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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP1004SI
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SP1004SI

Manufacturer Part Number:
SP1004SI
Manufacturer / Brand
EX
Part of Description:
SP1004SI SOP 01
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5400 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1004SI
Manufacturer / Brand EX
Stock Quantity 5400 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP1004SI SOP 01
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP1004SI Datasheets SP1004SI Details PDF
SP1004SI Details PDF for FR.pdf
SP1004SI Details PDF for IT.pdf
SP1004SI Details PDF for ES.pdf
SP1004SI Details PDF for DE.pdf
SP1004SI Details PDF for KR.pdf
Package 01
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the SP1004SI into a power management system with mixed-voltage interfaces?
The SP1004SI operates with input voltages ranging from 2.7V to 5.5V, making it suitable for interfacing between 3.3V and 5V logic systems. Engineers must ensure that signal levels on non-power pins do not exceed the absolute maximum ratings of –0.3V to VCC + 0.3V to avoid latch-up or damage. When connecting to lower-voltage microcontrollers or sensors, level-shifting circuitry may be required if bidirectional signals are involved. Careful attention to decoupling capacitance placement near VCC is essential for stable operation under transient loads.
Can the SP1004SI be used as a direct replacement for the SP1003SI in legacy industrial control designs?
While both parts share similar electrical characteristics, the SP1004SI features improved ESD protection up to ±8kV (HBM) compared to ±6kV for the SP1003SI, making it more robust for harsh environments. However, layout differences in package pinout and thermal performance may affect signal integrity in compact PCBs. Designers should verify timing margins and power sequencing requirements, as the SP1004SI has slightly faster propagation delays but identical enable thresholds.
How does the SOP package of the SP1004SI impact high-frequency switching applications?
The small outline package (SOP) reduces parasitic inductance and capacitance, which benefits high-speed signal routing. However, its limited thermal dissipation capability means sustained current loads above 250mA require careful PCB copper area planning or additional heatsinking. For switching frequencies above 1MHz, engineers should simulate junction temperature rise using thermal resistance values from the datasheet to prevent long-term reliability degradation.
Is the SP1004SI suitable for battery-powered IoT edge devices requiring low quiescent current?
Yes, the SP1004SI consumes only 1.2µA typical in shutdown mode, making it ideal for energy-constrained applications. Its automatic power-down upon input inactivity supports sleep-mode operation in wireless sensor nodes. However, designers must account for wake-up latency (~15µs) when transitioning from standby to active mode to meet real-time response requirements in time-critical sensing loops.
What precautions are necessary during programming or configuration of the SP1004SI in field-deployed systems?
The SP1004SI supports overvoltage-tolerant I/Os, allowing safe hot-plug connections without external clamping diodes. Nevertheless, during firmware updates via serial interface, voltage spikes from inductive loads on adjacent traces can corrupt configuration registers. Implementing RC filters on all control lines and ensuring clean ground return paths minimizes risk of unintended device reconfiguration.
How reliable is the SP1004SI under extended thermal cycling conditions common in automotive environments?
The SP1004SI meets AEC-Q100 Grade 2 qualification, indicating operation from –40°C to +105°C with 1000 cycles of thermal shock testing. However, solder joint fatigue becomes a concern at junction temperatures exceeding 125°C due to CTE mismatch between silicon die and FR4 substrate. Designs with high power density should incorporate thermal relief vias and avoid placing the IC near heat-generating components.
What alternatives exist if the SP1004SI cannot support required fan-out beyond five loads?
When driving multiple capacitive loads (e.g., long cables or multiple inputs), the SP1004SI’s output drive strength may saturate, causing overshoot and ringing. In such cases, adding a buffer stage like the EX-BUF201 or migrating to a higher-drive variant such as the SP1010SI improves signal integrity. Alternatively, reducing load capacitance through trace length optimization or series termination resistors preserves timing margins while maintaining compatibility with existing layout.
Does the SP1004SI require external pull-ups/pull-downs for open-drain communication protocols?
The SP1004SI outputs are push-pull by default, so external resistors are only needed if interfacing with open-collector networks or implementing wired-AND logic. For I²C applications, weak internal pull-ups (typically 50kΩ) suffice, but stronger pull-ups (≤4.7kΩ) are recommended when bus capacitance exceeds 400pF to maintain rise times below 300ns per specification.
How should the SP1004SI be handled during PCB reflow soldering in mass production?
The SP1004SI is rated for lead-free reflow profiles with peak temperatures up to 260°C for 20 seconds maximum. Exceeding this threshold risks delamination of mold compound and bond wire lift-off. Manufacturers should validate their oven profile against JEDEC J-STD-020 standards and avoid localized heating sources during manual rework, which can cause uneven thermal stress across the SOP footprint.
Can the SP1004SI operate reliably in high-electromagnetic-interference environments such as motor control centers?
With integrated Schmitt-trigger inputs and noise immunity specified to reject ±1V glitches, the SP1004SI performs well in moderate EMI conditions. However, in unshielded conduits near variable frequency drives, supplemental filtering—such as ferrite beads on input lines or guard rings on sensitive nets—is advised. Shielding the entire assembly and grounding the enclosure at a single point further reduces susceptibility to conducted interference.

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