Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Specialized ICs > F7H3P
Image may be representation.
See specs for product details.

F7H3P

Manufacturer Part Number:
F7H3P
Manufacturer / Brand
SHINDENGEN
Part of Description:
SHINDENGEN SOP8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7311 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number F7H3P
Manufacturer / Brand SHINDENGEN
Stock Quantity 7311 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SHINDENGEN SOP8
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the F7H3P be used in high-temperature industrial environments, and what are its thermal derating considerations for continuous operation?
The F7H3P is rated for extended temperature ranges typical of industrial applications, but its maximum junction temperature must not exceed 150°C. Engineers should account for self-heating effects when designing PCB layouts with adequate copper pour and thermal relief. Thermal resistance values from the datasheet should guide heatsinking decisions, especially in ambient temperatures above 85°C.
What is the recommended gate drive voltage range for the F7H3P to ensure reliable turn-on without excessive switching losses?
For optimal performance, the F7H3P should be driven with a gate voltage between 10V and 15V. Operating below 10V increases on-state resistance and conduction losses, while exceeding 15V may stress the gate oxide over time. A dedicated gate driver IC with controlled rise/fall times is strongly advised for fast-switching applications.
How does the F7H3P compare to the IRF740 in terms of switching speed and gate charge, and can it directly replace the IRF740 in legacy designs?
The F7H3P features lower gate charge and faster switching characteristics compared to the IRF740 due to optimized internal structure. While pin-compatible in SOP8 packages, direct replacement requires verifying input capacitance and threshold voltage compatibility. Designers must re-evaluate gate drive strength and layout parasitics to maintain efficiency and reduce EMI.
Is the F7H3P suitable for use in half-bridge or full-bridge topologies, and what gate-source protection is required?
Yes, the F7H3P can be used in half-bridge configurations when paired with proper bootstrap circuitry. However, a negative gate drive (down to -5V) is necessary during dead time to prevent shoot-through. A Zener diode clamping the gate-source voltage to ±20V is essential to protect against voltage spikes.
What are the key differences between the F7H3P and the IXTH11N60P, particularly in terms of ruggedness and avalanche energy rating?
The IXTH11N60P offers higher avalanche energy capability (100 mJ vs. 15 mJ for the F7H3P) and enhanced SOA (Safe Operating Area) margins under inductive switching. The F7H3P is better suited for low-to-medium power applications where cost and footprint are prioritized over extreme fault tolerance.
Can the F7H3P operate reliably in automotive environments with repeated thermal cycling?
The F7H3P meets basic industrial temperature requirements but lacks specific automotive-grade certification (e.g., AEC-Q101). In automotive applications with frequent cold-start cycles and wide ambient swings (-40°C to +125°C), additional mechanical stress analysis and conformal coating are recommended to mitigate solder joint fatigue.
What external components are needed to implement soft-start functionality using the F7H3P in a DC-DC converter?
Soft-start can be implemented by adding an RC network at the gate driver output, typically a 10kΩ resistor in series with a 1μF capacitor to ground. This introduces a controlled ramp in gate voltage, limiting inrush current during startup. The F7H3P’s low gate charge allows effective use of such passive timing circuits.
Is reverse recovery behavior of the F7H3P acceptable in synchronous rectification applications?
The F7H3P has moderate reverse recovery charge (Qrr) due to body diode characteristics, making it less ideal for high-frequency synchronous rectification above 100 kHz. For such use cases, a dedicated Schottky or ultra-fast MOSFET is preferable; otherwise, significant switching losses will occur during turn-off transitions.
How should the F7H3P be handled during ESD-sensitive assembly processes to avoid premature failure?
As with all MOSFETs, the F7H3P is vulnerable to ESD events. Assembly should follow JEDEC JESD22-A114 standards using grounded workstations, wrist straps, and ESD-safe packaging. Handling precautions are critical because even brief exposure to voltages above 2 kV can degrade gate integrity over time.
What layout guidelines should be followed when routing power traces near the F7H3P to minimize parasitic inductance and noise coupling?
Minimize loop area between source and drain connections by placing decoupling capacitors as close as possible to the drain and source pins. Use Kelvin connections for gate drive signals to avoid false triggering from ground bounce. Keep gate traces short and shielded from noisy power rails to preserve switching performance and reliability.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


F7H3P

SHINDENGEN

SHINDENGEN SOP8

In Stock: 7311

SUBMIT RFQ