Choose your country or region.

Image may be representation.
See specs for product details.

WM8753LGEB/RV

Manufacturer Part Number:
WM8753LGEB/RV
Manufacturer / Brand
WOLFSON
Part of Description:
WM8753LGEB/RV Wolfson BGA-52
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7930 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number WM8753LGEB/RV
Manufacturer / Brand WOLFSON
Stock Quantity 7930 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description WM8753LGEB/RV Wolfson BGA-52
Lead Free Status / RoHS Status: RoHS Compliant
RFQ WM8753LGEB/RV Datasheets WM8753LGEB/RV Details PDF
WM8753LGEB/RV Details PDF for FR.pdf
WM8753LGEB/RV Details PDF for KR.pdf
WM8753LGEB/RV Details PDF for IT.pdf
WM8753LGEB/RV Details PDF for DE.pdf
WM8753LGEB/RV Details PDF for ES.pdf
Package BGA-52
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


WM8753LGEB/RV Product Details:

The WM8753LGEB/RV is a specialized integrated circuit (IC) manufactured by Wolfson, designed for advanced audio and signal processing applications. This BGA-52 packaged chip represents a sophisticated solution in the realm of specialized integrated circuits, offering high-performance capabilities for complex electronic design challenges.

The device is specifically engineered to provide robust audio processing functionality, leveraging Wolfson's expertise in signal management technologies. Its Ball Grid Array (BGA-52) packaging ensures efficient heat dissipation and compact integration, making it ideal for space-constrained electronic designs such as mobile devices, audio equipment, and professional sound systems.

Key features of this integrated circuit include its specialized signal processing capabilities, which enable precise audio signal manipulation, noise reduction, and high-quality sound reproduction. The compact BGA-52 form factor allows for dense circuit board designs, providing engineers with greater flexibility in product development.

Primary advantages include enhanced signal integrity, low power consumption, and superior audio performance. The chip is particularly well-suited for applications requiring high-precision audio processing, such as smartphones, digital audio players, professional sound mixing equipment, and embedded audio systems.

Compatible with various electronic platforms, the WM8753LGEB/RV offers versatile integration potential across multiple device architectures. Its specialized design makes it an excellent choice for engineers seeking a reliable, high-performance audio signal processing solution.

While specific equivalent models are not definitively listed in the provided specifications, similar Wolfson or industry-standard audio processing ICs might include alternatives from manufacturers like Cirrus Logic, Texas Instruments, or Analog Devices that offer comparable audio signal processing capabilities.

The substantial quantity of 7,730 units suggests this is a production-ready component with significant market demand in professional and consumer electronics segments.

WM8753LGEB/RV Key Technical Attributes

Manufacturer: Wolfson

Package: BGA-52

Encapsulation: 14475

WM8753LGEB/RV Packing Size

The WM8753LGEB/RV utilizes a BGA-52 (Ball Grid Array with 52 balls) packaging type, which is highly compact and minimizes the physical footprint on PCBs. The packaging material is robust and specifically designed to ensure optimal thermal dissipation and electrical integrity. This configuration supports secure pin connections and alignment, and provides enhanced resistance to mechanical stress, making it suitable for high-density integrated circuit applications. The pin configuration of BGA-52 ensures efficient signal transmission and high data rates, while also improving thermal characteristics for long-term reliability. The package’s electrical properties are optimized for noise immunity and high-speed operation.

WM8753LGEB/RV Application

The WM8753LGEB/RV is most commonly employed in audio and multimedia processing within portable devices, including smartphones, digital audio players, personal media players, and similar consumer electronics. Its versatile design also supports deployment in wireless communication equipment and embedded systems where high-quality audio interface and codec functionality is required.

WM8753LGEB/RV Features

This specialized IC is a feature-rich device designed for advanced audio applications. It integrates a high-performance audio codec with stereo DACs and ADCs, supporting multiple sampling rates for both playback and recording. The device includes programmable audio filters, digital volume controls, and support for advanced sound processing such as 3D sound enhancement and bass boost. Power management features allow for low power operation in portable environments. The WM8753LGEB/RV also provides a versatile I²C/SPI control interface, making configuration flexible and adaptable in various system environments. Comprehensive pop and click suppression circuitry minimizes undesired transients during power-up and power-down cycles. Additional features include multiple analog and digital input/output options, microphone bias support, headphone and line-level drive capability, and on-chip PLLs (Phase Locked Loops) to support clock generation requirements for complex audio systems.

WM8753LGEB/RV Quality and Safety Features

The WM8753LGEB/RV is manufactured to stringent quality assurance standards and is fully RoHS compliant, guaranteeing the absence of hazardous substances. ESD (Electrostatic Discharge) protection is integrated into the design, ensuring robust performance in demanding operational environments. The thermal characteristics of the BGA-52 package further enhance reliability by dissipating heat effectively, thus protecting the device against thermal overstress.

