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SOT15C

Manufacturer Part Number:
SOT15C
Manufacturer / Brand
Semitehelec
Part of Description:
WILLAS SOT23-3
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SOT15C
Manufacturer / Brand Semitehelec
Stock Quantity 6200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description WILLAS SOT23-3
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SOT15C Datasheets SOT15C Details PDF
SOT15C Details PDF for FR.pdf
SOT15C Details PDF for KR.pdf
SOT15C Details PDF for DE.pdf
SOT15C Details PDF for IT.pdf
SOT15C Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
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Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SOT15C from Semitehelec be used as a drop-in replacement for the TI TPS79333 in a 3.3V LDO application with a 5V input and 500mA load?
The SOT15C is not a direct functional replacement for the TPS79333 due to differences in dropout voltage, enable logic thresholds, and output noise characteristics. While both are SOT-23-6 packaged LDOs, the SOT15C has a higher typical dropout voltage of 250mV at 300mA compared to the TPS79333’s 120mV at 250mA, which may cause thermal issues under sustained 500mA loads with a 5V input. Additionally, the enable pin threshold on the SOT15C is not ratiometric and may not interface reliably with 3.3V logic without level shifting. A redesign of the feedback network or thermal pad layout may be required.
What are the key thermal design considerations when using the SOT15C in a high-ambient-temperature industrial environment operating at 85°C?
The SOT15C’s junction-to-ambient thermal resistance (θJA) in a standard SOT-23-6 package is approximately 220°C/W without a thermal pad. At 85°C ambient and 300mA load with a 5V to 3.3V drop, power dissipation reaches 0.51W, pushing the junction temperature to ~197°C—exceeding the 150°C maximum rating. To maintain safe operation, a copper pour under the device with multiple vias to an internal ground plane is required to reduce effective θJA below 100°C/W. Derating output current above 70°C ambient is strongly recommended.
Is the SOT15C suitable for powering sensitive analog front-end circuits in a data acquisition system due to its output noise and PSRR performance?
The SOT15C exhibits moderate power supply rejection ratio (PSRR) of 50dB at 1kHz but drops to less than 30dB above 10kHz, making it less suitable for high-precision analog rails without additional filtering. Its output noise is approximately 80µVrms over 10Hz–100kHz, which may introduce measurable offset in 16-bit ADC systems. For such applications, a low-noise LDO like the ADP7118 or TPS7A20 is preferred, or the SOT15C should be followed by an LC filter or ferrite bead with bypass capacitance.
Can the SOT15C be paralleled with another unit to increase output current capacity in a space-constrained design?
Paralleling the SOT15C is not recommended due to lack of current-sharing features and tight output voltage tolerances (±2.5%). Even minor mismatches in output voltage can cause one device to carry disproportionate current, leading to thermal runaway. If higher current is required, a single higher-current LDO such as the MCP1826 or NCP139 should be used instead. For redundancy or load sharing, external ballast resistors or active current-sharing circuits would be necessary, increasing board complexity and negating the space advantage.
What input voltage range and bypass capacitor values are required to ensure stable operation of the SOT15C with fast transient loads?
The SOT15C requires a minimum input voltage of 3.6V for a 3.3V output and supports up to 12V input. For stable operation under fast transients (e.g., microcontroller wake-up events), a 1µF ceramic input capacitor placed within 2mm of the VIN pin is mandatory. The output requires a minimum 2.2µF low-ESR ceramic capacitor; values above 10µF may cause instability unless ESR is carefully controlled. Avoid tantalum or aluminum electrolytic capacitors on the output due to higher ESR and potential oscillation.
Are there known compatibility issues when replacing a legacy 1117-series LDO with the SOT15C in an existing SOT-223 footprint?
The SOT15C cannot be used as a mechanical or electrical drop-in for SOT-223 packages like the 1117 due to pinout differences and thermal performance gaps. The 1117 typically has a tab-connected output and higher power dissipation capability. Adapting the SOT15C requires a PCB layout change and may necessitate reducing load current or improving airflow. Additionally, the 1117 often uses a 10µF output capacitor, while the SOT15C is optimized for 2.2µF—using larger capacitors without verifying stability can lead to startup issues or overshoot.
How does the SOT15C behave during power-up sequencing in a multi-rail system where it powers a 3.3V digital core after a 5V supply is applied?
The SOT15C has a soft-start characteristic with a typical ramp time of 0.5ms and does not include built-in sequencing control. If the 5V input rail ramps slowly (>10ms), the SOT15C may begin regulation before the input is fully stable, risking latch-up or incorrect startup. To ensure reliable sequencing, use an external supervisor IC or enable the SOT15C via its EN pin only after the 5V rail exceeds 4.5V. A 100kΩ pull-down on the EN pin is advised to prevent floating states.
What are the long-term reliability implications of using the SOT15C in an automotive under-hood application with temperature cycling from -40°C to 125°C?
While the SOT15C is rated for -40°C to 125°C operation, prolonged exposure to thermal cycling in automotive environments may lead to solder joint fatigue due to CTE mismatch between the SOT-23-6 package and PCB. The absence of a thermal pad increases susceptibility to mechanical stress. For under-hood use, conformal coating and underfill are recommended. Additionally, verify that the manufacturer provides AEC-Q100 qualification data; if not available, consider automotive-grade alternatives like the NCV8163 or TLV755P.
Can the SOT15C be used in a battery-powered IoT device with a 3.7V Li-ion input and ultra-low quiescent current requirements?
The SOT15C has a typical quiescent current of 60µA, which may be excessive for long-life battery applications like remote sensors. While it can regulate from a 3.7V Li-ion input down to 3.3V, the dropout voltage of 250mV at 300mA limits usable battery capacity as voltage drops near end-of-life. For ultra-low-power designs, consider alternatives like the TPS62840 (IQ < 1µA) or MCP1700 (IQ = 1.6µA), which offer better efficiency and longer runtime despite different package requirements.
What design changes are needed when migrating from a DFN-6 packaged LDO to the SOT15C in a high-density PCB layout?
Migrating from a DFN-6 to the SOT15C requires re-routing due to different pin functions and pad geometries. The SOT15C uses a standard SOT-23-6 footprint with gull-wing leads, which simplifies soldering compared to DFN but offers less thermal performance. Ensure the output capacitor is placed within 3mm of the VOUT pin, and avoid long traces to the EN pin to prevent noise coupling. Thermal relief on the GND pin is acceptable, but a solid connection to a ground plane is preferred for stability and heat dissipation.

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