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The cost is nearly 3,500 yuan, iPhone 11 Pro Max dismantling BOM exposure!

Earlier, iFixit got the iPhone 11 Pro Max and disassembled it. In the dismantling report, iFixit confirmed that the new iPhone is still 4G.

Recently, another analyst, Techinsights, also dismantled the Apple iPhone 11 Pro Max. The main components were analyzed and the overall BOM cost was analyzed.

According to the analysis, the BOM material cost of the iPhone 11 Pro Max (512GB version) is 490.5 US dollars (rounded to the nearest 0.5 US dollars), which is about 3,493 yuan, which is 27.5% of its national bank version of 12,699 yuan. It should be pointed out that the material cost refers to the cost of each component, and does not count the cost of research and development.





The iPhone 3 Pro Max's rear-camera module has the highest percentage of total cost, reaching about 15%, at $73.5. Followed by display and touch screen ($66.5) and A13 processor ($64).

On the SoC side, the Apple A13 processor inside the iPhone 11 Pro Max disassembled by Techinsights is numbered APL1W85. The A13 processor and the Samsung K3UH5H50AM-SGCL 4GB LPDDR4X SDRAM package are packaged together in PoP. The size of the A13 processor (die seal edge) is 10.67mm x 9.23mm = 98.48 mm2. In contrast, the area of ​​the A12 processor is 9.89 × 8.42 = 83.27 mm 2 , so the A13 area is increased by 18.27%.



For the baseband, the Intel PMB9960 is used, which may be the XMM7660 modem. According to Intel, the XMM7660 is its sixth-generation LTE modem that meets 3GPP Release 14. It supports speeds of up to 1.6 Gbps in the downlink (Cat 19) and up to 150 Mbps in the uplink.

In contrast, the Apple iPhone Xs Max uses the Intel PMB9955 XMM7560 modem, which supports up to 1 Gbps in the downlink (Cat 16) and up to 225 Mbps in the uplink (Cat 15). According to Intel, the XMM7660 modem has a design node of 14 nm, which is the same as last year's XMM7560.



The RF transceiver uses the Intel PMB5765 for RF transceivers with Intel baseband chips.

Nand Flash storage: Toshiba's 512 GB NAND flash module is used.

Wi-Fi / BT module: Murata 339S00647 module.

NFC: NXP's new SN200 NFC&SE module is different from the SN100 used in iPhone Xs / Xs Max / XR last year.

PMIC: Intel PMB6840, Apple 343S00355 (APL1092), this should be Apple's own design of the main PMIC for the A13 bionic processor

DC/DC: Apple 338S00510, Texas Instruments TPS61280

Battery Charge Management: STMicroelectronics STB601, Texas Instruments SN2611A0

Display power management: Samsung S2DOS23

Audio IC: Apple / Cirrus Logic 338S00509 audio codec and three 338S00411 audio amplifiers.

Envelope Tracker: Using Qorvo QM81013

RF front-end: Avago (Broadcom) AFEM-8100 front-end module, Skyworks SKY78221-17 front-end module, Skyworks SKY78223-17 front-end module, Skyworks SKY13797-19 PAM, etc.

Wireless charging: STMicroelectronics' STPMB0 chip is most likely a wireless charging receiver IC, while the previous iPhone used the Broadcom chip.

Camera: Sony is still the supplier of four vision cameras for the iPhone 11 Pro Max. For the third consecutive year, STMicroelectronics has used its global shutter IR camera chip as a detector for the iPhone's structured light-based FaceID system.

Other: STMicroelectronics ST33G1M2 MCU, NXP CBTL1612A1 display port multiplexer, Cypress CYPD2104 USB Type-C port controller.