The 1551099-1 is a specialized vertical male backplane connector manufactured by Agastat Relays/TE Connectivity, designed specifically for telecommunications applications requiring Telcordia pre-post compliance. This high-density interconnect solution belongs to the connectors and interconnects category, specifically engineered as a backplane connector for complex electronic systems where reliable board-to-board connections are critical.
This connector addresses several key design challenges in modern telecommunications infrastructure, including the need for high pin count density while maintaining signal integrity, reliable connections in demanding environments, and compliance with stringent Telcordia standards for telecommunications equipment. The press-fit termination technology eliminates the need for soldering, reducing manufacturing time and potential thermal stress on the PCB while ensuring consistent electrical connections across all 96 positions.
The connector features a robust 8-row by 12-column configuration providing 96 individual connection points in a compact footprint, utilizing through-hole mounting for secure mechanical attachment to the PCB. The natural-colored housing is constructed from high-grade materials that meet lead-free and RoHS compliance standards, ensuring environmental responsibility and regulatory adherence. With a Moisture Sensitivity Level of 1, the connector can withstand unlimited exposure to ambient conditions without degradation, making it suitable for various storage and handling environments.
Key advantages include the press-fit termination system that provides gas-tight connections resistant to corrosion and vibration, high-density pin arrangement maximizing connection capability per unit area, and Telcordia compliance ensuring reliability in telecommunications applications. The through-hole mounting provides superior mechanical stability compared to surface-mount alternatives, while the bulk packaging option offers cost-effective procurement for high-volume applications with a standard package quantity of 90 units.
This connector is fully compatible with corresponding female receptacles in the Z-PACK series and is designed for integration into telecommunications switching equipment, network infrastructure hardware, server backplanes, and industrial control systems where high-reliability connections are paramount. Primary application areas include central office equipment, data center infrastructure, telecommunications switching systems, and high-performance computing platforms requiring dense interconnection solutions.
Equivalent models and alternatives include other connectors within TE Connectivity's Z-PACK series with similar pin counts and configurations, Samtec's high-density backplane connector series offering comparable functionality, Molex's backplane connector solutions with press-fit termination, and Amphenol's telecommunications-grade connectors meeting similar Telcordia requirements. Specific alternative part numbers may include other Z-PACK series connectors with different pin arrangements or mounting orientations, though the exact Telcordia pre-post compliance and 96-position 8x12 configuration make this particular model specialized for its intended telecommunications applications.
1551099-1 Key Technical Attributes
Manufacturer: Agastat Relays / TE Connectivity
Manufacturer Part Number: 1551099-1
Main Category: Connectors, Interconnects
1551099-1 Packing Size
The 1551099-1 model comes in a bulk package, ensuring protection and ease of handling during shipment and storage. Bulk packaging is ideal for high-volume installations and manufacturing settings. The connector features a through hole mounting type, with press-fit termination technology that simplifies installation and secures electrical connections without soldering. The connector has a header type configuration with male pins, offering robust mechanical and electrical stability. Its structure includes 96 positions, arranged across 8 rows and 12 columns, which supports high-density backplane applications. The device is finished in a natural color for easy identification during assembly. The component’s design also allows efficient thermal dissipation due to its standardized configuration, and it is built with lead-free, RoHS-compliant materials ensuring safe use in environmentally focused projects.
1551099-1 Application
The 1551099-1 connector is specifically engineered for use in backplane interconnections within specialized and high-performance electronic assemblies. It is highly suitable for telecommunications, industrial automation, networking equipment, and servers where reliable data transmission and mechanical resilience are required. Its Telcordia pre-post configuration supports compatibility with industry-standard systems, making it ideal for designs adhering to strict communication and networking specifications. The connector is optimized for use in environments that require high pin count, robust architecture, and excellent signal integrity.
1551099-1 Features
This connector boasts a highly detailed feature set:
- High-density configuration with 96 positions, providing extensive connection capability for advanced system integration.
- 8 rows and 12 columns layout ensures organized signal and power distributions, critical for complex backplane systems.
- Through hole mounting type offers superior stability and long-term mechanical endurance, making it suitable for heavy-duty and vibration-prone installations.
- Press-fit termination allows solder-free installation, reducing assembly time and risk of thermal damage to sensitive components.
- The header and male pin design is engineered for reliable and repetitive mating cycles, supporting both initial system integration and subsequent maintenance or upgrades.
- Bulk packaging is ideal for manufacturing and mass deployment, accommodating streamlined operations and inventory management.
- “Natural” coloring aids identification and sorting during the manufacturing process.
- Lead-free status and RoHS compliance demonstrate commitment to environmental regulations and user safety.
1551099-1 Quality and Safety Features
This model meets stringent environmental and safety standards, being fully lead-free and RoHS compliant. The Moisture Sensitivity Level (MSL) of 1 ensures unlimited shelf life, making inventory management more flexible for users. Press-fit technology minimizes exposure to thermal stress, which enhances reliability and safety during assembly. The bulk package further secures the product during transit and handling. Agastat Relays / TE Connectivity is known for rigorous testing and adherence to global quality standards, making this connector a reliable choice for mission-critical applications.
1551099-1 Compatibility
The 1551099-1 connector belongs to the Z-PACK series and is tailored for compatibility with Telcordia pre-post standard backplane systems. Its industry-standard dimensions and pin configuration facilitate seamless integration into existing assemblies from TE Connectivity and other leading manufacturers. It supports direct mating with corresponding female connectors for modular upgrades, system expansion, or maintenance – ensuring high flexibility within systems that require future-proof interconnect solutions.
1551099-1 Datasheet PDF
The most authoritative datasheet for the 1551099-1 model is available exclusively on our website. We strongly recommend downloading the official datasheet directly from this page, ensuring you receive the latest and most accurate technical information for product integration, specification, and compliance reference.
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