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Home > Products > Connectors, Interconnects > Sockets for ICs, Transistors - IC Sockets > 10-8828-210C
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10-8828-210C

Manufacturer Part Number:
10-8828-210C
Manufacturer / Brand
Aries Electronics
Part of Description:
CONN IC DIP SOCKET 10POS GOLD
Datasheets:
10-8828-210C(1).pdf10-8828-210C(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 32213 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 10-8828-210C
Manufacturer / Brand Aries Electronics
Stock Quantity 32213 pcs Stock
Category Connectors, Interconnects > Sockets for ICs, Transistors - IC Sockets
Description CONN IC DIP SOCKET 10POS GOLD
Lead Free Status / RoHS Status: ROHS3 Compliant
Type DIP, 0.2' (5.08mm) Row Spacing
Termination Post Length 0.140' (3.56mm)
Termination Solder
Series 8
Pitch - Post 0.100' (2.54mm)
Pitch - Mating 0.100' (2.54mm)
Package Bulk
Operating Temperature -55°C ~ 105°C
Number of Positions or Pins (Grid) 10 (2 x 5)
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Features Closed Frame, Elevated
Current Rating (Amps) 3 A
Contact Resistance -
Contact Material - Post Brass
Contact Material - Mating Beryllium Copper
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Base Product Number 10-8828

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can 10-8828-210C be used for a 10-pin DIP device on an existing PCB footprint?
10-8828-210C fits best when the PCB is already laid out for a 10-position, 2 x 5 through-hole socket with 0.1" pin pitch and 0.2" row spacing. It is not a substitute for a standard 0.3" wide DIP footprint. Before committing to 10-8828-210C, check the board-to-board clearance, nearby component height, and whether the inserted IC body will clear the elevated socket profile.
Is 10-8828-210C better for prototyping, or can it be used in production hardware too?
10-8828-210C works well in production when the IC may need replacement, calibration, or field upgrades. In fixed designs where the device will never be removed, a direct-solder approach can reduce mechanical interfaces. With 10-8828-210C, the trade-off is serviceability versus an additional contact interface, so it is a good fit when rework access, burn-in, or device swapping is part of the workflow.
Can 10-8828-210C handle power pins, or should I avoid using it for higher-current loads?
10-8828-210C can be used on circuits that draw moderate current, but the actual margin depends on how many contacts are loaded, the ambient temperature, and whether the current is continuous or pulsed. If the socket is carrying power rails, check the temperature rise at the contacts, the copper trace width, and any downstream connector heating. If the design is close to its current limit, a direct solder connection or a different power-rated interconnect may be a better fit.
Is 10-8828-210C suitable for low-level analog, sensor, or precision reference signals?
10-8828-210C can be used for sensitive circuits because the gold contact interface helps keep contact variation low, but any socket adds an extra electrical junction. For high-impedance inputs, microvolt-level sensors, or precision references, validate offset, leakage, and noise in the actual assembly. If the measurement chain is highly sensitive to contact resistance drift or intermittent connection, socketing the device may change behavior enough to matter in calibration.
How reliable is 10-8828-210C for repeated IC swapping during development or maintenance?
10-8828-210C is intended for repeated insertion and removal, especially when the device is expected to be serviced or evaluated in multiple boards. Real-world cycle life depends on lead condition, insertion alignment, and contamination on the IC pins. To preserve contact quality, insert the device straight, avoid prying on one side, and keep the leads clean and properly formed. If the part will be swapped very often, periodic inspection of the socket contacts is a practical maintenance step.
What should I verify before replacing another socket with 10-8828-210C?
When replacing a different socket with 10-8828-210C, confirm the mechanical details beyond pin count: row spacing, body height, post length, solder tail style, and how much clearance the elevated body leaves under or around the IC. A socket from another brand may look similar but still differ enough to affect board fit, fixture clearance, or solder process behavior. If the old design used a lower-profile or open-frame style, 10-8828-210C may require a footprint or mechanical review before it becomes a true drop-in replacement.
Is 10-8828-210C a good choice for industrial equipment exposed to vibration or thermal cycling?
10-8828-210C can be used in serviceable industrial assemblies, but vibration and temperature changes can move the contact interface over time. The closed-frame design helps guide the IC leads, yet the board should be supported so the socket area is not flexed during operation or maintenance. For equipment that sees repeated shock, heavy vibration, or frequent thermal swings, designers often compare 10-8828-210C against direct soldering or a mechanically locked interconnect depending on the service strategy.
What PCB assembly details matter when soldering 10-8828-210C?
10-8828-210C is a through-hole socket, so hole size, plating quality, and solder fillet formation drive the assembly result. The PCB should provide clean annular rings and enough hole tolerance for straight insertion without forcing the pins. During wave or hand soldering, avoid overheating the housing and keep solder wicking under control so the post joints stay consistent. On dense boards, also check that the elevated socket body does not create shadowing or access issues for nearby parts and test probes.
When should I choose a different part instead of 10-8828-210C?
Choose another part if the target device is not a 10-pin DIP, if the PCB uses a different row spacing, or if the assembly method is surface mount rather than through-hole. 10-8828-210C is also not the best match when the design needs a very low profile, a latching retention system, or a connector optimized for severe mechanical stress. If the board geometry stays the same but the mounting style changes, compare the Aries 10-8828 family against the other socket style that matches your height and retention requirements.
Does 10-8828-210C need special storage or handling before assembly in long-term industrial use?
10-8828-210C is MSL 1, so it does not require moisture-sensitive dry-pack handling, but it still benefits from clean, dry storage to protect the contact surfaces and solder tails. Contamination from dust, oils, or corrosive atmospheres can affect contact behavior more than humidity absorption. For long-term field use, store the sockets in a way that avoids bent leads and package deformation, and keep the mating IC pins clean so the gold contact interface in 10-8828-210C can seat consistently after installation.

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10-8828-210C

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