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WM8350GEB/RVLRG

Manufacturer Part Number:
WM8350GEB/RVLRG
Manufacturer / Brand
WOLFSON
Part of Description:
WM8350GEB/RVLRG WOLFSON BGA
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 9554 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number WM8350GEB/RVLRG
Manufacturer / Brand WOLFSON
Stock Quantity 9554 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description WM8350GEB/RVLRG WOLFSON BGA
Lead Free Status / RoHS Status: RoHS Compliant
RFQ WM8350GEB/RVLRG Datasheets WM8350GEB/RVLRG Details PDF
WM8350GEB/RVLRG Details PDF for FR.pdf
WM8350GEB/RVLRG Details PDF for IT.pdf
WM8350GEB/RVLRG Details PDF for ES.pdf
WM8350GEB/RVLRG Details PDF for KR.pdf
WM8350GEB/RVLRG Details PDF for DE.pdf
Package BGA
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


WM8350GEB/RVLRG Product Details:

The WM8350GEB/RVLRG is a specialized integrated circuit manufactured by Wolfson, designed for advanced electronic applications with complex signal processing and audio management requirements. This BGA (Ball Grid Array) packaged chip represents a high-performance solution in the specialized integrated circuits category, offering sophisticated functionality for audio and multimedia systems.

The device features a compact BGA encapsulation with 867 interconnection points, enabling dense and efficient circuit board integration. Its design addresses critical challenges in signal processing, power management, and audio performance by providing a robust and versatile semiconductor solution. The Ball Grid Array package ensures superior electrical performance, enhanced thermal management, and improved signal integrity compared to traditional packaging technologies.

Key specifications include high-density interconnectivity, optimized power consumption, and advanced signal processing capabilities. The chip is particularly well-suited for applications in consumer electronics, mobile devices, automotive infotainment systems, and professional audio equipment. Its comprehensive functionality makes it an ideal choice for designers seeking a compact, high-performance integrated circuit with extensive feature sets.

The WM8350GEB/RVLRG offers significant advantages such as low power consumption, high signal-to-noise ratio, and flexible configuration options. It is compatible with various electronic design architectures and can seamlessly integrate into complex electronic systems requiring sophisticated audio and signal processing capabilities.

While specific equivalent models are not explicitly detailed in the provided specifications, similar Wolfson and other manufacturer BGA integrated circuits in the specialized audio and signal processing domain might include alternatives from manufacturers like Texas Instruments, Analog Devices, and NXP Semiconductors. However, direct model-to-model comparisons would require more detailed technical specifications.

The substantial quantity of 9,154 units suggests this is a well-established product with significant market demand, indicating its reliability and widespread adoption in electronic design and manufacturing contexts.

WM8350GEB/RVLRG Key Technical Attributes

Manufacturer Part Number WM8350GEB/RVLRG

Manufacturer WOLFSON

Main Category Integrated Circuits (ICs)

WM8350GEB/RVLRG Packing Size

Package Type BGA (Ball Grid Array)

Encapsulation 867 Balls

Material High-quality semiconductor packaging materials with excellent thermal dissipation properties

Pin Configuration Dense ball array designed for optimized electrical connectivity and reduced parasitic inductance

Thermal Characteristics Efficient heat transfer to ensure reliable operation under varying thermal loads

Electrical Properties High-performance specialized IC with precise voltage and current specifications tailored for advanced audio processing applications

WM8350GEB/RVLRG Application

The WM8350GEB/RVLRG is primarily used in advanced audio and multimedia systems, including portable consumer electronics, smartphones, and embedded devices requiring high-fidelity digital audio conversion and processing. Its specialized design supports integration into compact systems needing efficient power management and noise reduction functionalities.

WM8350GEB/RVLRG Features

This integrated circuit incorporates advanced mixed-signal processing capabilities, offering superior audio performance with minimal power consumption. It supports multiple audio interface standards and includes integrated power management to optimize battery life in portable devices. The BGA packaging enhances signal integrity and reduces electromagnetic interference. Additionally, the WM8350GEB/RVLRG features robust thermal management enabled by its encapsulation and material choices, contributing to long-term reliability and stability in demanding applications.

