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0761450633

Manufacturer Part Number:
0761450633
Manufacturer / Brand
Molex
Part of Description:
CONN HEADER IMPACT 288POS PCB
Datasheets:
0761450633.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 34986 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 0761450633
Manufacturer / Brand Molex
Stock Quantity 34986 pcs Stock
Category Connectors, Interconnects > Backplane Connectors - Specialized
Description CONN HEADER IMPACT 288POS PCB
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage Rating 30V
Termination Press-Fit
Series Impact 76145
Pitch 0.053' (1.35mm)
Package Tray
Operating Temperature -55°C ~ 85°C
Number of Rows 18
Number of Positions Loaded All
Number of Positions 288
Number of Columns 16
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Features -
Current Rating (Amps) -
Contact Layout, Typical 96 Differential Pairs
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Usage -
Connector Type Header, Male Pins
Connector Style Impact
Color Black
Base Product Number 076145

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can Molex 0761450633 be used in a 100 ohm differential backplane link, and what should I verify during board and channel design?
Molex 0761450633 is a 288-position Impact backplane header with a typical 96 differential-pair layout, so it can fit high-speed differential backplane architectures when the mating connector, trace geometry, and stackup are designed as a controlled-impedance channel. For 0761450633, verify the target differential impedance, insertion-loss budget, via transitions, and connector pair assignment before locking the pin map. The connector itself does not guarantee system impedance; the PCB stackup, press-fit eyelet design, adjacent return paths, and the mating connector family determine whether the channel meets the link requirement.
Is Molex 0761450633 suitable for replacing another backplane header, and what compatibility checks matter most?
Molex 0761450633 should only be treated as a replacement when the mating interface, pitch, row count, column pattern, mounting style, and press-fit zone match the existing footprint. With a 1.35 mm pitch, 18-row layout, and press-fit through-hole termination, even small footprint differences can prevent a drop-in swap. When evaluating 0761450633 against another part, compare pin assignment, stack height, coplanarity tolerance, plating thickness, and PCB drill specifications, since those factors usually control whether migration is mechanically and electrically viable.
What design constraints should I check before using Molex 0761450633 in a dense backplane with many power and signal nets?
Molex 0761450633 combines a very high pin count with a compact backplane format, so the main constraints are routing escape, via density, and pin mapping discipline. Because the header is not a power blade connector, the available current path and voltage margin must be validated for the actual load rather than assumed from the connector count. For 0761450633, confirm that the allotted pins for ground and power provide acceptable return current distribution, and keep enough spacing and copper clearance for the 30 V rating and the specific system insulation rules.
What are the practical limitations of using Molex 0761450633 in industrial equipment or long-life systems?
Molex 0761450633 is specified for -55°C to 85°C operation and uses gold contact finish, which supports stable contact behavior across typical industrial environments when the mating cycle, shock, vibration, and contamination levels stay within the assembly design limits. For long-life systems, the press-fit interface, PCB hole quality, and mechanical support of the backplane are often the main reliability drivers rather than the connector shell alone. In 0761450633 designs, it is prudent to validate retention after thermal cycling, inspect plated-through-hole integrity, and confirm that the mating connector does not introduce excessive normal-force loss over time.
Can Molex 0761450633 be used for a high-speed connector replacement if I need lower risk during migration from a different Molex backplane family?
Molex 0761450633 belongs to the Impact 76145 family, so migration from another backplane series should be checked at the family level, not just by pin count. The substitute 0761451633 may look related, but a safe migration still depends on exact mating compatibility, stack height, keying, and footprint alignment. For 0761450633, compare the full mechanical drawing, contact orientation, and PCB keepout with the incumbent design before treating it as a direct replacement.
How should I handle PCB assembly and press-fit process control for Molex 0761450633?
Molex 0761450633 uses press-fit termination, so assembly quality depends on the hole plating, press-in force profile, board thickness, and support tooling during insertion. The PCB manufacturer should hold the hole diameter and annular ring to the connector drawing, and the assembly line should verify that the insertion process does not deform the housing or over-stress the solder mask. For 0761450633, process validation typically includes force monitoring, post-insertion inspection, and continuity testing across representative samples.
Is Molex 0761450633 appropriate for low-voltage signal backplanes, and what system-level checks still matter?
Molex 0761450633 is rated to 30 V, so it can be used in low-voltage signal backplanes provided the rest of the system respects the connector’s electrical and spacing limits. The practical questions are not just voltage rating, but also crosstalk, skew, return loss, and how many adjacent pins are assigned to ground or quiet references. In 0761450633 applications, signal integrity should be verified with the final mating pair and full channel stackup because the connector’s dense geometry can amplify routing mistakes.
What should I consider if I need Molex 0761450633 for a design that may require future service replacement?
For serviceable systems, Molex 0761450633 is easiest to maintain when the board support, mating clearance, and access for inspection are designed in from the start. Because the connector is a high-density press-fit header, field replacement usually means more than swapping the part; the PCB hole condition and nearby laminate integrity need to be preserved as well. If 0761450633 is expected to be replaced during service, it is wise to define the acceptable rework method, verify connector removal limits, and keep a controlled spare strategy for the exact matching mate.
What environmental or compliance factors should I check before qualifying Molex 0761450633 in a regulated product?
Molex 0761450633 is RoHS3 compliant, UL94 V-0 rated, and moisture sensitivity level 1, which simplifies many qualification paths, but system-level compliance still depends on the end product. The backplane enclosure, PCB material set, and adjacent components must be evaluated together for flammability, temperature rise, and contamination exposure. For 0761450633, qualification usually also includes vibration, thermal cycling, and mating durability checks because those are the conditions that expose integration weaknesses rather than the part number itself.
What is the main trade-off when selecting Molex 0761450633 versus a lower-pin-count backplane connector?
Molex 0761450633 is suited to dense backplane architectures where large numbers of differential and single-ended connections need to be concentrated into a small footprint. The trade-off is routing and assembly complexity: the higher pin density increases PCB layer demand, escape routing effort, and inspection discipline. If the system does not need the 288-position format, a simpler connector may reduce board cost and implementation risk; if it does, 0761450633 offers a compact way to preserve channel count within the backplane envelope.

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