WM8753LGEB/RV Compatibility

Designed for broad compatibility, the WM8753LGEB/RV interfaces seamlessly with a wide range of microcontrollers, DSPs, and system-on-chip (SoC) platforms. Its support for standard communication interfaces ensures straightforward integration into new or existing electronic systems, making it an excellent choice for both new product development and legacy product support.

WM8753LGEB/RV Datasheet PDF

For engineers, designers, and purchasing professionals seeking the most detailed and up-to-date technical information, our website hosts the most authoritative datasheet for the WM8753LGEB/RV product model. We strongly recommend that you download the official PDF datasheet directly from this page for comprehensive specifications, application guidelines, and configuration examples.

Quality Distributor

IC-Components is a premium distributor of Wolfson products, ensuring genuine, high-quality supply directly from authorized sources. With a robust inventory and responsive service, we are dedicated to exceeding customer expectations in both product quality and delivery speed. For the best prices and reliable stock availability, we encourage you to get a quote on our website—experience the advantages of sourcing from a trusted global leader in electronic components.

Frequently Asked Questions

What are the primary I/O voltage level compatibility considerations when integrating the WM8753LGEB/RV with microcontrollers operating at 1.8V or 2.5V logic levels, and what are the implications for signal integrity?
The WM8753LGEB/RV operates with a digital supply voltage (VDD) that typically ranges from 2.7V to 3.6V. When interfacing with microcontrollers at lower logic levels (1.8V or 2.5V), direct connection of digital I/O signals from the WM8753LGEB/RV to the microcontroller might lead to voltage mismatches. It is crucial to employ appropriate level-shifting circuitry, such as dedicated level shifters or MOSFET-based solutions, to ensure reliable communication and prevent potential damage to either the WM8753LGEB/RV or the microcontroller. Failing to do so can result in unreliable data transfer, increased bit error rates, and signal integrity issues, especially at higher clock frequencies. The WM8753LGEB/RV can handle these lower logic levels through proper interfacing; careful consideration of transition times and signal reflections due to impedance mismatches is essential for optimal performance.
Under what specific operating conditions, particularly concerning ambient temperature and humidity, should the WM8753LGEB/RV be deployed to ensure long-term reliability and prevent premature failure in industrial applications?
For industrial applications requiring long-term reliability, the WM8753LGEB/RV should ideally be operated within its specified ambient temperature range, typically -40°C to +85°C. Exceeding these limits, especially under continuous high load, can accelerate component aging and increase the risk of thermal runaway or performance degradation. While the datasheet may not explicitly detail humidity requirements, avoiding condensation and exposure to corrosive environments is paramount. Proper enclosure design with adequate ventilation and dehumidification, if necessary, will contribute significantly to the longevity of the WM8753LGEB/RV in challenging industrial settings.
How does the BGA-52 package of the WM8753LGEB/RV influence board layout, thermal management, and assembly processes compared to traditional leaded packages for high-density PCB designs?
The BGA-52 package of the WM8753LGEB/RV offers advantages in terms of density and reduced parasitic inductance, but it introduces specific challenges. Board layout requires careful consideration of trace routing beneath the package, and the use of blind or buried vias may be necessary. Thermal management is critical, as heat dissipation relies heavily on the solder balls and the PCB's thermal vias. Ensuring sufficient copper planes and thermal vias connected to the package ground are essential. From an assembly perspective, BGA components like the WM8753LGEB/RV require specialized reflow soldering profiles and precise solder paste application. Inspection of solder joint quality, often using X-ray, is also a standard practice for BGA components to ensure reliable connections.
When migrating from an older audio codec, such as a legacy TI PCMxxxx series, what are the critical design considerations and potential pitfalls in replacing it with the WM8753LGEB/RV, specifically regarding pin compatibility, power sequencing, and software driver development?
Migrating from a legacy audio codec to the WM8753LGEB/RV will likely involve significant design effort. Pin compatibility is rarely direct between different manufacturers and device families; expect a complete redesign of the PCB footprint and routing. Power sequencing is also crucial; the WM8753LGEB/RV may have specific power-up and power-down requirements that differ from the older part, necessitating changes to the power supply control circuitry. Software driver development will also be necessary, as the register maps and command structures for the WM8753LGEB/RV will be distinct. A thorough analysis of the WM8753LGEB/RV datasheet and reference designs is paramount before initiating a replacement project.
What are the limitations of the WM8753LGEB/RV in high-fidelity audio applications demanding ultra-low distortion and noise floors, and in which scenarios would it be considered a suboptimal choice compared to dedicated audiophile-grade DACs?