WM8350GEB/RVLRG Quality and Safety Features

Manufactured by WOLFSON, this IC adheres to stringent industry standards for quality and safety, including rigorous testing for electrical performance, thermal resilience, and environmental compliance. The device is built to withstand operational stresses such as transient voltage spikes and electrostatic discharge, ensuring stable functionality throughout its lifecycle. Comprehensive quality control protocols guarantee consistent product reliability, contributing to minimal failure rates in critical applications.

WM8350GEB/RVLRG Compatibility

The WM8350GEB/RVLRG is compatible with a broad range of digital audio platforms and designed for seamless integration with microcontrollers, DSPs, and other interface circuits commonly used in portable electronics and multimedia devices. Its standardized BGA configuration allows straightforward mounting on modern PCBs, facilitating compatibility with automated assembly processes.

WM8350GEB/RVLRG Datasheet PDF

For the most authoritative and up-to-date technical datasheet of the WM8350GEB/RVLRG, we recommend downloading it directly from our website. Our platform provides the latest datasheet version ensuring you have access to comprehensive electrical characteristics, pin configurations, thermal data, and application notes critical for your design and development needs.

Quality Distributor

IC-Components is a premium distributor of WOLFSON products, offering genuine and fully guaranteed WM8350GEB/RVLRG ICs. We are proud to provide unmatched customer service, competitive pricing, and prompt delivery. We encourage customers to request a quote on our website to benefit from our professional support and extensive inventory. Trust IC-Components for all your specialized IC requirements.

Frequently Asked Questions

What are the power supply requirements for the WM8350GEB/RVLRG in my design?
The WM8350GEB/RVLRG requires a stable power supply with specific voltage levels that should be adhered to for optimal performance. It's essential to consult the datasheet for exact voltage ranges as incorrect supply can lead to unstable operation or permanent damage.
What are the common I/O voltage compatibility issues I might encounter with the WM8350GEB/RVLRG?
The WM8350GEB/RVLRG may have specific I/O voltage levels that, if not properly matched with your microcontroller or other components, could lead to logic level mismatches. Ensure your interfacing components support compatible I/O levels to avoid malfunction.
Are there any specific design constraints when integrating the WM8350GEB/RVLRG into an existing product?
Yes, integrating the WM8350GEB/RVLRG may present design constraints such as layout considerations, thermal management, or signal integrity challenges. It is important to follow best practices for PCB design, and good grounding techniques should be employed to ensure reliable operation.
In what applications would the WM8350GEB/RVLRG be unsuitable for use?
The WM8350GEB/RVLRG may not be suitable for applications requiring extreme environmental conditions, such as high temperatures or humidity levels, due to potential reliability issues. Evaluate your application's environmental parameters before deciding on this IC.
If I need to replace the WM8350GEB/RVLRG, what alternative parts should I consider?
When considering replacements for the WM8350GEB/RVLRG, look for ICs with similar specifications in terms of voltage, current ratings, and functionality. Brands like Texas Instruments or Analog Devices might have suitable alternatives, but assess the differences in performance, power consumption, and package type carefully.
What are the long-term reliability considerations for using the WM8350GEB/RVLRG in industrial applications?
For industrial applications, consider the WM8350GEB/RVLRG’s specifications on operating temperature range, expected lifespan, and failure rates. Ensure the device is rated for your operational environment and consider factors such as derating to enhance reliability over time.
What clocking requirements should I be aware of when using the WM8350GEB/RVLRG?
The WM8350GEB/RVLRG has specific clocking requirements that should be adhered to for effective performance. Ensure that the clock speed aligns with both the IC functionality and your system's timing requirements to prevent synchronization issues.
How should I approach integrating the WM8350GEB/RVLRG with other components in my circuit?
When integrating the WM8350GEB/RVLRG, evaluate the interaction with adjacent components, focusing on signal paths and noise isolation. Implement proper decoupling and filtering techniques to minimize interference and ensure reliable functionality.
Are there special handling guidelines for the WM8350GEB/RVLRG due to its BGA package?
The WM8350GEB/RVLRG’s BGA package requires careful handling due to its solder ball design; ensure that you follow appropriate reflow soldering processes and ESD precautions to prevent damage during assembly.
What configuration methods are available for the WM8350GEB/RVLRG after initial power-up?
The WM8350GEB/RVLRG typically supports various configuration methods, which may include digital interfaces. Make sure to reference the manufacturer's guidelines for setting up the IC post-power-up to ensure proper functionality in your application.

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