In terms of progress, TSMC has also introduced a new "N2P" variant, an enhanced version of the company's first-generation 2nm process. The advanced 2nm "N2P" node is expected to enter mass production in 2026, with TSMC aiming to start manufacturing the first-generation iteration in 2025 successfully.
TSMC operates two factories in Baoshan and Kaohsiung, steadily advancing production levels to meet the growing demand for 2nm wafers. According to the Economic Daily News, the Taiwanese giant has initiated small-scale production using advanced lithography technology, currently capped at 5,000 wafers per month. However, earlier reports suggested that the company reached a trial production output of 10,000 wafers and is expected to hit 50,000 wafers later this year. By 2026, this figure is projected to reach 80,000 wafers, though it remains unconfirmed whether this will include both N2 and N2P processes or just one of them.
With the operation of the Baoshan and Kaohsiung facilities, TSMC's monthly wafer production is expected to quickly rise to 40,000 wafers. In terms of technological advancement, no other foundry rivals TSMC, so it's no surprise that most companies determined to launch cutting-edge chips seek TSMC's services.
The only significant concern for these companies might be the high wafer prices, which are expected to reach $30,000 each. While the cost increase for the 2nm process is inevitable, such pricing could deter customers. However, TSMC is reportedly exploring ways to reduce overall costs, starting with a service called "CyberShuttle," set to launch this April. This service allows companies like Apple, Qualcomm, and others to evaluate their chips on a shared test wafer, reducing costs.
If TSMC successfully scales up 2nm wafer production, economies of scale will help balance costs, enabling customers to pay lower fees. However, to achieve this, both the Baoshan and Kaohsiung facilities will need to operate at full capacity.