According to reports from the 2025 Computex Taipei, MediaTek CEO Rick Tsai announced that the company’s first 2nm chip is expected to tape out in September 2025.
Tape-out is the process of converting a finalized integrated circuit (IC) design layout into a physical chip, similar to an assembly line, involving a series of manufacturing steps.
While no additional details were officially disclosed, the media speculates that the chip will be manufactured by TSMC and could either be the next-generation flagship smartphone SoC or a custom ASIC chip for NVIDIA’s NVLink Fusion system.
During the keynote titled “AI without Boundaries, Infinite Intelligence,” Tsai reflected on MediaTek’s 28-year development history and noted that the company has shipped over 20 billion chips for end devices in the past decade, covering a wide range from smartphones to edge devices. He also stated that after adopting the 2nm process, MediaTek will continue using TSMC’s more advanced A16 and A14 node technologies in the future.