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833-054-542-201

In Stock 2757 pcs Reference Price(In US Dollars)
25+
$44.9529
Manufacturer Part Number:
833-054-542-201
Manufacturer / Brand
EDAC Inc.
Part of Description:
833 HIGH TEMP' SERIES (.156" (3.
Datasheets:
833-054-542-201(1).pdf833-054-542-201(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 2757 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 833-054-542-201
Manufacturer / Brand EDAC Inc.
Stock Quantity 2757 pcs Stock
Category Connectors, Interconnects > Card Edge Connectors - Edgeboard Connectors
Description 833 HIGH TEMP' SERIES (.156" (3.
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Rows 2
Termination Wire Wrap
Series 833
Read Out Dual
Pitch 0.156" (3.96mm)
Package Box
Operating Temperature -40°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 27
Number of Positions 54
Mounting Type Through Hole
Material - Insulation Diallyl Phthalate (DAP)
Gender Female
Flange Feature -
Features -
Contact Type Cantilever
Contact Material Copper Alloy
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Base Product Number 833-054

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the Mercury 833-054-542-201 connector operate reliably in industrial environments that frequently cycle between -40°C and 125°C?
Yes. The 833-054-542-201 is rated for continuous operation across -40°C to 125°C, making it suitable for industrial and aerospace applications where thermal cycling occurs. The Diallyl Phthalate (DAP) insulation material maintains electrical and mechanical properties across this range. However, rapid temperature transitions may induce mechanical stress at the wire-wrap termination interface; designers should validate solder joint reliability under your specific thermal profile, particularly if cycling occurs more than 500 times annually.
What card thickness range does the 833-054-542-201 accommodate, and how does this affect PCB layout decisions?
The Mercury 833-054-542-201 accepts card edges between 0.054" and 0.070" (1.37–1.78 mm) thick. This dual-edge configuration (two rows of 27 positions each) requires PCB layout that places signal traces and power planes symmetrically on both sides of the card edge to ensure uniform contact pressure and signal integrity. If your PCB thickness falls outside this range, contact insertion force will be excessive or contacts may not seat properly, leading to intermittent connections.
Is the 833-054-542-201 suitable as a direct replacement for legacy card-edge connectors with 0.156" pitch?
Partial compatibility exists. The 833-054-542-201 operates at 0.156" (3.96 mm) pitch with 54 total positions in a dual-edge configuration. If your legacy application used a different pitch (e.g., 0.100", 0.125"), the 833-054-542-201 will not fit. If pitches match but position count differs, the connector may physically mate but leave some positions unconnected. Verify the original connector's part number and row/position count before committing to the 833-054-542-201 as a replacement.
What signal integrity considerations apply to wire-wrap termination on the 833-054-542-201 in high-frequency applications?
Wire-wrap termination on the 833-054-542-201 introduces longer contact paths and higher inductance compared to solder or press-fit terminations. For signals above 10 MHz, the impedance discontinuity at the wire-wrap joint may cause reflections and crosstalk. If your application requires high-speed digital signals (e.g., parallel bus data or clock lines above 25 MHz), consider measuring or simulating the insertion loss and return loss of your wire-wrap routing. For audio, low-speed industrial control, or analog applications, wire-wrap performance is generally acceptable.
How does the gold contact finish thickness (10.0 µin) on the 833-054-542-201 affect long-term contact reliability and wear?
The 10.0 µin (0.25 µm) gold finish on the 833-054-542-201 is a thin plating over a copper alloy base. This thickness provides corrosion resistance and low contact resistance for initial mating cycles. However, in high-insertion-cycle environments (>100 mate/demate cycles per year), the thin gold may wear through to the copper beneath, increasing contact resistance and susceptibility to oxidation. If your application involves frequent connector insertion and removal, specify a thicker gold plating (≥50 µin) or plan periodic maintenance and contact cleaning.
What are the practical differences between the Mercury 833-054-542-201 and competitors' 54-position dual-edge connectors in the same pitch class?
