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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP2526A-2E
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SP2526A-2E

Manufacturer Part Number:
SP2526A-2E
Manufacturer / Brand
SIPEX
Part of Description:
SP2526A-2E SIPEX SOP8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5111 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP2526A-2E
Manufacturer / Brand SIPEX
Stock Quantity 5111 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP2526A-2E SIPEX SOP8
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP2526A-2E Datasheets SP2526A-2E Details PDF
SP2526A-2E Details PDF for FR.pdf
SP2526A-2E Details PDF for KR.pdf
SP2526A-2E Details PDF for ES.pdf
SP2526A-2E Details PDF for DE.pdf
SP2526A-2E Details PDF for IT.pdf
Package SOP8
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SP2526A-2E operate reliably in high-noise industrial environments with frequent voltage transients on the power rail?
The SP2526A-2E features integrated supply voltage supervision and transient filtering designed to maintain stable operation under typical industrial noise conditions. Its SOT23-6 package with optimized lead framing reduces parasitic inductance, improving immunity to fast-rising electrical disturbances. For systems exposed to severe transients, pairing the SP2526A-2E with an external RC filter at the supply pin and ensuring solid PCB layout practices—such as short trace lengths and ground plane continuity—can further enhance reliability in extended operating scenarios.
How does the SP2526A-2E handle power supply sequencing when used in mixed-voltage systems with 3.3V and 5V logic domains?
The SP2526A-2E supports single-supply operation and is typically powered from a 2.7V to 5.5V range, allowing direct interfacing with both 3.3V and 5V systems without level shifting. Since it does not require strict power-up/down sequencing, the device can be integrated into mixed-signal designs where supply rails ramp asynchronously. However, ensuring that input signals do not exceed the VCC + 0.3V absolute maximum rating during power transitions is critical to prevent latch-up or ESD cell activation.
Is the SP2526A-2E a viable drop-in replacement for MAX232 or SP232 devices in legacy RS-232 interface designs?
While the SP2526A-2E provides RS-232 signal level translation, it differs from the MAX232 and SP232 in that it does not include an onboard charge pump voltage converter. The SP2526A-2E requires an external 5V supply to generate RS-232-compliant output levels, making it unsuitable as a direct pin-compatible replacement in designs relying on charge-pump-based single-supply operation. Migration to the SP2526A-2E is feasible only if a local 5V rail is available and board space allows for re-routing of power connections.
What are the key thermal considerations when deploying the SP2526A-2E in dense PCB layouts with limited airflow?
The SP2526A-2E is housed in an SOP8 package with a junction-to-ambient thermal resistance (θJA) of approximately 170°C/W. Under continuous drive conditions, internal power dissipation from driver outputs switching at high baud rates can increase die temperature significantly in enclosed or thermally constrained environments. To maintain long-term reliability, limit the average data rate or duty cycle, use copper pours connected to ground pins for heat spreading, and avoid placing the SP2526A-2E near high-power components on the board.
Can the SP2526A-2E support full-duplex communication at baud rates above 1 Mbps in industrial telemetry applications?
The SP2526A-2E is characterized for operation up to 120 kbps in standard RS-232 configurations. Attempting full-duplex communication at 1 Mbps or higher exceeds the device's guaranteed performance envelope and may result in increased bit error rates due to propagation delay mismatches and slew rate limitations. For high-speed serial interfaces, engineers should consider using 3.3V logic-level signaling with dedicated high-speed transceivers or upgrade to modern transceivers specifically rated for multi-megabit operation.
What PCB layout practices are recommended to minimize crosstalk between channels on the SP2526A-2E in multi-driver applications?
To reduce crosstalk in multi-channel configurations using the SP2526A-2E, maintain adequate spacing (≥2x trace width) between adjacent signal traces. Route high-speed driver outputs away from sensitive receiver inputs and avoid parallel routing over long distances. Use a solid ground plane beneath the SOP8 footprint and minimize loop areas by placing decoupling capacitors (0.1 µF) as close as possible to the VCC pin. Differential parasitics between channel pairs should also be balanced to ensure consistent timing behavior.
How does the enable timing of the SP2526A-2E impact system-level handshaking in half-duplex RS-485-style networks?
Although the SP2526A-2E is primarily an RS-232 transceiver, some engineers attempt to repurpose its enable/disable function for bus arbitration in custom half-duplex systems. The device’s turn-on and turn-off propagation delays are not symmetrically specified, which can introduce unpredictable response windows during direction control transitions. For reliable handshaking, rely only on signal timing defined in the SP2526A-2E datasheet and implement software timeouts equivalent to at least 2–3 character periods at the operating baud rate to avoid data collisions.
What long-term availability and obsolescence risks are associated with designing the SP2526A-2E into new production equipment?
The SP2526A-2E is listed under Sipex (acquired by Maxim Integrated, now part of Analog Devices), and while currently available through franchised distributors, its status in active lifecycle management is uncertain. Engineers planning long-term deployments should confirm current status through official channels, evaluate last-time-buy (LTB) notices, and assess form-fit-function alternatives such as the MAX3232 or ST3232, which offer comparable performance with improved integration and broader supply chain support. Designing with second-source options in mind reduces risk in case of future discontinuation.

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