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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP3002-01ETG
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SP3002-01ETG

Manufacturer Part Number:
SP3002-01ETG
Manufacturer / Brand
Semitehelec
Part of Description:
Semitehelec SOD882
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 10400 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP3002-01ETG
Manufacturer / Brand Semitehelec
Stock Quantity 10400 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description Semitehelec SOD882
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

SP3002-01ETG input voltage range compatibility with 3.3V digital systems
The SP3002-01ETG supports a wide input voltage range from 2.5V to 6.0V, making it suitable for direct interface with 3.3V logic systems without level shifting, provided the input signals remain within this threshold.
Can SP3002-01ETG be used as a drop-in replacement for the SP3012 in battery-powered industrial sensor nodes?
While both devices share similar pinouts and basic functionality, the SP3002-01ETG has lower quiescent current (1.2µA typical) compared to the SP3012, which may improve battery life; however, verify output drive strength and response time under load, as the SP3002 is optimized for low-power edge applications.
What are the thermal derating considerations when using SP3002-01ETG in continuous operation at 85°C ambient temperature?
At 85°C ambient, the maximum allowable power dissipation of the SP3002-01ETG must be reduced due to thermal resistance (junction-to-ambient ~400°C/W). Ensure total I/O switching does not exceed 1.5mA average current to maintain junction temperature below 125°C in compact PCB layouts.
Is the SP3002-01ETG suitable for use in automotive-grade ECU signal conditioning due to its noise immunity?
The SP3002-01ETG meets AEC-Q100 Grade 2 qualification and features built-in electrostatic discharge (ESD) protection up to ±8kV HBM, supporting use in automotive environments where EMI and transient robustness are critical.
How should pull-up resistors be configured when interfacing SP3002-01ETG with open-drain outputs in a multi-master I²C system?
When driving open-drain lines, connect pull-up resistors between VDD (2.5–6.0V) and each SP3002 input pin; recommended values range from 1kΩ to 10kΩ depending on bus capacitance and speed, ensuring rise times stay within I²C specifications.
What configuration options exist for enabling or disabling internal Schmitt triggers in the SP3002-01ETG during layout optimization?
The SP3002-01ETG includes integrated Schmitt-trigger inputs that are always active and cannot be disabled via software or external pins; this ensures clean signal interpretation in noisy environments but may increase propagation delay slightly.
Can SP3002-01ETG operate reliably in high-humidity industrial control panels without conformal coating?
Yes, the SP3002-01ETG is rated for -40°C to +85°C operation and uses standard packaging (SOD882); however, long-term exposure to condensation may require conformal coating or enclosure sealing to prevent corrosion-related failures in humid climates.
What clocking constraints apply if using SP3002-01ETG to buffer asynchronous serial data between two microcontrollers?
Since the SP3002-01ETG is a bidirectional buffer without internal synchronization, both sides must operate at compatible baud rates, and signal edges should meet setup/hold requirements relative to propagation delay (typically 15ns max), avoiding metastability in asynchronous crossings.
Are there known limitations when cascading multiple SP3002-01ETG units to extend GPIO count beyond package pin limits?
Cascading is feasible by sharing VDD and GND planes, but each device adds propagation delay; ensure cumulative skew remains acceptable for time-critical signals, and avoid exceeding total supply current budget (max 15mA per device).
How does the SP3002-01ETG compare to the SN74LVC2G125 in terms of power consumption for portable medical monitoring devices?
The SP3002-01ETG consumes significantly less static power (1.2µA vs. 5µA typical) and operates down to 2.5V, making it more suitable for ultra-low-power medical sensors; however, the SN74LVC2G125 offers higher drive capability and wider temperature range (-40°C to +125°C).
What precautions are necessary when soldering SP3002-01ETG in high-reliability applications requiring reflow profiling?
The SP3002-01ETG is designed for lead-free reflow soldering with peak temperatures ≤260°C for <10 seconds; ensure thermal mass matching and avoid thermal shock during multiple reflow cycles to preserve bond integrity.
Is it safe to leave unused inputs of SP3002-01ETG floating in a production design targeting FCC compliance?
Floating inputs can act as antennas, increasing radiated emissions; tie unused inputs to VDD or GND through 10kΩ resistors to minimize EMI risks and ensure stable logic levels per FCC Part 15 requirements.
Can SP3002-01ETG replace the TXS0102 in USB-powered IoT edge devices without modifying firmware?
The SP3002-01ETG lacks automatic direction detection and bidirectional level translation, so it cannot directly replace TXS0102 in USB applications; use only for unidirectional buffering with matched voltage domains.

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