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Home > Products > Capacitors > Thin Film Capacitors > 04025J1R9PBSTR
KYOCERA AVX
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04025J1R9PBSTR

In Stock 6051 pcs Reference Price(In US Dollars)
1+
$0.7621
10+
$0.58
50+
$0.4816
100+
$0.4147
Manufacturer Part Number:
04025J1R9PBSTR
Manufacturer / Brand
KYOCERA AVX
Part of Description:
CAP THIN FILM 1.9PF 50V 0402
Datasheets:
04025J1R9PBSTR(1).pdf04025J1R9PBSTR(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 6051 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 04025J1R9PBSTR
Manufacturer / Brand KYOCERA AVX
Stock Quantity 6051 pcs Stock
Category Capacitors > Thin Film Capacitors
Description CAP THIN FILM 1.9PF 50V 0402
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 50 V
Tolerance ±0.02pF
Size / Dimension 0.039" L x 0.022" W (1.00mm x 0.55mm)
Series Accu-P®
Package / Case 0402 (1005 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Height - Seated (Max) 0.020" (0.50mm)
Features RF, High Q, Low Loss
Capacitance 1.9 pF

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the thin film construction of the 04025J1R9PBSTR compare to standard C0G ceramic capacitors for impedance matching at frequencies above 2GHz?
The 04025J1R9PBSTR utilizes thin film technology to achieve higher precision and lower ESR (Equivalent Series Resistance) compared to standard C0G multi-layer ceramic capacitors (MLCCs). In high-frequency impedance matching, the 04025J1R9PBSTR maintains a higher Q-factor and more predictable phase response because its electrodes are deposited with micron-level accuracy, minimizing the internal parasitics and structural variations common in traditional multi-layer ceramic processes.
With a tolerance of ±0.02pF, what PCB layout factors must be controlled to prevent the 04025J1R9PBSTR from shifting out of specification during system integration?
When designing with the 04025J1R9PBSTR, the parasitic capacitance of the PCB pads and the proximity to the ground plane can easily exceed the component's ±0.02pF tolerance. To maintain the intended 1.9 pF performance, designers should implement a ground relief or "copper keep-out" area directly beneath the 04025J1R9PBSTR pads on the internal layers to minimize stray shunt capacitance, which would otherwise alter the effective circuit capacitance and detune sensitive RF paths.
Can the 04025J1R9P4STR be used as a direct drop-in replacement for the 04025J1R9PBSTR in precision RF filter circuits?
While both parts share the 1.9 pF nominal value and 0402 footprint, the 04025J1R9PBSTR features a tighter tolerance of ±0.02pF compared to the ±0.04pF tolerance of the 04025J1R9P4STR. Replacing a 04025J1R9PBSTR with the 04025J1R9P4STR in narrow-band filters or high-speed signal paths may result in center-frequency shifts or increased return loss due to the higher statistical variance in the replacement part's capacitance.
What are the Self-Resonant Frequency (SRF) implications when using the 04025J1R9PBSTR in a 5.8GHz wireless front-end module?
The Accu-P series 04025J1R9PBSTR is engineered for low-loss performance well into the multi-GHz range. At 5.8GHz, the 04025J1R9PBSTR typically operates safely below its self-resonant frequency, ensuring it behaves as a predictable capacitive element. This stability prevents the inductive phase shifts that occur when a capacitor approaches resonance, allowing the 04025J1R9PBSTR to provide consistent gain flatness and phase linearity in wireless power amplifiers and LNA matching networks.
How does the thin film material of the 04025J1R9PBSTR affect long-term capacitance stability compared to traditional ceramic dielectric materials in industrial environments?
Unlike many ceramic dielectrics that experience aging or piezoelectric effects (microphonics), the 04025J1R9PBSTR is built on a high-stability glass or silicon substrate. This construction ensures that the 04025J1R9PBSTR exhibits near-zero aging of capacitance over time and remains resistant to voltage coefficient effects. Consequently, the 04025J1R9PBSTR is suitable for long-term deployment in telecommunications infrastructure where precision must be maintained across varying voltage levels and thermal cycles.
Does the 04025J1R9PBSTR require specific soldering profiles or handling to avoid performance degradation in high-Q applications?
The 04025J1R9PBSTR is compatible with standard lead-free reflow profiles (J-STD-020), but the thin film interface is sensitive to excessive thermal shock or multiple rework cycles. Adhering to the recommended ramp rates for the 04025J1R9PBSTR prevents micro-fractures in the precision electrode structure, which is necessary to preserve the ultra-low ESR and high Q-factor required for high-performance RF oscillators and filters.
Is the performance of the 04025J1R9PBSTR sensitive to its mounting orientation on the PCB relative to the signal trace direction?
Due to its internal thin film architecture, the 04025J1R9PBSTR exhibits significantly lower orientation sensitivity than vertical-electrode capacitors. However, for maximum repeatability in ultra-high-frequency designs (10GHz+), mounting the 04025J1R9PBSTR with the component marking side facing up ensures that the internal electrode distance to the PCB ground plane remains uniform across all production units, minimizing variations in parasitic coupling for the 04025J1R9PBSTR.
What are the power handling limitations of the 04025J1R9PBSTR when used in high-power RF transmitter output stages?
Although the 04025J1R9PBSTR is rated for 50V DC, its RF power handling is limited by its thermal dissipation and ESR. In high-power applications, the low ESR of the 04025J1R9PBSTR minimizes I²R heating; however, designers must ensure that the operating current does not cause the 04025J1R9PBSTR to exceed its maximum operating temperature of 125°C. For power levels exceeding a few watts, thermal modeling of the 04025J1R9PBSTR within the specific PCB thermal environment is necessary to ensure long-term reliability.

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