Choose your country or region.

Image may be representation.
See specs for product details.

1510300011

Manufacturer Part Number:
1510300011
Manufacturer / Brand
MOLEX
Part of Description:
648
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number 1510300011
Manufacturer / Brand MOLEX
Stock Quantity 5200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 648
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


1510300011 Product Details:

The 1510300011 from MOLEX represents a specialized socket solution designed for SOT23-6 package devices, enabling efficient prototyping, testing, and field replacement scenarios in compact electronic assemblies. This DIP-format socket provides a reliable mechanical and electrical interface for surface-mount SOT23-6 components, bridging the gap between SMT device footprints and traditional through-hole board layouts.

The socket architecture accommodates the standard SOT23-6 pinout configuration, supporting a wide range of small-signal semiconductors including dual MOSFETs, operational amplifiers, voltage regulators, and analog switches commonly packaged in this industry-standard form factor. The DIP package style allows direct insertion into breadboards, prototyping systems, and standard IC sockets, facilitating rapid circuit development without requiring specialized SMT assembly equipment or reflow processes.

Contact geometry within the 1510300011 maintains consistent electrical performance across the specified pin count, with spring-loaded or leaf-spring contact elements ensuring reliable signal integrity for low-frequency analog and digital applications. The socket's mechanical design provides secure component retention during handling and testing while allowing straightforward device insertion and removal, supporting iterative design validation and component evaluation workflows.

This socket configuration proves particularly valuable in development environments where multiple device variants require evaluation, or in production test fixtures where automated or manual device cycling occurs. The through-hole mounting approach simplifies integration into test jigs and development boards, while the SOT23-6 compatibility addresses one of the most prevalent small-outline package formats in modern mixed-signal and power management designs.

With active production status and current inventory availability, the 1510300011 serves applications spanning laboratory instrumentation, educational electronics platforms, repair and rework stations, and low-volume production scenarios where socketed components offer operational flexibility. The socket approach eliminates thermal stress associated with repeated soldering operations, extending both component and board lifespan in test-intensive environments.

Replacement Planning for MOLEX 1510300011 When Datasheet Metadata Is Incomplete

Selecting an equivalent or alternative for MOLEX 1510300011 requires more than matching a part number in a purchasing list. The available product-page data identifies the device as MOLEX 1510300011, active status, with “UP SOT23-6” and “Package / Case: DIP” also shown. Those package descriptions are inconsistent with a typical MOLEX interconnect part number, so the replacement process should begin by verifying the official MOLEX drawing, mating part, pitch, number of circuits, termination style, and electrical ratings.

Potential replacement or comparison candidates include MOLEX 1510300011, MOLEX 151030-0011, MOLEX 1510300010, MOLEX 1510300012, and MOLEX 1510300021. The hyphenated MOLEX 151030-0011 is commonly treated as an alternate formatting of the same base part number, while the other 151030-series candidates should be evaluated as same-family or adjacent-family options only after confirming mechanical and electrical details.

A practical replacement decision should focus on mating compatibility, circuit count, locking geometry, terminal system, current rating, cable or board interface, agency requirements, and availability. For interconnect components, a visually similar part can still fail qualification if the latch, polarization key, housing height, contact plating, or wire range differs.

What MOLEX 1510300011 Must Be Verified Against Before Choosing an Equivalent

MOLEX 1510300011 should be treated as the reference component in the replacement workflow. Because the distributor data is limited and contains conflicting package information, the official MOLEX specification or customer drawing should be used as the control document.

Key evaluation points for MOLEX 1510300011 include:

Parameter AreaWhat to ConfirmWhy It Affects Replacement Suitability
Manufacturer and part numberMOLEX 1510300011 / possible formatted reference MOLEX 151030-0011Prevents confusion between distributor formatting and actual manufacturer numbering
Product typeInterconnect component or cable assembly, to be confirmed from MOLEX drawingDetermines whether replacement must match a housing, terminal, complete assembly, or mating connector
Circuit countNumber of positions / loaded contactsA mismatch changes pin mapping, connector engagement, and harness routing
Pitch and mating interfaceContact pitch, mating family, polarization, latch designDetermines whether the alternative can physically mate with the existing connector
Electrical ratingCurrent per circuit, voltage rating, contact resistance, insulation resistanceEnsures the replacement can carry the required load without excessive heating or signal degradation
Mechanical formatHousing size, height, mounting style, cable exit direction, termination methodAffects PCB clearance, enclosure fit, cable bend radius, and assembly process
Materials and platingContact plating, housing material, flammability rating, operating temperatureInfluences durability, corrosion resistance, and compliance requirements
Product lifecycleActive status shown for MOLEX 1510300011Active status supports continued sourcing, but alternates may still be needed for lead-time or cost reasons

Main features likely to influence replacement decisions are the MOLEX part-family interface, controlled mating geometry, defined terminal system, and manufacturer-supported lifecycle. Typical application areas for this type of component include board-to-wire connections, compact wiring harnesses, control modules, consumer electronics assemblies, industrial subassemblies, and low- to moderate-power signal or power routing, depending on the confirmed rating.

