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SP3071ECN

Manufacturer Part Number:
SP3071ECN
Manufacturer / Brand
SIPEX
Part of Description:
SP3071ECN SP SOP8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 15198 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP3071ECN
Manufacturer / Brand SIPEX
Stock Quantity 15198 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP3071ECN SP SOP8
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP3071ECN Datasheets SP3071ECN Details PDF
SP3071ECN Details PDF for FR.pdf
SP3071ECN Details PDF for KR.pdf
SP3071ECN Details PDF for IT.pdf
SP3071ECN Details PDF for ES.pdf
SP3071ECN Details PDF for DE.pdf
Package SOP8
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design constraints when integrating the SP3071ECN in a low-voltage industrial control system with 3.3V I/O rails?
The SP3071ECN is designed to operate from a single 5V supply and supports RS-232 voltage levels, which may not be compatible with 3.3V logic systems without level shifting. Direct connection to 3.3V I/O pins can lead to undefined behavior or damage due to input threshold mismatch. Engineers should verify that all UART signals interface through bidirectional level translators or use an alternate transceiver like the SP3485 for native 3.3V support.
Can the SP3071ECN be used in automotive-grade temperature environments (-40°C to +85°C)?
The SP3071ECN has an operating temperature range of 0°C to +70°C, making it unsuitable for full automotive applications requiring AEC-Q100 qualification. For extended temperature operation, alternative parts such as the MAX3232CWE+ or SN75176B must be considered, as they often offer wider thermal tolerance and enhanced reliability under thermal cycling.
Is the SP3071ECN suitable for replacing legacy MAX232-based designs in space-constrained PCB layouts?
While the SP3071ECN integrates charge pump and driver/receiver circuitry on a single chip, it uses a similar pinout to the MAX232 but lacks external capacitor compatibility in some package variants. Migration requires verifying decoupling and bypassing layout to ensure stable charge pump operation. Engineers should confirm footprint equivalence and test transient response under load before full-scale replacement.
What are the risks of using the SP3071ECN in high-noise industrial environments with long cable runs?
The SP3071ECN provides basic ESD protection (typically ±15kV HBM), but in noisy settings, long RS-232 traces can act as antennas for electromagnetic interference. Without proper shielding, ground loops or signal degradation may occur. It is advisable to use shielded cables, add ferrite beads on signal lines, and consider differential transceivers like the SP3490E for improved noise immunity.
Can the SP3071ECN drive capacitive loads exceeding 1000pF on RS-232 output lines?
The SP3071ECN has limited current sourcing capability (~5mA) and may fail to maintain valid logic levels on capacitive loads above 1000pF due to slew rate and charge pump limitations. This can result in distorted waveforms and communication errors. For high-capacitance applications, a driver with higher output current such as the LT1180 or MAX232HV is recommended.
How does the SP3071ECN handle power-up sequencing when used with microcontrollers that have delayed UART enable signals?
The SP3071ECN does not require strict power sequencing, but simultaneous assertion of transmit data and receiver enable during power ramp-up can cause transient current spikes in the internal charge pump. Designers should ensure stable VCC reaches nominal value before enabling UART communication or add a small delay (≥1ms) after power-on reset in firmware.
Are there known compatibility issues when substituting the SP3071ECN with the SP3072ECN in existing designs?
The SP3072ECN offers improved slew rate control and lower power consumption but operates at slightly different logic thresholds and has a modified pin configuration in some packaging. Substitution requires checking signal integrity on high-speed UART links and verifying handshake timing. While functionally similar, layout and termination may need adjustment to maintain performance.
What precautions should be taken when operating the SP3071ECN near its maximum supply voltage of 5.5V in unregulated power systems?
Voltage transients above 5.5V—common in inductive load switching or power surges—can exceed the device’s absolute maximum rating and cause irreversible damage. Engineers must implement overvoltage protection using Zener diodes or TVS arrays at the VCC input and ensure adequate bulk capacitance to suppress ripple without violating thermal derating curves.
Can the SP3071ECN be used in battery-powered devices with frequent sleep-wake cycles?
The SP3071ECN has moderate quiescent current (~10µA typical), but its charge pump becomes active during transmission, drawing several mA pulses that can significantly impact battery life. In ultra-low-power applications, alternatives like the SP3307EN with shutdown mode or digital isolators with lower leakage are more appropriate.
What are the implications of omitting decoupling capacitors when using the SP3071ECN in compact board designs?
Omitting decoupling capacitors increases susceptibility to power supply noise and can destabilize the internal charge pump oscillator. This leads to erratic data transmission and potential lockup. A 0.1µF ceramic capacitor should be placed within 1cm of the VCC and GND pins, even in small form factors.

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