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20-101-1007

Manufacturer Part Number:
20-101-1007
Manufacturer / Brand
Digi
Part of Description:
IC MOD RABBIT 3000 25.8MHZ 256KB
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 4144 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 20-101-1007
Manufacturer / Brand Digi
Stock Quantity 4144 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers, Microprocessor, FPGA Modules
Description IC MOD RABBIT 3000 25.8MHZ 256KB
Lead Free Status / RoHS Status: RoHS Compliant
Speed 25.8MHz
Size / Dimension 2.350' L x 4.000' W (60.00mm x 102.00mm)
Series -
RAM Size 256KB
Package Box
Operating Temperature -40°C ~ 70°C
Module/Board Type MPU Core
Flash Size 512KB
Core Processor Rabbit 3000
Connector Type IDC Header 2x25, 2x5, 1x3mm
Co-Processor -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the 20-101-1007 module operate reliably in an industrial environment with frequent temperature cycling between -40°C and 70°C, and what design precautions are needed for long-term stability?
Yes, the 20-101-1007 is specified to operate from -40°C to 70°C, making it suitable for industrial environments. However, thermal stress during rapid cycling can affect solder joints and connectors. Engineers should ensure adequate mechanical support at the IDC header interface and consider conformal coating to protect against moisture ingress, especially if operating near the upper temperature limit.
What voltage requirements must be met when integrating the 20-101-1007 into a custom PCB, and how does power sequencing impact system reliability?
The Rabbit 3000 core in the 20-101-1007 typically requires a stable 3.3V supply with low noise and ripple. Power sequencing must follow the module’s internal reset behavior; abrupt power-up or down may cause configuration errors or corruption of flash memory. A soft-start regulator and proper decoupling near the module’s VCC pins are recommended to ensure clean power delivery and predictable startup.
How should clocking be handled when replacing legacy systems with the 20-101-1007 to avoid timing conflicts with peripheral devices?
The 20-101-1007 uses an integrated 25.8MHz crystal oscillator, which provides a fixed clock frequency. When migrating from systems using different clock sources, engineers must verify that all peripherals (UART, SPI, timers) tolerate this specific frequency or implement clock division/PLL adjustments if necessary. Mismatched clock domains can lead to data framing errors or missed interrupts.
Is it possible to reprogram the 20-101-1007 without removing it from the target system, and what tools are required for in-circuit programming?
Yes, the 20-101-1007 supports in-circuit programming via the standard IDC header using Digi’s proprietary development tools such as the Digi Embedded Yocto SDK and Digi Flash Utility. No removal is required, but access to the programming header must be preserved during assembly. Ensure JTAG/SWD signals are properly routed and buffered if long traces are used.
Can the 20-101-1007 be used in battery-powered applications due to its power consumption characteristics, and what optimizations reduce energy usage?
While not optimized for ultra-low-power, the 20-101-1007 can be used in battery applications with careful software management. Software-level sleep modes and disabling unused peripherals significantly reduce average current draw. However, the module lacks hardware-based low-power states; thus, duty-cycling the processor and managing clock gating are essential techniques to extend battery life.
What considerations apply when selecting alternative modules to replace the 20-101-1007 in existing designs, particularly regarding footprint compatibility and pinout equivalence?
Replacement modules must match the 20-101-1007’s 60mm x 102mm form factor and provide identical connector layout (IDC 2x25, 2x5, 1x3mm). Pin-to-pin compatibility is critical, especially for power, ground, and critical control lines like RESET and WAKE. Even minor deviations in signal mapping can disrupt boot sequences or communication protocols. Always validate timing margins and voltage thresholds across candidate replacements.
How does the 20-101-1007 handle electromagnetic interference (EMI) in electrically noisy environments, and what PCB layout practices improve immunity?
The Rabbit 3000 core in the 20-101-1007 does not include on-chip EMI filtering, so external measures are necessary. Engineers should minimize loop areas for high-speed signals, use ground planes beneath the module, and add ferrite beads on I/O lines exposed to noise. Shielding the IDC connector and maintaining separation from switching regulators enhances robustness in industrial settings.
Are there known limitations in using the 20-101-1007 for real-time control applications requiring deterministic interrupt response times?
The 20-101-1007 runs a full-featured OS (such as RTOS or Linux via Yocto), which introduces variable interrupt latency. For hard real-time tasks, the scheduler behavior and context-switch overhead must be analyzed. While suitable for soft real-time applications, mission-critical timing loops may require external co-processors or dedicated timing controllers to meet strict deadlines.
What firmware migration steps are necessary when upgrading from older Rabbit 2000-based systems to the 20-101-1007, and are code changes required?
Migration involves recompiling application code using updated toolchains compatible with the Rabbit 3000 architecture and Digi Embedded Yocto. While C source compatibility is generally maintained, register-level access and memory-mapped I/O addresses may differ. Engineers must update linker scripts for the new 256KB RAM and 512KB flash layout and verify stack usage under optimized builds.
Does the 20-101-1007 support over-the-air (OTA) firmware updates in field-deployed systems, and what security measures are built-in?
OTA updates are supported through Digi’s secure provisioning framework, but they require integration of additional components such as a modem or Wi-Fi module and secure bootloader implementation. The module itself does not include cryptographic hardware acceleration. Engineers must implement signed firmware images and secure storage partitions to prevent unauthorized modifications.

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