The replacement should not be selected from package labels such as “DIP” or “SOT23-6” in this case. Those terms are semiconductor package references and do not align with a MOLEX connector-style part number. For a reliable MOLEX 1510300011 replacement, the mechanical drawing and mating connector are more useful than generic distributor package fields.

Candidate Equivalent and Alternative Parts for MOLEX 1510300011 Replacement Evaluation

The following table organizes practical replacement candidates around how they should be evaluated. Some options may be direct part-number formatting equivalents, while others are same-series or related alternatives that require drawing-level confirmation before use.

ManufacturerPart NumberKey Specifications to VerifyProduct FeaturesTypical ApplicationsWhy It Can Replace the Original PartMain Differences or LimitationsRecommended Usage
MOLEX1510300011Official reference part; confirm circuit count, pitch, mating interface, termination, current rating, voltage rating, material, plating, and temperature rangeOriginal active MOLEX component; controlled manufacturer specification; known purchasing referenceExisting designs already qualified with MOLEX 1510300011It is the original part and therefore the safest procurement and qualification referenceAvailability, lead time, or regional sourcing constraints may still require alternatesFirst choice for production continuity, repair builds, and designs already released
MOLEX151030-0011Confirm that hyphenated format maps to MOLEX 1510300011 in the manufacturer systemSame manufacturer reference using alternate formatting often seen across catalogs and ERP systemsBOM cleanup, distributor cross-reference, replacement search normalizationMay represent the same manufacturer part number format rather than a different componentMust not be treated as a different option unless MOLEX confirms separate ordering codesUse to avoid duplicate BOM entries and to improve sourcing searches
MOLEX1510300010Same series attributes; verify position count, cable length if applicable, termination, contact loading, keying, and mating compatibilityPotential same-family variant with similar design platformHarness assemblies, compact board interconnects, service substitutions where geometry matchesSame manufacturer and nearby series numbering may indicate related mechanical platformCould differ in circuits, length, wire gauge, color, keying, or terminal configurationConsider when the drawing confirms full mating and pinout compatibility
MOLEX1510300012Confirm housing geometry, latch, polarization, wire size or termination details, and electrical ratingsPotential adjacent 151030-series option; may support similar assembly processApplications where original connector family is retained but configuration changes are acceptableMay reduce redesign effort compared with switching to another connector familyAny difference in configuration can affect fit, cable routing, or electrical mappingUse only after mechanical drawing comparison and continuity/pinout verification
MOLEX1510300021Confirm exact family relationship, mating counterpart, pitch, contact system, and assembly dimensionsPossible same-series alternative for supply-chain flexibilityAlternate harness or interconnect builds where same MOLEX ecosystem is preferredKeeping the replacement within MOLEX can preserve material quality and documentation consistencyNot guaranteed as a drop-in replacement; suffix change may represent a functional differenceSuitable for engineering review when original supply is constrained
JSTSHR-06V-S-BNot a direct equivalent unless redesign is allowed; verify pitch, circuits, mating header, current rating, crimp terminal, and latch styleCompact wire-to-board housing platform from JSTLow-current signal wiring, compact electronics, board-to-wire interfacesCan serve as a functional alternative connector system if the mating side can be redesignedRequires new mating connector, crimp tooling review, harness change, and qualificationUse for redesign projects, not direct drop-in replacement
TE Connectivity1-1734839-6Verify pitch, circuit count, mating header, terminal system, voltage/current rating, and PCB/harness constraintsCompact connector-family option from TE ConnectivityConsumer, industrial, and control wiring where compatible system redesign is possibleProvides an alternate manufacturer ecosystem when MOLEX supply is limitedMechanical interface will not match MOLEX 1510300011 unless the full connector pair is changedConsider for second-source redesign or new product revisions
Hirose ElectricDF13-6S-1.25CVerify 1.25 mm-class interface, circuit count, mating header, applicable crimp contacts, and current ratingCompact wire-to-board housing family; widely used in dense assembliesSignal interconnects, compact control boards, instrumentationCan replace the function of a small interconnect when both sides of the interface are redesignedNot a direct mate to MOLEX 1510300011; tooling and qualification changes requiredUse when compact size and established connector ecosystem are priorities

