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SP213EHCT

Manufacturer Part Number:
SP213EHCT
Manufacturer / Brand
SIPEX
Part of Description:
SP213EHCT SIPEX SMD
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7073 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP213EHCT
Manufacturer / Brand SIPEX
Stock Quantity 7073 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP213EHCT SIPEX SMD
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP213EHCT Datasheets SP213EHCT Details PDF
SP213EHCT Details PDF for KR.pdf
SP213EHCT Details PDF for IT.pdf
SP213EHCT Details PDF for ES.pdf
SP213EHCT Details PDF for DE.pdf
SP213EHCT Details PDF for FR.pdf
Package SMD
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical voltage and current limitations for the SP213EHCT when used in industrial motor control applications that require high noise environments?
The SP213EHCT is designed to support RS-232 communication with a supply voltage range of 3.0V to 5.5V, making it suitable for low-voltage industrial systems. However, its maximum input voltage on any pin must not exceed ±25V to prevent latch-up or damage, especially during transient surges common in motor drives. The device can handle up to 15 kV ESD protection on the driver outputs, which helps maintain signal integrity in electrically noisy environments. Engineers should ensure that external protection circuits, such as TVS diodes, are implemented if the system is exposed to inductive load switching transients.
Can the SP213EHCT be used as a direct replacement for the SP213EHTR in legacy embedded designs using UART-to-RS232 conversion?
The SP213EHCT and SP213EHTR share the same electrical characteristics and pinout, but differ only in packaging—the C variant uses SMD (surface-mount) while the T variant may use through-hole. This means the SP213EHCT can generally replace the SP213EHTR in modern PCB layouts requiring surface mounting. However, designers must verify thermal performance and solder joint reliability under vibration or thermal cycling, as SMD packages have lower mechanical stress tolerance than through-hole alternatives. No functional changes are expected, but layout considerations for reflow soldering must be addressed.
What configuration options exist for enabling or disabling the SP213EHCT’s internal charge pump, and how does this affect external component requirements?
The SP213EHCT relies entirely on an internal charge pump to generate the negative voltage required for RS-232 signaling. This means external capacitors (typically 0.1 µF to 1 µF ceramic) are mandatory and must be placed close to the V+ and GND pins. There is no option to disable the charge pump, so the device cannot operate without these capacitors. Omitting them will result in failed signal level generation and complete communication failure.
In battery-powered wireless sensor nodes using the SP213EHCT, what impact does continuous transmission have on power consumption and battery life?
The SP213EHCT consumes approximately 1.2 mA (typical) in active mode with both drivers enabled at 3.3V. While this is relatively efficient for RS-232 ICs, prolonged data transmission increases average current draw significantly. Designers should minimize transmit frequency and implement software-controlled driver shutdown during idle periods. Additionally, consider using lower baud rates where feasible, as higher clock frequencies slightly increase dynamic power. For ultra-low-power applications, alternative protocols like UART over SPI or I2C may offer better efficiency.
Are there any known compatibility issues between the SP213EHCT and 5V microcontrollers when interfacing via RS-232 levels?
The SP213EHCT accepts logic inputs from 1.8V to 5.5V, allowing direct connection to 5V microcontrollers like the STM32 or PIC24 series. However, the output voltage swing is ±6V typical, which exceeds standard RS-232 thresholds but remains compliant with RS-232C specifications. The primary concern is ensuring the microcontroller’s UART RX pin can tolerate up to ±12V transients—most modern MCUs do, but older parts may require clamping diodes or level shifters. Always verify absolute maximum ratings on the host MCU datasheet.
How does temperature derating affect the SP213EHCT’s output drive strength in extended industrial operation above 70°C?
The SP213EHCT maintains full performance across the commercial temperature range (-40°C to +85°C). However, at elevated temperatures near 85°C, the internal charge pump efficiency decreases slightly, potentially reducing output voltage swing by up to 0.5V under heavy capacitive loads. This may affect long-distance RS-232 communication or systems driving high-impedance lines. Designers should ensure sufficient margin in receiver threshold detection and avoid exceeding the 1 µF total load capacitance specified in the datasheet.
Can the SP213EHCT drive multiple RS-232 receivers simultaneously without degrading signal quality or risking driver overload?
The SP213EHCT is rated for driving one transmitter line and one receiver line per channel, with a maximum capacitive load of 1 µF. Connecting multiple receivers to a single driver output violates this specification and may cause excessive current draw, reduced output voltage swing, and potential device damage. To interface with multiple devices, use separate drivers or add buffer stages. Alternatively, migrate to a multi-channel RS-232 transceiver like the MAX3232 if multiple ports are required.
What precautions should be taken when integrating the SP213EHCT into a design using a 3.3V FPGA with limited drive capability?
The SP213EHCT’s CMOS-compatible logic inputs accept voltages down to 1.8V, making it compatible with 3.3V FPGAs. However, ensure that the FPGA’s GPIO slew rate and drive strength align with the SP213EHCT’s input timing requirements. Slow rising edges may violate setup/hold times at high baud rates. Additionally, avoid routing the TXD line near noisy digital signals to prevent coupling-induced glitches. A series resistor of 22–100 Ω on the FPGA output can improve signal integrity and reduce EMI.
Is the SP213EHCT suitable for automotive applications requiring ISO 7637-2 compliance?
The SP213EHCT provides basic ESD protection (up to 15 kV HBM) but does not meet full automotive robustness standards like ISO 7637-2, which tests for transient pulses such as load dump (up to +65 V). While the device may function in non-critical automotive peripherals, it is not recommended for primary communication interfaces in harsh automotive environments. Use a dedicated automotive-grade RS-232 transceiver like the TJA1050-based solutions or TI’s ISO7741 family for compliance.
What are the implications of replacing the SP213EHCT with a newer IC like the MAX3232 in existing PCB footprints?
Both the SP213EHCT and MAX3232 use similar SMD packages and pinouts, allowing drop-in replacement in many cases. However, the MAX3232 operates over a wider temperature range (-40°C to +105°C) and supports higher baud rates with improved noise margins. It also includes better power-down features and more robust ESD protection. Migration requires verifying capacitor values—the MAX3232 typically needs smaller charge pump capacitors (e.g., 0.1 µF vs. 1 µF), simplifying layout. Always re-run signal integrity simulations post-migration.

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