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74LVC2G00HD4-7

In Stock 7132 pcs Reference Price(In US Dollars)
5+
$0.0844
50+
$0.0822
150+
$0.0808
500+
$0.0793
Manufacturer Part Number:
74LVC2G00HD4-7
Manufacturer / Brand
Diodes Incorporated
Part of Description:
IC GATE NAND 2CH 2-INP DFN2010-8
Datasheets:
74LVC2G00HD4-7(1).pdf74LVC2G00HD4-7(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 7132 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 74LVC2G00HD4-7
Manufacturer / Brand Diodes Incorporated
Stock Quantity 7132 pcs Stock
Category Integrated Circuits (ICs) > Logic - Gates and Inverters
Description IC GATE NAND 2CH 2-INP DFN2010-8
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.65V ~ 5.5V
Supplier Device Package X2-DFN2010-8
Series 74LVC
Package / Case 8-XFDFN
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 125°C
Number of Inputs 2
Number of Circuits 2
Mounting Type Surface Mount
Max Propagation Delay @ V, Max CL 4.2ns @ 5V, 50pF
Logic Type NAND Gate
Input Logic Level - Low -
Input Logic Level - High -
Features -
Current - Quiescent (Max) 40 µA
Current - Output High, Low 32mA, 32mA
Base Product Number 74LVC2G00

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the 74LVC2G00HD4-7 be safely used in a mixed-voltage system where one side operates at 3.3V and the other at 5V without additional level shifting?
The 74LVC2G00HD4-7 supports a wide supply voltage range of 1.65V to 5.5V, allowing it to interface between 3.3V and 5V logic levels directly due to its 5V-tolerant inputs. This eliminates the need for external level shifters in most bidirectional or unidirectional signal paths, provided the higher-voltage side is not driven above the absolute maximum rating of VCC + 0.5V.
What are the implications of using the 74LVC2G00HD4-7 in a high-speed digital design with tight timing budgets?
With a maximum propagation delay of 4.2ns at 5V and 50pF load, the 74LVC2G00HD4-7 is suitable for moderate-speed applications but may introduce significant delay in systems requiring sub-nanosecond precision. Careful PCB layout, minimizing trace lengths, and avoiding capacitive loading beyond specifications are essential to maintain signal integrity and meet timing constraints.
Is the 74LVC2G00HD4-7 suitable for automotive-grade temperature cycling environments, and what derating practices should be considered?
The device operates from -40°C to 125°C, making it compatible with automotive temperature grades. However, long-term reliability under thermal cycling requires adherence to JEDEC JESD22-A104 standards. Engineers should ensure proper solder joint quality, avoid mechanical stress on the X2-DFN2010-8 package, and consider margining on input thresholds and output drive strength under extreme conditions.
How does the quiescent current of the 74LVC2G00HD4-7 impact power consumption in battery-powered applications?
The maximum quiescent current is 40 µA, which is low enough to support extended battery life in portable devices. In sleep-mode dominated designs, this characteristic helps minimize standby power. However, total system power must also account for switching activity, output loading, and supply rail stability across the full operating voltage range.
What configuration considerations exist when cascading multiple 74LVC2G00HD4-7 gates to implement larger logic functions?
When cascading the 74LVC2G00HD4-7, designers must ensure that fan-out requirements do not exceed the 32mA output drive capability per channel. Input leakage currents and propagation delays accumulate across stages, potentially degrading overall performance. It is advisable to buffer heavily loaded nets and verify timing margins using worst-case VOH/VIH thresholds at minimum supply voltage.
Can the 74LVC2G00HD4-7 replace legacy SN74LVC2G00 variants in existing designs without modification?
While pin-compatible and functionally equivalent, the 74LVC2G00HD4-7 uses a different package (X2-DFN2010-8) than traditional SOIC or TSSOP versions. Mechanical footprint changes require PCB redesign unless an adapter is used. Additionally, ensure thermal and soldering profiles align with the smaller form factor; otherwise, migration may necessitate board-level rework.
Are there any limitations in using the 74LVC2G00HD4-7 for open-drain or wired-AND configurations?
The 74LVC2G00HD4-7 contains standard push-pull outputs, not open-drain. Therefore, it cannot directly implement wired-OR or open-collector logic without external components such as pull-up resistors and discrete transistors. Attempting to tie outputs together may result in contention currents exceeding absolute maximum ratings if not properly managed.
What precautions are necessary when reflow soldering the 74LVC2G00HD4-8 in mass production?
The X2-DFN2010-8 package has a low thermal mass, increasing susceptibility to overheating during reflow. Adherence to IPC/JEDEC J-STD-020C profile with controlled peak temperatures below 260°C and adequate soak time is critical. Moisture sensitivity level (MSL) is 1, so pre-baking is unnecessary unless storage conditions violate IPC guidelines. Ensure stencils and placement accuracy to prevent tombstoning.
How does input hysteresis affect noise immunity in noisy industrial environments when using the 74LVC2G00HD4-7?
The 74LVC2G00HD4-7 exhibits minimal input hysteresis, which reduces noise immunity compared to Schmitt-trigger variants. In electrically noisy settings, this can lead to unintended toggling near threshold voltages. Adding external RC filtering or using buffered input lines is recommended to stabilize logic transitions and improve robustness.
What alternatives exist if higher drive strength than 32mA per output is required while maintaining compatibility with the 74LVC2G00HD4-7’s voltage levels?
For increased output current, consider using a buffer IC such as the TXB0102 (bidirectional translator) or dedicated drivers like SN74ALVC244. These offer higher sink/source current while preserving 1.65V–5.5V operation. Alternatively, parallel multiple 74LVC2G00HD4-7 outputs with common enable control, though this increases component count and complexity.

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