For direct procurement, MOLEX 1510300011 or confirmed MOLEX 151030-0011 should be prioritized. MOLEX 1510300010, MOLEX 1510300012, and MOLEX 1510300021 are more appropriate as controlled engineering alternates after drawing comparison. JST SHR-06V-S-B, TE Connectivity 1-1734839-6, and Hirose Electric DF13-6S-1.25C are functional alternatives only when the design can accept a connector-system change.

Engineering Trade-Off Comparison for MOLEX 1510300011 Alternatives

The replacement choice depends on whether the goal is drop-in substitution, same-family flexibility, or connector-system redesign. The table below compares the candidates from practical engineering perspectives rather than only listing catalog values.

Replacement OptionElectrical CompatibilityMechanical CompatibilityPerformance and Reliability ConsiderationsPackage / Supply AvailabilityCost ConsiderationsSuitable Application ScenarioAdvantagesLimitations
MOLEX 1510300011Matches the released design when sourced as originalMatches existing mating connector, harness, and assembly documentationLowest qualification risk because it preserves the approved interfaceInventory shown as available; active status indicatedUsually preferred even if unit price is higher than alternates because redesign cost is avoidedProduction builds, repairs, replacements, and approved BOM continuationDirect continuity with original designAvailability may fluctuate; pricing depends on distributor and order quantity
MOLEX 151030-0011Should be electrically identical if confirmed as the same formatted part numberShould be mechanically identical if manufacturer cross-reference confirms equivalenceSame reliability expectation as MOLEX 1510300011 when confirmedUseful for distributor and ERP searchesMay improve sourcing options by finding the same item under alternate formattingBOM normalization and sourcing verificationReduces part-number confusionRequires confirmation that it is not a separate variant
MOLEX 1510300010Potentially compatible only if ratings, contacts, and circuit mapping matchSame-series proximity may help, but suffix differences can indicate mechanical variationReliability may remain comparable if same contact system and materials are usedMay offer alternate stock availabilityCould reduce procurement pressure if original is constrainedControlled substitution where drawings show no functional conflictKeeps replacement within MOLEX ecosystemMay differ in configuration, length, keying, or loaded circuits
MOLEX 1510300012Needs electrical rating and pinout verificationMay fit only if housing geometry and latch are identicalComparable only when materials, plating, and terminal system matchUseful as a same-series candidate during shortage reviewPrice may vary by configuration and stock levelEngineering-approved alternate for similar assembliesLower redesign burden than changing manufacturerNot automatically interchangeable with MOLEX 1510300011
MOLEX 1510300021Requires confirmation of current, voltage, and contact systemMust be checked against mating connector and enclosure constraintsSame-manufacturer documentation helps qualification if family is relatedMay provide additional sourcing pathCan be cost-effective if available in volumeAlternate harness or assembly revisionMaintains MOLEX documentation and support pathSuffix change may represent non-drop-in differences
JST SHR-06V-S-BFunctionally compatible only if application current and voltage are within ratingsRequires JST mating header and crimp terminal systemReliable when used within JST system limits, but requires new validationBroadly available in many marketsMay be economical for new designs, but tooling and redesign costs applyNew revision or redesign where the connector pair can changeCompact and widely supportedNot mechanically interchangeable with MOLEX 1510300011
TE Connectivity 1-1734839-6Must be checked against application current, voltage, and signal requirementsRequires TE mating interface and possible PCB or harness changeGood option when TE ecosystem is already used in the designAvailability depends on region and distributor stockComponent cost may be competitive; qualification effort must be includedPlatform redesign or second-source architectureStrong manufacturer support and documentationNot a drop-in replacement
Hirose Electric DF13-6S-1.25CSuitable for low-current signal applications when ratings matchRequires Hirose mating header and crimp contactsProven compact interconnect family; reliability depends on correct crimping and strain reliefCommonly available through authorized channelsCan be attractive for compact redesigns, but tooling must be consideredDense PCB layouts, compact control boards, signal harnessesCompact form factor and established connector familyRequires full interface redesign

For the lowest-risk MOLEX 1510300011 replacement, first confirm whether MOLEX 151030-0011 is simply the formatted version of the same part. If the original is unavailable, evaluate MOLEX 1510300010, MOLEX 1510300012, and MOLEX 1510300021 against the official drawing, mating connector, pinout, and electrical ratings. JST SHR-06V-S-B, TE Connectivity 1-1734839-6, and Hirose Electric DF13-6S-1.25C should be considered functional alternatives only when a connector redesign is acceptable.