While the WM8753LGEB/RV is a capable audio codec, its specifications in terms of total harmonic distortion plus noise (THD+N) and dynamic range may not meet the stringent requirements of ultra-high-fidelity audio applications. For systems demanding audiophile-grade performance with noise floors below -110dB and THD+N below 0.005%, the WM8753LGEB/RV might be considered suboptimal. Applications where precise analog signal conditioning, extremely low jitter clocks, and advanced noise-shaping techniques are paramount, such as professional audio mastering or high-end home theater systems, might benefit from more specialized DAC ICs. The WM8753LGEB/RV is generally better suited for consumer audio products where cost, integration, and moderate performance are key.
What is the recommended configuration method for the WM8753LGEB/RV's audio interface (e.g., I2S, left-justified, right-justified) when interfacing with an FPGA or a DSP, and what are the implications of clock domain crossing for data integrity?
The WM8753LGEB/RV supports several standard audio interfaces, including I2S, left-justified, and right-justified. The choice of interface depends on the capabilities of the connected FPGA or DSP. I2S is a common and robust choice. Configuration is typically done via a serial control interface (e.g., I2C or SPI). When the WM8753LGEB/RV's digital interface is operating in a different clock domain than the FPGA or DSP, a robust clock domain crossing (CDC) strategy is essential to prevent data corruption. This typically involves using asynchronous FIFOs or synchronizer circuits to ensure data integrity during transfer between clocks. The WM8753LGEB/RV's internal PLL can often be used to synchronize its clock to the system, simplifying CDC.
If a design requires a higher channel count or more advanced audio processing capabilities than what the WM8753LGEB/RV offers, what are the alternative Wolfson or third-party audio codecs that provide a clear upgrade path, and what are the key trade-offs?
If the WM8753LGEB/RV does not meet the requirements for higher channel counts or advanced processing, Wolfson (now Cirrus Logic) offers a range of alternative audio codecs. For example, parts from the CSxxxx series often provide more channels, higher sample rates, and integrated DSP capabilities. When considering alternatives, key trade-offs include increased component cost, potentially higher power consumption, and more complex digital interfaces. The WM8753LGEB/RV offers a good balance of integration and performance for many consumer audio applications, so an upgrade path will likely involve sacrificing some of that simplicity for enhanced features. Always consult the manufacturer's product selection guides and datasheets for direct comparisons.
How critical is the impedance matching of the analog output stages of the WM8753LGEB/RV to the subsequent amplifier stages in terms of preventing signal reflections and maintaining audio fidelity, and what is the recommended output impedance?
While the WM8753LGEB/RV's analog output stages are designed to be relatively robust, proper impedance matching is still important for optimal audio fidelity, especially in sensitive designs. The datasheet typically specifies the output impedance. For the WM8753LGEB/RV, the output impedance is generally low, making it somewhat forgiving. However, to prevent signal reflections and ensure maximum power transfer, it's advisable to design the subsequent amplifier stages with an input impedance significantly higher than the WM8753LGEB/RV's output impedance. A common rule of thumb is a 10:1 ratio. Deviating significantly from this can lead to signal attenuation and potential ringing.
What are the considerations for power supply decoupling and filtering for the WM8753LGEB/RV, particularly to mitigate noise coupling from digital switching transients into the sensitive analog audio paths?
Effective power supply decoupling and filtering are critical for the WM8753LGEB/RV to maintain its audio performance and prevent digital noise from contaminating analog signals. Multiple bypass capacitors of varying values (e.g., 100nF ceramic and 10µF electrolytic) should be placed as close as possible to the power supply pins of the WM8753LGEB/RV. Additionally, a ferrite bead or low-pass filter on the analog power supply line can help attenuate high-frequency noise. Careful grounding and separation of analog and digital grounds are also essential. The WM8753LGEB/RV's datasheet will provide specific recommendations for capacitor values and placement.
In embedded systems where power management is a key concern, what are the different low-power or sleep modes available for the WM8753LGEB/RV, and what is the typical power consumption reduction achievable in these modes?
The WM8753LGEB/RV typically offers various power-saving modes, including standby and shutdown modes, to reduce power consumption in embedded systems. In standby mode, certain internal blocks may be powered down while maintaining configuration registers, allowing for quick wake-up. Shutdown mode provides the deepest power savings by disabling most of the IC. The specific power consumption reduction varies depending on the mode and the configuration, but significant savings, often down to microampere levels, can be achieved. The datasheet for the WM8753LGEB/RV will detail the specific current draw for each mode and the wake-up times, which are crucial for power-sensitive designs.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


WM8753LGEB/RV

WOLFSON

WM8753LGEB/RV Wolfson BGA-52

In Stock: 7930

Submit RFQ