| Part Number | 2036100008 |
|---|---|
| Manufacturer / Brand | Molex |
| Stock Quantity | 38590 pcs Stock |
| Category | Uncategorized > Unclassified |
| Description | 2036100008 |
| Lead Free Status / RoHS Status: | RoHS Compliant |
| Series | * |
| Package | Bulk |
| Base Product Number | 203610 |
| Part Number | 2036100008 |
|---|---|
| Manufacturer / Brand | Molex |
| Stock Quantity | 38590 pcs Stock |
| Category | Uncategorized > Unclassified |
| Description | 2036100008 |
| Lead Free Status / RoHS Status: | RoHS Compliant |
| Series | * |
| Package | Bulk |
| Base Product Number | 203610 |


| Shipment charges: | (Reference DHL and FedEX) |
|---|---|
| Weight(KG): 0.00kg-1.00kg | Price(USD$) : USD$60.00 |
| Weight(KG): 1.00kg-2.00kg | Price(USD$) : USD$80.00 |

| Payment For Telegraphic Transfers: | |
|---|---|
| Company Name : IC COMPONENTS LTD | Beneficiary Account Number : 549-100669-701 |
| Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd | Beneficiary Bank Code : 382 (for local payment) |
| Beneficiary Bank SWIFT : COMMHKHK | |
| Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong | |
As demand for high-speed transmission in AI data centers continues to rise, TSMC is accelerating the commercialization of co-packaged optics (CPO) tec...
TSMC recently held its Technology Symposium in Taiwan. According to Reuters, the company said demand for AI accelerator wafers is expected to increase...
According to South Korean media outlet ETNews, Samsung Electronics’ Device Solutions (DS) division is discussing plans to resume research and facilit...
Industry rumors suggest that Apple could become an early adopter of Intel’s 18A-P process technology, potentially using it for future M-series chips....
Japanese chemical maker JSR, which accounts for roughly one-fifth of the global photoresist market, plans to build its first production facility in Ta...
On April 30, Samsung Electronics reported its financial results for the first quarter of 2026, ended March 31. The company posted consolidated revenue...
According to sources, TSMC’s 3nm fabs in Taiwan were originally expected to reach a monthly capacity of 150,000 wafers by the end of 2026. That figur...
Leading foundry company TSMC showcased its latest innovations in the cutting-edge A13 process technology at its 2026 North America Technology Symposiu...
According to a recent report by Korean media outlet ETNews, Samsung Electro-Mechanics and LG Innotek are accelerating their efforts in co-packaged opt...
According to people familiar with the matter, OpenAI has agreed to pay more than $20 billion over the next three years to use servers powered by chips...
According to Commercial Times, TSMC began delivering equipment to its R&D teams in February for its CoPoS (Chip-on-Panel-on-Substrate) pilot productio...
On April 9, Hanmi Semiconductor officially announced plans to unveil a prototype of its second-generation hybrid bonding machine for next-generation h...
No account yet? Register now
Molex

