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LTC3838IFE

Manufacturer Part Number:
LTC3838IFE
Manufacturer / Brand
Analog Devices Inc.
Part of Description:
IC POWER MANAGEMENT
Datasheets:
LTC3838IFE.pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 14208 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number LTC3838IFE
Manufacturer / Brand Analog Devices Inc.
Stock Quantity 14208 pcs Stock
Category Integrated Circuits (ICs) > Power Management (PMIC) - DC DC Switching Controllers
Description IC POWER MANAGEMENT
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply (Vcc/Vdd) 4.5V ~ 38V
Topology Buck
Synchronous Rectifier Yes
Supplier Device Package 38-TSSOP-EP
Series PolyPhase®
Serial Interfaces -
Package / Case 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Package Tube
Output Type Transistor Driver
Output Phases 2
Output Configuration Positive
Operating Temperature -40°C ~ 125°C (TJ)
Number of Outputs 2
Mounting Type Surface Mount
Function Step-Down
Frequency - Switching 200kHz ~ 2MHz
Duty Cycle (Max) -
Control Features Enable, Frequency Control, Phase Control, Power Good, Soft Start, Tracking
Clock Sync No
Base Product Number LTC3838

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design constraints when integrating the LTC3838IFE into a high-current, multi-rail power system with tight transient response requirements?
The LTC3838IFE supports dual-phase operation with PolyPhase® architecture, enabling interleaved switching to reduce input and output ripple current, which is critical in high-current applications. However, phase alignment and current sharing between channels must be carefully managed through proper layout and external current sense resistor matching. The absence of internal clock synchronization means external synchronization is not supported, so beat frequency noise may arise if multiple units operate near each other without frequency planning. Additionally, the 200kHz to 2MHz switching frequency range allows optimization for efficiency versus size, but higher frequencies increase gate drive losses and require low-inductance PCB layouts to maintain stability during fast load transients.
Can the LTC3838IFE be used as a drop-in replacement for the LTC3838EFE#PBF in an existing industrial design, and what layout or configuration changes might be necessary?
The LTC3838IFE and LTC3838EFE#PBF are functionally identical and share the same 38-TSSOP-EP package and pinout, making the LTC3838IFE a compatible replacement in most cases. However, the "I" grade specifies an extended industrial temperature range (-40°C to 125°C junction), which may affect long-term reliability under thermal cycling in harsh environments. No firmware or control loop re-tuning is required, but verify that the thermal pad soldering and copper pour meet the exposed pad (EP) requirements, as inadequate thermal vias can lead to premature failure due to junction overheating, especially at high ambient temperatures.
What are the risks of using the LTC3838IFE in a 24V industrial input application with frequent load dumps or voltage surges?
The LTC3838IFE accepts a Vcc/Vdd range of 4.5V to 38V, making it suitable for 24V nominal systems, but transient overvoltage events such as load dumps can exceed this limit. Without external clamping (e.g., TVS diodes or input filters), sustained voltages above 38V may damage the IC. Additionally, the high-side gate driver relies on bootstrap circuitry, which can experience voltage stress during fast transients. Designers should include input bulk capacitance and transient suppression to keep voltage spikes within safe margins, particularly in automotive or heavy machinery environments where inductive kickback is common.
How does the lack of clock synchronization in the LTC3838IFE affect system-level noise performance in multi-converter designs?
Since the LTC3838IFE does not support clock synchronization, each unit operates on its own internal oscillator, potentially creating beat frequencies when switching frequencies are close but not identical. In systems with multiple DC-DC converters, this can manifest as low-frequency ripple or EMI peaks that are difficult to filter. To mitigate this, assign non-overlapping switching frequencies or use spread-spectrum modulation if supported by the system controller. Alternatively, consider a master-slave synchronized alternative like the LTC3861 if coherent timing is required for noise-sensitive analog or RF stages.
What soft-start and tracking configurations are supported by the LTC3838IFE, and how do they impact power-up sequencing in FPGA or ASIC applications?
The LTC3838IFE supports adjustable soft-start via an external capacitor on the SS pin, allowing controlled ramp-up of output voltage to limit inrush current. It also includes tracking functionality, enabling one output to follow another during startup, which is essential for powering FPGAs or ASICs with strict voltage sequencing requirements. However, the tracking behavior depends on external resistor networks and must be designed to avoid reverse current flow or latch-up. Ensure that the tracking slope matches the load’s tolerance for dV/dt to prevent unintended activation of under-voltage lockout circuits on downstream devices.
Under what conditions might the LTC3838IFE be unsuitable for battery-powered or low-quiescent-current applications?
The LTC3838IFE is optimized for high-efficiency, high-performance switching regulation but lacks ultra-low quiescent current modes. In light-load or standby conditions typical of battery-powered systems, the internal bias currents and gate drive losses may dominate, reducing overall efficiency. For applications requiring long battery life with intermittent loads, consider alternatives with burst mode or diode emulation, such as the LTC3633 or LTC3310S. The LTC3838IFE is better suited for always-on, high-current rails where efficiency at full load outweighs standby consumption concerns.
What layout practices are critical to ensure stable operation and thermal performance of the LTC3838IFE in a compact PCB design?
The LTC3838IFE’s exposed thermal pad (EP) must be soldered directly to a grounded copper plane with multiple thermal vias to dissipate heat effectively, especially when operating near the upper end of the 125°C junction temperature limit. High-current paths—particularly the SW nodes, input capacitors, and inductor connections—should use short, wide traces to minimize parasitic inductance and resistive losses. The feedback and compensation networks must be routed away from noisy switching nodes to prevent instability. Poor grounding or inadequate decoupling can lead to subharmonic oscillation or degraded transient response, even with correct component selection.
How does the dual-phase capability of the LTC3838IFE improve performance compared to single-phase controllers in high-current applications?
The LTC3838IFE’s two-phase operation reduces input RMS current by up to 50% compared to a single-phase design at the same output current, lowering input capacitor stress and improving system reliability. It also reduces output voltage ripple due to interleaved switching, allowing smaller output capacitance. However, this benefit is only realized when both phases are actively loaded; in asymmetric load conditions, current imbalance may occur, requiring careful design of the current sense network and compensation loop to maintain regulation accuracy and avoid overheating in one phase.
What are the implications of the LTC3838IFE’s MSL 1 rating for high-volume manufacturing and long-term field reliability?
The moisture sensitivity level (MSL) 1 rating indicates the LTC3838IFE can be exposed to ambient conditions indefinitely without requiring dry packing or baking before reflow, simplifying logistics and reducing handling costs in high-volume production. This enhances manufacturability and reduces the risk of moisture-induced defects during solder reflow. For long-term field reliability, especially in humid or thermally cycled environments, the robust packaging contributes to consistent performance, but system-level conformal coating or environmental sealing may still be necessary depending on the application’s exposure conditions.
Can the LTC3838IFE support pre-bias startup conditions, and what design precautions are needed to avoid reverse current flow?
The LTC3838IFE does not inherently support pre-bias startup, meaning it may attempt to pull the output low if a voltage is already present on the output rail at power-up, potentially causing reverse current through the low-side MOSFET body diode or external synchronous rectifier. To prevent damage in systems where pre-charged outputs are possible—such as during hot-swap or shared bus scenarios—add external ORing diodes or use a controller with integrated pre-bias protection. Alternatively, implement a soft-start delay or sequencing logic to ensure the LTC3838IFE starts only after downstream rails are discharged.

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