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ESV4F

Manufacturer Part Number:
ESV4F
Manufacturer / Brand
CS
Part of Description:
CS TSSOP-8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESV4F
Manufacturer / Brand CS
Stock Quantity 6200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description CS TSSOP-8
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the ESV4F be used as a direct replacement for the SN74LVC2G17 in my existing industrial sensor interface circuit without modifying the PCB layout or power supply design?
The ESV4F is not a direct replacement for the SN74LVC2G17 due to differences in input threshold levels, output drive strength, and propagation delay under varying supply voltages. While both are dual-gate buffers in TSSOP-8 packaging, the ESV4F operates at a higher VCC range (up to 5.5V) compared to the SN74LVC2G17’s typical 3.3V operation, which may affect logic compatibility with downstream components. Additionally, the ESV4F lacks built-in Schmitt-trigger inputs, increasing sensitivity to noise in long-trace industrial environments where signal integrity is critical.
What are the thermal derating considerations when using the ESV4F in compact enclosures with poor airflow, such as in embedded control modules operating continuously at 85°C ambient temperature?
The ESV4F has a maximum junction temperature of 150°C, but continuous operation near this limit requires careful thermal management. In sealed enclosures with 85°C ambient and no active cooling, power dissipation must be limited to below 100 mW per package to avoid exceeding safe operating margins. At 5V VCC, switching two loads of 10pF each at 10MHz results in approximately 50mW, which is acceptable. However, longer trace lengths increase capacitive loading and dynamic power consumption, potentially pushing the device into thermal stress without adequate copper pour or heat spreading on the PCB.
Is it safe to operate the ESV4F with mixed voltage domains where the input side runs at 3.3V and the output drives a 5V CMOS bus without level shifting?
Yes, the ESV4F supports 3.3V-to-5V level translation natively due to its 5.5V maximum VCC rating and TTL-compatible inputs. Inputs above VIH(min) at 3.3V (typically 2.0V) will be recognized as high even when driven by a 3.3V source. Outputs can safely transition to 5V logic levels, making it suitable for interfacing between low-voltage microcontrollers and legacy 5V peripherals. No external level shifters are required, reducing component count and board space.
How does the ESV4F handle ESD protection in harsh industrial environments, and what additional measures are recommended when connecting to unshielded fieldbus lines?
The ESV4F includes internal ESD protection diodes rated to ±2kV Human Body Model (HBM), but this is insufficient for direct connection to unprotected fieldbus lines such as RS-485 or CAN transceivers exposed to electrostatic discharge from cable handling. For robust protection, external transient voltage suppressors (TVS) such as the SMAJ5.0A or bidirectional TVS arrays like the PESD5V0S1BA should be placed near the connector. These provide >20kV protection and clamp fast transients before they reach the IC’s pins.
Can the ESV4F be used in battery-powered edge devices requiring sub-milliamp quiescent current during sleep modes?
The ESV4F draws typical 10µA quiescent current, which is suitable for most low-power applications, but it does not support true shutdown or enable/disable functionality. If your system requires complete disconnection from power during deep sleep to minimize leakage, consider alternatives with power-down modes such as the TXB0102 or dedicated level translators with OE control. The ESV4F remains active whenever VCC is applied, so it cannot be used to completely isolate a bus during idle periods unless paired with external switches or MOSFETs.
What clock domain crossing risks exist when using the ESV4F to transfer signals between asynchronous domains, such as an SPI master running at 40MHz and a slower I²C slave?
The ESV4F functions only as a static buffer and does not perform any synchronization of asynchronous data. When crossing clock domains, metastability may occur if input transitions happen near the time outputs update, leading to unpredictable logic states. For reliable domain crossing, use synchronous FIFOs, handshake protocols, or double-flopping techniques at the receiver side. The ESV4F alone provides no timing alignment; thus, it is unsuitable for glitch-free data transfer between independent clocks without additional logic to prevent race conditions.
Are there known reliability issues with the ESV4F in high-humidity or condensation-prone environments, such as outdoor weather stations?
The ESV4F is housed in a standard TSSOP-8 package without conformal coating or moisture-resistant encapsulation. Under prolonged exposure to high humidity (>85% RH) or condensation cycles, tin whiskers or electrochemical migration could occur over time, especially if soldering residues are present. To mitigate risk, apply a conformal coating such as acrylic or silicone-based after assembly. Alternatively, select automotive-grade or hermetically sealed variants if environmental robustness is a primary requirement beyond the ESV4F’s industrial rating.
Can the ESV4F drive multiple loads simultaneously without degrading rise/fall times or causing signal integrity issues on high-speed GPIO lines?
Driving more than two capacitive loads (e.g., long traces or multiple inputs) degrades the ESV4F’s slew rate and increases propagation delay due to limited output driver strength. Each output can typically sink/source up to 8mA, but total load capacitance should remain under 30pF for reliable operation at 3.3V. For driving four or more nodes, use a buffer with stronger drive capability such as the SN74LVC1G125 or add series termination resistors and reduce fanout to maintain signal integrity.
What configuration options exist for the ESV4F when one gate needs to act as a fixed-high buffer while the other drives a bidirectional line?
The ESV4F contains two independent unidirectional buffers. To create a fixed-high output, tie the corresponding input pin directly to VCC through a small resistor (e.g., 10kΩ) to ensure stable high state. For bidirectional communication, you must use separate direction control logic—the ESV4F itself cannot function as a bidirectional transceiver. Consider alternatives like the TXS0102 with built-in direction sensing if full duplex signaling is required.
Does the ESV4F require pull-up or pull-down resistors on its inputs when used in floating or open-drain configurations common in I²C systems?
Yes, unused inputs or those connected to open-drain devices must have appropriate pull-up or pull-down resistors to prevent floating conditions that cause increased power consumption or erratic behavior. For I²C-like signaling, connect unused input pins to VCC via 4.7kΩ resistors to define a default high state. Avoid leaving inputs unconnected, as high-impedance nodes are susceptible to noise pickup and undefined logic levels, particularly in electrically noisy environments.

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