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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP1117M3-3.3
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SP1117M3-3.3

Manufacturer Part Number:
SP1117M3-3.3
Manufacturer / Brand
SIPEX
Part of Description:
SP1117M3-3.3 100K库存 SOT223
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 12328 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1117M3-3.3
Manufacturer / Brand SIPEX
Stock Quantity 12328 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP1117M3-3.3 100K库存 SOT223
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP1117M3-3.3 Datasheets SP1117M3-3.3 Details PDF
SP1117M3-3.3 Details PDF for FR.pdf
SP1117M3-3.3 Details PDF for KR.pdf
SP1117M3-3.3 Details PDF for IT.pdf
SP1117M3-3.3 Details PDF for ES.pdf
SP1117M3-3.3 Details PDF for DE.pdf
Package SOT223
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the SP1117M3-3.3 linear voltage regulator into a compact PCB layout with limited space and thermal constraints?
The SP1117M3-3.3 is housed in a SOT223 package, which offers moderate thermal performance but requires careful layout to manage heat dissipation. Engineers should ensure adequate copper area on all three pins (especially the tab) for effective heat sinking, maintain short traces to minimize parasitic inductance and resistance, and avoid placing high-current paths near sensitive analog sections. Thermal vias under the regulator pad can significantly improve long-term reliability in continuous operation.
Can the SP1117M3-3.3 be safely used as a replacement for the LM1117-3.3 in designs requiring 500mA output current at ambient temperatures up to 85°C?
Yes, the SP1117M3-3.3 is functionally equivalent to the LM1117-3.3 and supports up to 1A output current under proper thermal conditions. However, its internal reference and dropout voltage specifications are similar, so input-output differential must still be maintained above 1.2V minimum. At 500mA and elevated ambient temperature, ensure sufficient heatsinking or derate power dissipation per the datasheet’s thermal curves to prevent junction temperature from exceeding 125°C.
What happens if the input capacitor for the SP1117M3-3.3 is omitted or replaced with a low-ESR ceramic capacitor without verifying transient response stability?
Omitting the input capacitor risks instability due to insufficient filtering of high-frequency noise and potential oscillations under dynamic load changes. While many applications tolerate ceramic capacitors alone, some batch variations of the SP1117M3-3.3 may exhibit ringing or instability with certain combinations of capacitance and ESR. It is recommended to include a 10µF tantalum or aluminum electrolytic capacitor at the input and verify transient behavior during prototype testing.
Is it acceptable to operate the SP1117M3-3.3 continuously at full load without a heatsink in an enclosed industrial enclosure rated for 40°C ambient?
Continuous operation at full load (e.g., 1A) without a heatsink may lead to thermal throttling or failure in such conditions. The SOT223 package has limited thermal resistance; even with good PCB copper, power dissipation can push the junction temperature beyond safe limits. Engineers should calculate total power loss (P = (Vin - Vout) × Iout) and compare it against the derated maximum allowable dissipation curve in the datasheet. A heatsink or forced airflow is strongly advised for reliable long-term operation.
How does the SP1117M3-3.3 compare to switching regulators like the MP2307 when used in battery-powered IoT devices where efficiency matters?
The SP1117M3-3.3 is a linear regulator offering simplicity, low noise, and fast transient response but suffers from lower efficiency—especially when Vin > Vout by more than 1–2V. In battery-powered applications with wide input ranges, this results in significant quiescent current and reduced runtime. Switching regulators like the MP2307 are far more efficient but introduce switching noise and require additional components. Choose the SP1117M3-3.3 only when noise sensitivity outweighs power budget concerns.
Are there any known compatibility issues when replacing older SP1117 variants with the SP1117M3-3.3 in legacy designs originally using SP1117-3.3L or SP1117-3.3T models?
The SP1117M3-3.3 is pin-compatible with earlier SP1117 series parts, but subtle differences in internal compensation or startup behavior may affect stability with certain output capacitor types or loads. Always verify transient response and phase margin during migration. Use identical capacitor values and ESR characteristics where possible, and perform bench testing under worst-case load transients before finalizing the change in production hardware.
What precautions should be taken when configuring multiple SP1117M3-3.3 regulators on a single board sharing ground planes or power traces?
When paralleling SP1117M3-3.3 units, individual current sharing is not guaranteed due to tolerance mismatches in feedback resistors and output voltages. This can cause one regulator to carry excess current while others remain underutilized. Avoid paralleling unless absolutely necessary; if required, use external ballast resistors or active current-sharing circuits. Additionally, ensure clean return paths to prevent ground bounce and cross-talk between modules.
Can the SP1117M3-3.3 support hot-swapping applications where the input power rail is connected after the output load is active?
Hot-swapping the input supply while the output load remains powered may cause reverse current flow into the regulator if the output voltage rises above the input due to capacitive coupling or leakage. Although the SP1117M3-3.3 lacks built-in reverse-current protection, adding a Schottky diode in series with the input can prevent damage. Alternatively, implement sequencing logic or use dedicated hot-swap controllers for safer operation in such scenarios.
What are the implications of using the SP1117M3-3.3 with pulsed loads common in microcontrollers or communication interfaces?
Pulsed loads with high di/dt can induce voltage overshoots on the output unless adequately decoupled. The SP1117M3-3.3 responds quickly to load steps, but poor output capacitance or trace inductance may lead to undershoots or ringing. Use a combination of bulk capacitance (e.g., 22µF) and low-ESR ceramics near the regulator to stabilize the output. Monitor with an oscilloscope under actual load profiles to confirm stability.
Is the SP1117M3-3.3 suitable for automotive-grade applications requiring AEC-Q100 qualification?
No, the SP1117M3-3.3 is not specified for automotive environments and lacks AEC-Q100 compliance. Its operating temperature range and reliability metrics are intended for industrial or commercial use. For automotive systems, consider automotive-qualified LDOs such as the NCP1117 or TPS7A4700 that meet stringent environmental and longevity requirements.

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SP1117M3-3.3

SIPEX

SP1117M3-3.3 100K库存 SOT223

In Stock: 12328

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