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Home > Products > Capacitors > Ceramic Capacitors > CDR32BP101BKUP\M500
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CDR32BP101BKUP\M500

In Stock 11844 pcs Reference Price(In US Dollars)
1000+
$2.5284
Manufacturer Part Number:
CDR32BP101BKUP\M500
Manufacturer / Brand
KYOCERA AVX
Part of Description:
CAP CER SMP MLC HI-REL
Datasheets:
CDR32BP101BKUP\M500.pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 11844 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number CDR32BP101BKUP\M500
Manufacturer / Brand KYOCERA AVX
Stock Quantity 11844 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER SMP MLC HI-REL
Lead Free Status / RoHS Status: RoHS non-compliant
Series *
Package Tape & Reel (TR)
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

When integrating the CDR32BP101BKUP\M500 into a high-vibration aerospace environment, how does its military-grade screening differ from standard automotive-grade (AEC-Q200) 1206 capacitors?
The CDR32BP101BKUP\M500 is qualified under MIL-PRF-55681 standards, which include specific Group A and Group B testing protocols to ensure a 'P' level failure rate (0.1% per 1,000 hours). Unlike AEC-Q200: components which focus on automotive stress cycles, the CDR32BP101BKUP\M500 undergoes established reliability testing that tracks cumulative failure rates over time, providing the statistical certainty required for mission-critical flight hardware where component-level breakdown is not an option.
What are the technical risks of using lead-free SAC305 reflow profiles when mounting the CDR32BP101BKUP\M500 to a PCB?
Because the CDR32BP101BKUP\M500 features a non-RoHS compliant Sn/Pb (tin/lead) termination finish, attempting to use it with lead-free SAC305 solder paste can lead to the formation of a non-eutectic alloy with a higher melting point than traditional Sn63/Pb37. This can result in "hot tearing" during cooling or the development of brittle intermetallic phases within the solder joint of the CDR32BP101BKUP\M500, potentially compromising the mechanical integrity of the 1206 surface mount connection under thermal cycling.
How does the BP (NPO/C0G) dielectric of the CDR32BP101BKUP\M500 behave regarding capacitance drift when operated at its full 100V DC rating?
The CDR32BP101BKUP\M500 utilizes an NPO (C0G) dielectric, which is characterized by a near-zero voltage coefficient of capacitance (VCC). Unlike X7R or X5R materials that can lose up to 50% of their effective capacitance when biased at their rated voltage, the CDR32BP101BKUP\M500 maintains its nominal 100pF value across the entire 100V range. This stability makes it suitable for high-precision timing and RF filtering where the operating voltage must not shift the circuit's resonant frequency.
Can a commercial-grade 100pF C0G capacitor serve as a drop-in replacement for the CDR32BP101BKUP\M500 in medical imaging systems?
While a commercial 1206 C0G capacitor may share the same physical dimensions and basic electrical specs, it lacks the 'U' termination code and 'P' reliability level of the CDR32BP101BKUP\M500. Substituting the CDR32BP101BKUP\M500 with a commercial part in high-reliability medical equipment removes the assurance of MIL-spec lot traceability and rigorous outgassing or hermeticity considerations, which are often required to meet system-level MTBF (Mean Time Between Failures) targets in clinical environments.
In what specific design scenarios would the 10% (K) tolerance of the CDR32BP101BKUP\M500 be considered a constraint compared to 5% (J) tolerance alternatives?
In applications such as high-Q bandpass filters or precise impedance matching networks, the ±10% tolerance of the CDR32BP101BKUP\M500 might allow for a 10pF variance, which could shift the center frequency or cause signal reflections. If the design margin for the 100pF nominal value is tighter than ±10%, the engineer must evaluate if the system can be tuned after assembly or if a tighter tolerance variant of the CDR32BP101BKUP\M500 series should be specified to ensure consistent signal integrity.
How does the MSL 1 (Unlimited) rating of the CDR32BP101BKUP\M500 affect long-term inventory management and production floor life?
The MSL 1 rating indicates that the CDR32BP101BKUP\M500 is not susceptible to moisture absorption that could lead to "popcorning" or delamination during reflow soldering. For manufacturers, this means the CDR32BP101BKUP\M500 can be stored indefinitely outside of moisture barrier bags (MBB) in controlled warehouse conditions (≤30°C/85% RH), simplifying the logistics of multi-stage assembly and reducing the need for pre-baking components before they are placed on the board.
What are the thermal considerations when using the CDR32BP101BKUP\M500 in high-density power supply decoupling modules?
Although the BP dielectric of the CDR32BP101BKUP\M500 offers excellent temperature stability (±30 ppm/°C), the 1206 package size has specific thermal dissipation limits. When the CDR32BP101BKUP\M500 is used for decoupling in high-temperature industrial environments, designers must account for the self-heating effect (ESR-related) if high-frequency ripple currents are present, ensuring that the combined ambient and self-generated heat does not exceed the maximum operating temperature range specified for the CDR32BP101BKUP\M500.

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