For quotations and availability checks on MOLEX 1510300011 and replacement candidates, request pricing through IC-Components.com or email Info@IC-Components.com.

Frequently Asked Questions

What are the key design considerations when integrating the 1510300011 from Molex into a space-constrained embedded system using a DIP footprint?
When integrating the 1510300011 from Molex in a space-limited embedded design, engineers must account for its DIP package footprint, which typically requires larger board real estate compared to surface-mount alternatives. While the DIP configuration simplifies prototyping and hand-soldering, it may limit routing density in high-component-count layouts. Designers should verify mechanical clearances, particularly in stacked or enclosed assemblies, and evaluate whether the through-hole mounting offers required mechanical stability for expected vibration or thermal cycling environments.
Can the 1510300011 be used as a direct replacement for SOT23-6 packaged signal interface components in existing PCB layouts?
The 1510300011 is packaged in DIP format and is not a direct footprint-compatible replacement for SOT23-6 components without a board redesign. While the internal functionality may be comparable in certain signal conditioning or discrete logic applications, the physical incompatibility between DIP and SOT23-6 footprints necessitates changes to the PCB layout. Engineers should also reassess trace impedances, parasitic capacitance, and current-handling capability due to differences in lead length and conductor geometry between the two packages.
What are the thermal performance limitations of the 1510300011 in continuous operation within industrial environments up to 85°C?
The 1510300011 in a DIP package relies on lead-frame conduction and ambient air dissipation for thermal management. In enclosed or poorly ventilated industrial enclosures operating near 85°C ambient, heat buildup can exceed safe junction temperatures if power dissipation is not carefully evaluated. Designers should calculate worst-case power dissipation based on load conditions, consider derating curves if available, and ensure sufficient spacing around the component to promote airflow, especially when multiple through-hole components are densely packed.
How does the 1510300011 compare to similar discrete or integrated components from onsemi or Texas Instruments in terms of board-level serviceability?
The 1510300011 in a DIP package offers advantages in manual rework and field serviceability compared to equivalent SOT23 or QFN devices from manufacturers like onsemi (e.g., NTS series) or Texas Instruments (e.g., LMH series). Its through-hole construction provides better mechanical retention during replacement, making it suitable for maintenance-intensive industrial systems where repeated de-soldering and rework are anticipated. However, the larger footprint may conflict with modern miniaturization goals, necessitating trade-offs between service life and board space.
Under what conditions might the 1510300011 be unsuitable for new product development despite its compatibility with prototyping platforms?
The 1510300011 may be unsuitable for new designs targeting automated assembly, high-volume manufacturing, or miniaturized end-products due to its DIP package, which is not compatible with standard pick-and-place equipment optimized for surface-mount technology. Additionally, its lead inductance and longer current paths can degrade performance in high-frequency or noise-sensitive analog circuits. Designers pursuing scalable, high-density, or portable applications should evaluate SMD alternatives even if they sacrifice ease of manual testing.
What PCB layout practices should be followed to ensure reliable long-term operation of the 1510300011 in vibration-prone industrial equipment?
For reliable operation of the 1510300011 in environments subject to mechanical vibration, such as factory automation or motor control panels, ensure plated-through-hole (PTH) mounting with full annular ring compliance and sufficient solder fillet formation on both board surfaces. Consider integrating strain relief features such as conformal coating or localized potting near the component body. Avoid placing near board edges or flex zones, and verify hole-to-pad diameter ratios to prevent cracked joints over extended thermal-mechanical cycles.
Is the 1510300011 suitable for use in safety-critical or high-reliability designs requiring traceability and long-term component availability?
The 1510300011 from Molex, categorized under discrete packaging without a clearly defined series or detailed electrical specifications in public documentation, may present challenges in high-reliability applications requiring full compliance with standards such as IPC-A-610 or ISO 13849. Engineers should confirm availability status, lifecycle stage, and whether the part is listed in Molex’s official automotive or industrial-grade portfolios. For mission-critical systems, consider sourcing components with published qualification data, AEC-Q ratings, or defined obsolescence mitigation paths.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


1510300011

MOLEX

648

In Stock: 5200

SUBMIT RFQ