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Home > Products > Connectors, Interconnects > Backplane Connectors - Hard Metric, Standard > HM2S30PE51N0N9LF
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HM2S30PE51N0N9LF

In Stock 7995 pcs Reference Price(In US Dollars)
896+
$4.7643
Manufacturer Part Number:
HM2S30PE51N0N9LF
Manufacturer / Brand
Amphenol ICC (FCI)
Part of Description:
5R STR REC TYPC 0.76UGXT
Datasheets:
HM2S30PE51N0N9LF(1).pdfHM2S30PE51N0N9LF(2).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7995 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number HM2S30PE51N0N9LF
Manufacturer / Brand Amphenol ICC (FCI)
Stock Quantity 7995 pcs Stock
Category Connectors, Interconnects > Backplane Connectors - Hard Metric, Standard
Description 5R STR REC TYPC 0.76UGXT
Lead Free Status / RoHS Status: RoHS Compliant
Voltage Rating 750Vrms
Termination Press-Fit
Series Millipacs®
Pitch 0.079" (2.00mm)
Package Tray
Operating Temperature -55°C ~ 125°C
Number of Rows 5
Number of Positions Loaded All
Number of Positions 55
Mounting Type Through Hole
Features -
Current Rating (Amps) 1.5 A
Contact Finish Thickness -
Contact Finish Gold
Connector Usage -
Connector Type Receptacle, Female Sockets
Connector Style C 11
Base Product Number HM2S30

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

For HM2S30PE51N0N9LF, what board stack-up and mating geometry checks should I do before committing to a backplane design?
HM2S30PE51N0N9LF is a 55-position Millipacs receptacle with a 2.00 mm pitch and 5-row layout, so the main checks are connector-to-card alignment, backplane spacing, and coplanarity across the full array. In practice, the plated-through-hole pattern, board thickness, and mating tolerances should be validated together because press-fit receptacles can build insertion stress if hole quality or positional accuracy is off.
Can HM2S30PE51N0N9LF be used for signal and power on the same backplane, and what limits should I watch?
HM2S30PE51N0N9LF can be used in mixed-signal backplane designs, but the 1.5 A contact rating means current sharing and pin assignment need to be planned carefully if the same connector carries power. For higher-load rails, designers usually parallel contacts or move bulk power to a different interconnect while reserving HM2S30PE51N0N9LF for lower-current signal distribution.
Is HM2S30PE51N0N9LF suitable for high-voltage or isolated industrial interfaces?
HM2S30PE51N0N9LF is rated at 750 Vrms, which supports many isolated signal and control applications, but the final suitability still depends on creepage, clearance, pollution degree, and the system’s insulation requirements. If the application involves reinforced insulation, extended exposure to contamination, or surge-heavy environments, the connector spacing on the PCB and the full end-system qualification should be checked rather than relying on the connector rating alone.
What are the practical reasons to choose the press-fit version of HM2S30PE51N0N9LF instead of a soldered backplane connector?
HM2S30PE51N0N9LF uses press-fit termination, which is often selected when the assembly process favors high-throughput insertion and when long-term mechanical retention on thick backplanes matters. The trade-off is tighter control over plated-hole dimensions, board finish, and insertion equipment, so it is a better fit when the PCB fabrication and assembly flow can consistently support press-fit tolerances.
If I am replacing a different Amphenol ICC (FCI) backplane connector, what should I compare against HM2S30PE51N0N9LF?
When replacing with HM2S30PE51N0N9LF, compare the exact footprint, loaded positions, row count, mating height, and termination style against the existing part, not just the series name. Even within Millipacs, small differences in connector style or keying can change board layout, panel clearance, and mating compatibility, so the migration should be validated against the mechanical drawing and the mate-side part number.
Can HM2S30PE51N0N9LF be used as a drop-in replacement for other 55-position Millipacs receptacles?
HM2S30PE51N0N9LF may be mechanically close to other 55-position Millipacs receptacles, but “drop-in” should only be assumed after checking the exact part geometry and contact arrangement. In backplane designs, differences in press-fit tail geometry, standoff features, or mating style can affect insertion force, retention, and alignment even when the circuit count looks identical.
How does HM2S30PE51N0N9LF hold up in industrial temperature ranges and long-life systems?
HM2S30PE51N0N9LF is specified for -55°C to 125°C, which aligns with demanding industrial and embedded environments. For long-life systems, the practical follow-up is to validate thermal cycling, vibration, and oxidation behavior at the board level, since connector reliability also depends on hole integrity, backplane stiffness, and the mating cycle profile.
What contact-plating considerations matter when using HM2S30PE51N0N9LF in a system that may see low-level signals?
HM2S30PE51N0N9LF uses gold contact finish, which is commonly selected for stable low-level contact behavior and better corrosion resistance than tin in many signal applications. For low-voltage or low-current signals, the more relevant checks are fretting risk, mating cycle count, and contamination control, because those factors can influence contact resistance over time.
Is HM2S30PE51N0N9LF a good choice if I need frequent field replacement or module swapping?
HM2S30PE51N0N9LF can fit serviceable backplane architectures, but the press-fit termination changes the repair strategy because extraction and reinsertion are not the same as with a soldered part. If field replacement is expected, the backplane hole design, repair tooling, and allowable service procedures should be defined early so the connector can be removed without damaging the plated barrel or neighboring interconnects.
What are the main design risks when integrating HM2S30PE51N0N9LF into a dense backplane with adjacent connectors?
With HM2S30PE51N0N9LF, the usual risks are connector-to-connector spacing, board flex during insertion, and local stress around the press-fit zone. Dense layouts should be checked for tool access, mating travel, and any interference from adjacent components, because mechanical stacking issues often appear before electrical limits do.
When would HM2S30PE51N0N9LF not be the right connector for a project?
HM2S30PE51N0N9LF is less appropriate when the design needs high-current distribution, very small board area, or a simple cable-to-board interface rather than a backplane receptacle. It is also a weaker fit if the assembly line cannot support press-fit processing or if the application needs a connector family with a different mating profile, pin density, or retention method.
What should I verify before qualifying HM2S30PE51N0N9LF for production use in a harsh environment?
Before releasing HM2S30PE51N0N9LF into production, verify press-fit hole quality, insertion force, mating alignment, vibration behavior, and thermal cycling performance on the actual PCB stack-up. In harsh environments, those tests usually reveal more about real-world reliability than the catalog ratings alone, especially for backplane connectors exposed to repeated mechanical stress.

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HM2S30PE51N0N9LF

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5R STR REC TYPC 0.76UGXT

In Stock: 7995

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