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S-1312D28-A4T2U3

In Stock 44428 pcs Reference Price(In US Dollars)
10000+
$0.4772
Manufacturer Part Number:
S-1312D28-A4T2U3
Manufacturer / Brand
ABLIC Inc.
Part of Description:
IC REG LINEAR 2.8V 150MA HSNT4-B
Datasheets:
S-1312D28-A4T2U3(1).pdfS-1312D28-A4T2U3(2).pdfS-1312D28-A4T2U3(3).pdfS-1312D28-A4T2U3(4).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 44428 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number S-1312D28-A4T2U3
Manufacturer / Brand ABLIC Inc.
Stock Quantity 44428 pcs Stock
Category Integrated Circuits (ICs) > Power Management (PMIC) - Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Description IC REG LINEAR 2.8V 150MA HSNT4-B
Lead Free Status / RoHS Status: RoHS Compliant
Voltage Dropout (Max) 0.32V @ 100mA
Voltage - Output (Min/Fixed) 2.8V
Voltage - Output (Max) -
Voltage - Input (Max) 5.5V
Supplier Device Package HSNT-4-B
Series S-1312
Protection Features Overcurrent, Thermal Shutdown
Package / Case 4-SMD, Flat Lead Exposed Pad
Package Tape & Reel (TR)
PSRR 70dB (1kHz)
Output Type Fixed
Output Configuration Positive
Operating Temperature -40°C ~ 85°C (TA)
Number of Regulators 1
Mounting Type Surface Mount
Current - Quiescent (Iq) 30 µA
Current - Output 150mA
Control Features Enable
Base Product Number S-1312

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the S-1312D28-A4T2U3 be used as a direct replacement for the S-1312B28-A4T1U3 in a legacy industrial sensor node design, and what are the key differences that may affect thermal performance or layout requirements?
The S-1312D28-A4T2U3 can serve as a functional replacement for the S-1312B28-A4T1U3 in many applications due to matching electrical characteristics such as 2.8V fixed output, 150mA current capability, and similar dropout voltage. However, the D variant features an exposed pad (HSNT-4-B package) with improved thermal dissipation compared to the B variant’s standard SMD package, which enhances heat spreading and lowers junction temperature under continuous load—critical for long-term reliability in sealed enclosures or high-ambient-temperature environments.
What is the maximum input-to-output differential voltage the S-1312D28-A4T2U3 can sustain before regulation fails, and how does this impact system design when powered by a Li-ion battery discharging from 4.2V to 2.7V?
The S-1312D28-A4T2U3 maintains regulation down to a 0.32V dropout at 100mA load, meaning the minimum input voltage required is approximately 3.12V for stable 2.8V output. When powered by a Li-ion cell, the regulator will remain functional until the battery voltage drops below this threshold, but efficiency will decrease as the differential increases. Designers should account for this transition point to avoid brownout conditions in battery-operated systems.
How does the enable pin logic level of the S-1312D28-A4T2U3 interact with 1.8V microcontroller GPIOs, and what precautions are needed to prevent unintended shutdowns during power-up sequencing?
The enable pin of the S-1312D28-A4T2U3 accepts logic low-to-high thresholds compatible with 1.8V signals, allowing direct interfacing with modern MCUs. However, due to potential input hysteresis variations across temperature, it's advisable to verify actual switching thresholds using the part’s datasheet curve and consider adding a small pull-up resistor (e.g., 10kΩ) if noise immunity is a concern during startup transients.
In a compact IoT device where space is constrained, can multiple S-1312D28-A4T2U3 regulators share a common output capacitor without degrading transient response, and what capacitance and ESR range is recommended?
Multiple S-1312D28-A4T2U3 units can share a single output capacitor only if their switching phases are staggered; however, since this device is linear and not switching-based, parallel operation does not inherently create phase cancellation issues. That said, each regulator must have its own dedicated output capacitor (typically 1µF ceramic with X5R/X7R dielectric) within 1mm of the IC to ensure stability and minimize ground bounce effects under dynamic loads.
What is the expected lifetime derating behavior of the S-1312D28-A4T2U3 under continuous operation at 80°C ambient with 100mA load, and how should PCB copper area be allocated to maintain long-term reliability?
Operating at 80°C ambient with 100mA draw results in significant power dissipation (P = (Vin - Vout) × I). For example, at 4.0V input, dissipation is (4.0V - 2.8V) × 0.1A = 120mW. To keep junction temperature within safe limits (<125°C), sufficient copper pour on both top and bottom layers around the HSNT-4-B exposed pad is essential—recommended minimum 3x3mm inner layer copper with multiple vias to thermal pads for effective heat sinking.
Can the S-1312D28-A4T2U3 safely power a BLE module drawing brief current spikes up to 250mA, and what protection mechanisms exist to prevent damage during these transient events?
While the S-1312D28-A4T2U3 has overcurrent protection, it is designed for continuous 150mA operation with brief overload tolerance typically limited to 200–250mA for very short durations (<1ms). Sustained spikes above 150mA may trigger thermal shutdown. Therefore, for BLE modules with frequent current bursts exceeding rated output, an external bulk capacitor (e.g., 10µF) near the regulator output combined with proper layout minimizes voltage droop and reduces stress on the LDO.
Are there any known compatibility issues between the S-1312D28-A4T2U3 and certain buck-boost converters in mixed-voltage architectures, particularly when sharing ground planes or experiencing ground loops?
No inherent compatibility issues exist between the S-1312D28-A4T2U3 and most DC-DC converters due to its low quiescent current (30µA) and lack of high-frequency switching noise. However, in high-noise environments, careful attention to grounding strategy—such as using star grounding at the regulator input side—is advised to prevent digital switching noise coupling into the analog output rail, which could degrade PSRR performance beyond the specified 70dB at 1kHz.
What are the implications of substituting the S-1312D28-A4T2U3 with the S-1312A28-A4T1U3 in a medical wearable requiring strict leakage current compliance, given differences in internal architecture?
Although both are variants of the S-1312 series, the A variant may exhibit higher reverse-leakage or substrate injection currents under reverse-biased conditions due to process variations. In precision or battery-powered medical devices where nanoampere-level leakage affects runtime or measurement accuracy, verification through bench testing or consultation of ABLIC’s application notes specific to leakage performance per variant is strongly recommended before substitution.
Does the S-1312D28-A4T2U3 support hot-swapping into a live system without external protection components, and what risks arise if connected while powered by an unregulated wall adapter?
Hot insertion is not officially supported and poses risk of input overvoltage or latch-up if input exceeds 5.5V. While the device includes ESD protection up to ±2kV per IEC 61000-4-2, sustained exposure to voltages above Vin(max) during connection may compromise reliability. Adding a simple TVS diode or series resistor-capacitor snubber network at the input is advised for robustness in field-replaceable modules.
How does the Moisture Sensitivity Level (MSL) rating of MSL 1 for the S-1312D28-A4T2U3 influence reflow profile selection in automated SMT assembly lines, and are any post-bake steps required?
With an MSL 1 classification (unlimited shelf life and no pre-baking required), the S-1312D28-A4T2U3 can undergo standard lead-free reflow profiles without moisture conditioning. Standard JEDEC-compliant profiles (peak temp ≤260°C, time above liquidus ≤60 seconds) are acceptable, ensuring compatibility with typical high-volume manufacturing flows while preserving solder joint integrity and bond wire reliability.

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S-1312D28-A4T2U3

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IC REG LINEAR 2.8V 150MA HSNT4-B

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