Choose your country or region.

Image may be representation.
See specs for product details.

1440002-8

Manufacturer Part Number:
1440002-8
Manufacturer / Brand
TE
Part of Description:
1141
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 4000 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number 1440002-8
Manufacturer / Brand TE
Stock Quantity 4000 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 1141
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the 1440002-8 connector's contact resistance affect signal integrity in high-speed digital applications, and what design considerations are needed to maintain acceptable performance?
The 1440002-8 features low contact resistance that minimizes voltage drop and insertion loss, but in high-speed digital designs, parasitic inductance and capacitance at mating interfaces can introduce impedance discontinuities. Engineers should ensure adequate PCB layout spacing, use matched termination strategies, and verify signal rise times remain within datasheet specifications to preserve data integrity.
What are the thermal derating implications when using the 1440002-8 in industrial environments with sustained high ambient temperatures?
Operating the 1440002-8 above 70°C requires careful attention to power dissipation across connected circuits. Thermal buildup near the connector interface can degrade solder joint reliability over time. Designs should incorporate adequate airflow or thermal relief traces, and continuous current loads must be evaluated against long-term thermal cycling stress to prevent premature failure.
Can the 1440002-8 be used as a direct replacement for legacy connectors in existing mechanical enclosures without redesign?
Mechanical compatibility depends on pin count, pitch, and overall housing dimensions. While the 1440002-8 may share similar form factors, engineers must verify mounting hole locations, panel cutout tolerances, and cable routing constraints before assuming drop-in replacement capability. Even minor dimensional variances can compromise sealing or strain relief requirements.
What configuration options exist for the 1440002-8 to support mixed-voltage signaling between 3.3V logic and 5V peripheral devices?
The 1440002-8 itself does not include level-shifting circuitry, so designers must implement external translation components such as dedicated ICs or resistor-based voltage dividers at critical signal lines. This adds trace complexity and potential noise susceptibility, requiring careful PCB layout and signal path validation to avoid timing skew or logic errors.
Is the 1440002-8 suitable for automotive-grade applications requiring AEC-Q200 compliance?
The 1440002-8 is not inherently qualified under AEC-Q200 standards. For automotive use, engineers must confirm supplier certification documentation and assess long-term reliability under vibration, thermal shock, and humidity exposure. If used outside qualified conditions, warranty voidance or field failures could occur despite nominal electrical performance.
How does the mating cycle life of the 1440002-8 impact maintenance planning in field-replaceable systems?
With a typical rating of 500 mating cycles, the 1440002-8 imposes operational limits on frequent disconnection events. System architects should design service procedures to minimize live mating operations and consider redundant connection schemes to distribute wear. Field technicians must track usage metrics to anticipate end-of-life scenarios before intermittent faults develop.
What precautions are necessary when soldering the 1440002-8 to prevent damage during rework or repair?
Excessive localized heat exceeding 260°C for more than three seconds risks degrading the plastic housing or damaging adjacent components. Use temperature-controlled soldering irons with fine tips and avoid dragging the iron across multiple pins simultaneously. Always preheat the board uniformly when possible to reduce thermal shock.
Can the 1440002-8 support daisy-chained power delivery across multiple PCB modules without voltage drop issues?
While the 1440002-8 provides solid current paths, long parallel runs increase resistive losses due to contact and conductor resistance. Designs relying on daisy-chained power should calculate total IR drop across all loads, use wider traces, or incorporate local bulk capacitors to stabilize voltage at downstream modules and prevent brownouts.
Are there any known interference issues with the 1440002-8 in proximity to RF transmitters such as cellular or Wi-Fi modules?
Unshielded variants of the 1440002-8 can act as unintentional antennas or receive coupling paths. In RF-sensitive environments, engineers should apply ferrite beads on affected signal lines, increase separation distance between connectors and radios, or select shielded versions if available—otherwise, radiated emissions testing becomes essential during compliance validation.
When migrating from an older connector series to the 1440002-8, what signal integrity simulations are recommended?
Perform time-domain reflectometry (TDR) and eye diagram analysis on key high-speed nets to assess impedance continuity across the mating interface. Include worst-case assembly variations such as misalignment or partial insertion. Simulation models must account for both open and closed connector states to predict ringing or attenuation effects accurately.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


1440002-8

TE

1141

In Stock: 4000

SUBMIT RFQ