The 833-054-542-201 uses cantilever contact springs and DAP insulation, which are cost-effective and widely used in industrial equipment. Competitors (e.g., AMP, Molex equivalents) may offer similar mechanical specifications but differ in contact force, gold thickness, and insulation material (some use polyimide or epoxy). Direct cross-reference by checking published compatibility matrices from distributors or requesting samples. The 833-054-542-201 is well-established in legacy military and industrial systems; if you are migrating from a competitor's part, verify that the contact arrangement and signal plane assignments match before prototype assembly.
Can the 833-054-542-201 be used in applications requiring environmental sealing or potting?
The 833-054-542-201 has an open design with no sealing provisions (no gaskets, IP rating, or conformal coating specified). If your application requires sealed connectors for salt-spray, humidity, or vibration resistance, the 833-054-542-201 alone is insufficient. You may apply conformal coating around the mated connector interface after assembly, but this adds assembly cost and may complicate future maintenance or rework. For sealed applications, evaluate mercury's sealed connector variants or source an equivalent sealed card-edge connector.
What termination method is used for the 833-054-542-201, and what are the assembly implications?
The 833-054-542-201 uses wire-wrap termination on a two-row base (833-054). Wire-wrap offers low assembly cost and allows manual rework without removing the connector. However, wire-wrap requires specialized tooling (wire-wrap gun or semi-automatic equipment) and trained operators to ensure proper wrap tension and consistency. If your facility uses only hand-soldering or reflow soldering, wire-wrap may introduce labor costs. Verify that your assembly partner has wire-wrap capability and can meet your wrap-tension specifications (typically 2–4 ounces of pull force per wire).
How should I select between the 833-054-542-201 and a connector with a smaller pitch (e.g., 0.100") for space-constrained designs?
The 833-054-542-201 operates at 0.156" pitch, occupying a larger footprint than 0.100" or 0.125" pitch alternatives. If PCB real estate is limited, smaller-pitch connectors reduce the connector's card-edge length. However, smaller pitches increase manufacturing complexity, cost, and require tighter PCB tolerances and higher-precision insertion equipment. For space-critical applications, trade off the 833-054-542-201's proven reliability and ease of assembly against smaller-pitch alternatives; prototype with both to measure assembly yield and field failure rates in your production environment.
What is the rated contact resistance and voltage rating for the 833-054-542-201, and how do these affect power distribution designs?
Datasheet specifications for the 833-054-542-201 typically cite contact resistance in the range of 10–30 mΩ and voltage rating of 125V AC / 250V DC at standard conditions. In power distribution applications (e.g., high-current backplane), each contact's resistance contributes to I²R losses. If your design carries >5A per contact over extended periods, calculate the power dissipation per contact and verify that card-edge heating does not exceed your thermal budget. For DC power, gold plating and copper alloy contacts provide acceptable performance; for AC power or high-frequency switching, validate that the contact resistance remains stable across your operating temperature range.
Are there known design pitfalls when migrating from parallel card-edge connectors to the 833-054-542-201 in legacy systems?
Common pitfalls include misalignment of signal and ground planes if the original connector used a different row count or pin assignment. The 833-054-542-201's dual-edge, 27-position-per-row configuration requires careful cross-reference with the legacy connector's pinout to avoid signal-to-ground mapping errors. Additionally, wire-wrap termination may have different crosstalk characteristics than solder or press-fit terminals on the original connector; re-measure signal timing and integrity in your prototype to confirm timing margins remain adequate.
What RoHS and REACH compliance status should I verify for the 833-054-542-201 in regulated markets?
The 833-054-542-201 is RoHS3 Compliant and REACH Unaffected according to the part specifications. RoHS3 compliance confirms the absence of banned substances (lead, cadmium, hexavalent chromium, etc.) in solder, plating, and insulation. REACH Unaffected status means the part is not subject to SVHC (Substances of Very High Concern) candidate lists at the time of designation. However, REACH designations may change; if your application requires certification for a specific year or region (EU, China RoHS), request updated compliance documentation from the manufacturer and verify the batch or serial number on your purchased units.

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833-054-542-201

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EDAC Inc.

833 HIGH TEMP' SERIES (.156" (3.

In Stock: 2757

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