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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SOP-114HST
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SOP-114HST

Manufacturer Part Number:
SOP-114HST
Manufacturer / Brand
SUMI
Part of Description:
MITSUMI SMD
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5600 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SOP-114HST
Manufacturer / Brand SUMI
Stock Quantity 5600 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MITSUMI SMD
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SOP-114HST be used as a direct replacement for legacy through-hole components in space-constrained PCB designs without requiring board modifications?
The SOP-114HST is designed as a surface-mount device (SMD), which enables higher component density and improved solder joint reliability compared to through-hole alternatives. However, direct replacement without modification typically requires a footprint redesign due to differing pin configurations and thermal pad layouts. Engineers should verify mechanical compatibility and ensure adequate reflow soldering profiles when migrating from through-hole parts.
What are the thermal management considerations when integrating the SOP-114HST into high-reliability industrial control systems operating continuously at elevated ambient temperatures?
Continuous operation under elevated temperatures increases junction temperature stress on semiconductor devices. While the SOP-114HST does not specify an explicit thermal resistance (θJA) in its basic description, designers must account for self-heating effects during power dissipation. Thermal vias under the package and sufficient copper area in the PCB layout are strongly recommended to maintain long-term junction integrity, especially in applications exceeding 70°C ambient.
Does the SOP-114HST support partial or full configuration via external pull-up/pull-down resistors, or is internal logic required for initialization in microcontroller-driven applications?
Although detailed electrical characteristics are not provided in the base specification, most SOP-packaged ICs of this class rely on internal configuration logic rather than external resistor networks for operational states. Designers should assume that critical control pins may require specific voltage levels during startup sequences and consult application notes or manufacturer datasheets for initialization timing requirements before finalizing firmware design.
Is the SOP-114HST suitable for automotive-grade environments with exposure to vibration, thermal cycling, and humidity beyond standard commercial specifications?
The part number indicates only "SUMI SMD" with no explicit AEC-Q100 qualification or industrial temperature grade marking. Therefore, it is not inherently guaranteed for automotive or extended industrial environments where reliability under mechanical stress and wide temperature swings is essential. Alternative variants with formal certification may be necessary for such use cases.
When migrating from a competing brand’s similar SOP-16 package device, what key electrical and physical differences must be evaluated to avoid signal integrity issues on shared bus lines?
Pin-to-pin compatibility between different manufacturers' SOP-16 packages is often superficial; differences in input capacitance, output drive strength, and ESD protection levels can affect bus loading and noise margins. Even if the SOP-114HST shares the same package outline, engineers must compare datasheet parameters such as VIH/VIL thresholds, output rise/fall times, and leakage currents to ensure interoperability across multiple ICs on the same line.
How should decoupling capacitors be placed relative to the SOP-114HST to minimize power supply noise in mixed-signal switching power supply controller circuits?
Decoupling capacitors must be located within 2 mm of the VCC and GND pins of the SOP-114HST to form an effective low-impedance path for high-frequency transients. Use a combination of a 1 µF ceramic capacitor in parallel with a 0.1 µF high-frequency bypass capacitor to address both bulk filtering and fast transient suppression, ensuring stable operation under dynamic load conditions.
Are there known limitations in using the SOP-114HST for PWM generation at frequencies above 1 MHz due to propagation delay or slew rate constraints?
Without explicit timing specifications like tPLH or tr in the provided description, the suitability for high-frequency PWM operation cannot be confirmed. Most general-purpose SOP-mounted controllers have limited bandwidth, and exceeding 1 MHz may result in degraded duty cycle accuracy and increased shoot-through risk in half-bridge topologies. Designers should validate performance empirically or select a dedicated high-speed PWM IC if sub-microsecond response is required.
What precautions should be taken during reflow soldering when replacing older leaded components with the SOP-114HST in mass production environments?
The SOP-114HST requires standard lead-free reflow profiles with peak temperatures between 240–260°C and dwell times under 60 seconds to prevent thermal damage. Ensure proper solder paste printing thickness (typically 0.12–0.18 mm) and use nitrogen atmosphere if available to improve wetting and reduce defects. Inspection via AOI or X-ray is advised for joints with thermal pads.
Can the SOP-114HST safely interface directly with 5V logic signals without level shifting when connected to a 3.3V microcontroller GPIO?
If the SOP-114HST supports 5V-tolerant inputs, direct connection may be acceptable; however, absence of explicit IO voltage compatibility data implies caution is warranted. Undershooting the input high threshold could lead to undefined logic states or excessive input current. Implementing a series resistor (e.g., 1 kΩ) with optional clamping diodes or using a dedicated level translator is recommended unless verified by manufacturer testing.
What are the implications of selecting the SOP-114HST over alternative packages like QFN or DIP in terms of reworkability and field replaceability?
The SOP package offers superior thermal and electrical performance but complicates manual repair due to small pitch and hidden solder joints beneath the body. In contrast, DIP allows easy socket mounting and hand-soldering, while QFN provides better heat dissipation with moderate rework complexity. For production testing or prototype iteration, consider test-friendly packaging unless performance mandates SOP adoption.

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