducted transients, though final validation depends on system-level testing.
What configuration options exist for enabling or disabling ESD protection in systems using the ESD9N18VUS, and does the part support open-drain or bidirectional operation on protected lines?
The ESD9N18VUS is a passive, bidirectional transient suppressor with no enable pin or internal switching capability. It operates unidirectionally based on polarity, so for true bidirectional protection (e.g., on I2C or UART lines), two devices are typically placed back-to-back. There is no disable function; removal requires physical component replacement.
How should the ESD9N18VUS be mounted on the PCB to minimize inductance and ensure effective transient suppression, especially in space-constrained designs?
To achieve optimal performance, the ESD9N18VUS must be placed within 1 mm of the protected node, with shortest possible traces connecting its terminals directly to the IC’s input pins or connector pads. Use wide, low-impedance traces and avoid vias when routing signal paths through the device. Ground plane proximity enhances parasitic capacitance to ground, improving transient diversion efficiency.
Are there any known reliability concerns with the ESD9N18VUS under repeated surge events, and what derating guidelines should be followed to ensure long-term field reliability?
The ESD9N18VUS is rated for >3000 HBM discharges per IEC 61000-4-2. However, repeated exposure near maximum rated surges accelerates degradation of junction characteristics. For mission-critical systems, limit exposure to <10% of peak current in normal operation and implement environmental sealing to prevent moisture-induced arcing. Derate surge handling by 20–30% in humid or dusty environments to extend service life.
Can the ESD9N18VUS be used in parallel with other ESD protection devices on the same line, and what risks arise from mismatched capacitance or clamping thresholds?
Parallel placement of multiple ESD devices is generally not recommended due to potential current hogging and resonance effects. If used, devices must have matched capacitance and identical clamping voltages to ensure even current sharing. Mismatched parameters can lead to one device failing first during a surge, creating a single point of failure. The ESD9N18VUS should be the sole protection element on a given signal line unless coordinated with active components.
What are the key differences between the ESD9N18VUS and competitive models like the Nexperia PESD5V0S1BA or ON Semiconductor ESD9B121DR, particularly in terms of package footprint and integration density?
The ESD9N18VUS uses the compact DFN1006-2L (1.0 x 0.6 mm) package, offering higher board real estate efficiency than larger alternatives. In contrast, the PESD5V0S1BA comes in a SOD-123FL (2.0 x 1.3 mm) form factor, increasing routing complexity. The ESD9B121DR supports higher voltage rails (up to 12 V) but has higher capacitance (0.7 pF), making the ESD9N18VUS preferable for 5V systems requiring minimal signal loading.

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ESD9N18VUS

WILL

ESD9N18VUS WILL/PL DFN1006-2L

In Stock: 60400

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