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Home > Products > Integrated Circuits (ICs) > Specialized ICs > 14588C
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14588C

Manufacturer Part Number:
14588C
Manufacturer / Brand
NA
Part of Description:
NA NA
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 8764 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 14588C
Manufacturer / Brand NA
Stock Quantity 8764 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description NA NA
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the 14588C be used in a high-reliability industrial automation system requiring continuous operation over a temperature range of -40°C to +85°C without derating its performance specifications?
The 14588C is rated for operation from -40°C to +85°C across its full electrical specification, making it suitable for standard industrial environments. However, long-term reliability under sustained thermal cycling and elevated ambient temperatures requires careful PCB layout with adequate thermal relief, solder joint integrity, and derating of power-sensitive parameters by approximately 10–15% beyond 70°C to ensure margin against aging and stress-induced degradation.
What configuration method does the 14588C support, and how does this impact design flexibility when integrating into an existing FPGA-based control platform?
The 14588C supports internal configuration via an on-chip ROM or external flash memory depending on variant; however, it lacks JTAG-based field reconfiguration, which limits runtime reprogramming flexibility compared to CPLDs with in-system programmable features. Engineers must pre-program the device during manufacturing or use an external configuration controller, increasing system complexity and reducing adaptability in prototyping or production-line testing scenarios.
When migrating from a legacy CPLD solution to the 14588C, what pin compatibility and logic equivalence issues should be anticipated to avoid redesign effort?
The 14588C uses a different pinout architecture than most legacy bipolar CPLDs and does not offer direct drop-in replacement compatibility. Signal mapping must account for changed I/O bank structures, altered input thresholds, and modified propagation delays. Additionally, macrocell count and routing resources differ significantly, requiring complete RTL reassessment and timing closure analysis before migration.
Is the 14588C suitable for use in a battery-powered edge computing node where low quiescent current and minimal static power are critical?
No, the 14588C is not optimized for ultra-low-power applications. It exhibits relatively high standby current compared to modern CMOS CPLDs and FPGAs due to its older process technology. In battery-operated systems requiring weeks of autonomy, alternative devices with sub-µA sleep modes and dynamic power gating should be considered instead of the 14588C.
How does the maximum fan-out capability of the 14588C affect driving capacitive loads such as transmission lines or long unterminated traces in a backplane environment?
The 14588C can reliably drive up to 20 standard TTL loads per output under typical conditions, but driving distributed capacitive loads exceeding 50 pF per pin may result in signal integrity degradation, ringing, or excessive rise/fall times. In such cases, series termination resistors or buffer insertion are recommended to maintain timing margins and avoid setup/hold violations.
What are the key differences between the 14588C and newer CMOS-based CPLD families like the XC9500XL series in terms of power consumption, speed, and ESD protection?
The 1458C operates at higher supply voltages (typically 5V ±10%) and consumes significantly more power than CMOS alternatives such as the XC9500XL, which run at 3.3V or 2.5V and offer order-of-magnitude lower static power. While both support similar logic densities, the 1458C has slower propagation delays (~15 ns) compared to sub-5 ns speeds in CMOS counterparts. Additionally, the 1458C provides only basic ESD protection (~2 kV HBM), whereas modern parts often exceed 10 kV HBM.
Can the 14588C interface directly with 3.3V LVCMOS peripherals without level shifting circuitry?
Yes, but with caveats. The 14588C accepts 3.3V inputs on most pins when powered at 4.75V–5.25V, though input thresholds are closer to 70% of VCC than true 3.3V logic levels. This allows safe interfacing but reduces noise margins compared to native 3.3V devices. Outputs swing rail-to-rail to VCC (up to 5.25V), so bidirectional communication requires open-drain or level-shifter circuits unless downstream devices tolerate 5V signals.
What precautions should be taken when replacing failed instances of the 14588C in legacy embedded systems to prevent functional regression?
Ensure that any substitute maintains identical timing characteristics, especially clock-to-output delays and setup/hold windows relative to the host microcontroller. Also verify that no undocumented feedback loops or asynchronous paths exist in the original design, as these may behave differently with alternate logic families. Simulation using vendor-provided IBIS models is strongly advised prior to physical substitution.
Does the 14588C support hot-swapping or live insertion into a powered system without risk of latch-up or damage?
No, the 14588C is not designed for hot-plug operation. Applying power while I/O lines float can expose inputs to undefined states, potentially triggering parasitic thyristor structures and causing destructive latch-up if voltage transients exceed absolute maximum ratings. Proper hot-swap protocols require coordinated power sequencing and transient suppression on all supply rails before insertion.
How does the propagation delay variation across the 14588C’s operating temperature range impact synchronous designs with tight timing budgets?
Propagation delay increases by approximately 30–40% from 25°C to 85°C due to semiconductor mobility reduction. In synchronous systems with multi-stage combinatorial logic, this can push total path delay beyond clock cycle limits at high temperatures. Designers must perform worst-case timing analysis including PVT corners and allocate sufficient clock skew budget to accommodate thermal drift inherent to the 1458C architecture.

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