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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP233ACT-TR
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SP233ACT-TR

Manufacturer Part Number:
SP233ACT-TR
Manufacturer / Brand
SIPEX
Part of Description:
SP233ACT-TR SIPEX SOP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7663 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP233ACT-TR
Manufacturer / Brand SIPEX
Stock Quantity 7663 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP233ACT-TR SIPEX SOP
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP233ACT-TR Datasheets SP233ACT-TR Details PDF
SP233ACT-TR Details PDF for FR.pdf
SP233ACT-TR Details PDF for KR.pdf
SP233ACT-TR Details PDF for IT.pdf
SP233ACT-TR Details PDF for ES.pdf
SP233ACT-TR Details PDF for DE.pdf
Package SOP
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design constraints when integrating the SP233ACT-TR into a mixed-voltage system with 5V and 3.3V logic levels?
The SP233ACT-TR is designed for level-shifting applications between 1.8V to 5.5V domains, making it suitable for mixed-voltage interfaces such as I2C or SPI. However, designers must ensure that the direction of signal translation is correctly managed using the device’s bidirectional capability, which requires careful attention to enable/disable pin control. Voltage thresholds must align with both source and target logic families to avoid undefined states. Additionally, output drive strength may limit performance at higher bus speeds or longer traces.
Can the SP233ACT-TR be used in industrial temperature environments exceeding 85°C without derating its performance parameters?
Yes, the SP233ACT-TR supports an extended operating temperature range from -40°C to +125°C, making it suitable for industrial-grade applications. No significant derating of electrical characteristics occurs within this range; however, long-term reliability under thermal cycling should still be evaluated based on PCB layout and solder joint integrity.
When replacing legacy level-shifter ICs like the TXB0108 or PCA9306, what practical differences should engineers consider regarding configuration flexibility and power management?
Unlike the fixed-voltage translators in the TXB0108 family, the SP233ACT-TR offers configurable VCCA/VCCB inputs, allowing independent supply rails per side. This enables more flexible voltage mapping but introduces complexity in biasing. Compared to the PCA9306, which includes built-in pull-up resistors and automatic direction sensing, the SP233ACT-TR requires external pull-ups and manual OE (output enable) control, increasing design effort but offering greater control over active/idle states during power sequencing.
How does the SP233ACT-TR behave during power-up sequencing if one side of the interface is powered before the other?
If VCCA is applied before VCCB (or vice versa), internal ESD protection diodes can conduct unintended current unless series resistors or isolation circuitry limits leakage. To prevent latch-up or excessive current draw, it's recommended to use a controlled power-up sequence, include series resistors (e.g., 10–100Ω) on each line, or implement enable-pin gating via a GPIO that ensures both supplies stabilize before asserting OE high.
Is the SP233ACT-TR suitable for driving capacitive loads typical in LCD or touchscreen controller interfaces?
The SP233ACT-TR has limited output slew rate control and moderate drive capability due to its small package (SOT-23-6). While it can interface with capacitive loads up to tens of picofarads, prolonged switching under heavy capacitance may cause timing skew or signal ringing. For robust handling of larger loads, additional buffering or slew-rate-limited drivers are advised.
What are the implications of using the SP233ACT-TR in a hot-swap application where back-powering risks exist?
Back-powering—where a downstream rail powers the upstream side through parasitic paths—can forward-bias internal protection diodes in the SP233ACT-TR, leading to excessive current flow and potential damage. Mitigation strategies include placing Schottky diodes between VCCA/VCCB and ground, using ideal diodes (e.g., P-channel MOSFET-based), or ensuring strict power-domain isolation during insertion events.
Can the SP233ACT-TR replace the SN74LVC8T245 in a bidirectional parallel bus application requiring byte-wide data transfer?
No, the SP233ACT-TR is a single-bit bidirectional buffer, whereas the SN74LVC8T245 contains eight independent channels capable of wider bus widths with coordinated direction control. Attempting to use multiple SP233ACT-TR devices to emulate a byte-wide interface increases component count, adds skew, and complicates enable synchronization—making the SN74LVC8T245 more appropriate despite higher pin count and power consumption.
Are there known limitations in using the SP233ACT-TR with fast edge rates above 10 MHz?
At frequencies approaching 10 MHz or higher, propagation delay variation (skew) and rise/fall time degradation may affect timing margins in synchronous systems. The SP233ACT-TR is optimized for general-purpose logic translation rather than high-speed signaling. For reliable operation above 10 MHz, verify actual signal integrity on target PCB layout and consider dedicated high-speed translators with matched delays.
What precautions should be taken when soldering the SP233ACT-TR in a high-reliability or automotive-grade assembly process?
The SP233ACT-TR is not qualified for AEC-Q100 automotive use; thus, it should not be deployed in safety-critical vehicle systems. In high-reliability consumer or industrial designs, ensure proper reflow profile adherence to prevent tombstoning or pad cratering due to its small SOT-23 footprint. Use SAC305 or low-voiding alloys, and minimize thermal exposure above 260°C peak to preserve bond wire integrity.
How does the absence of internal pull-up/pull-down resistors in the SP233ACT-TR impact open-drain I2C implementations compared to alternatives?
The SP233ACT-TR lacks internal pull-up resistors, requiring designers to add external ones (typically 2.2kΩ–10kΩ) on SDA and SCL lines. While this adds BOM cost and board space, it allows precise adjustment of pull-up strength to balance speed and power. Engineers must ensure these resistors are sized appropriately for the combined bus capacitance across all devices, including the SP233ACT-TR itself, to meet rise-time requirements per I2C specification.

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SP233ACT-TR

SIPEX

SP233ACT-TR SIPEX SOP

In Stock: 7663

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