According to Yingheng.com, foundry leader TSMC announced today (3) that it will work with Broadcom to strengthen the CoWoS platform to support the industry's first and largest double-mask-size interposer with an area of approximately 1,700 square millimeters.
CoWoS (Chip-on-Wafer-on-Substrate) is one of TSMC's wafer-level system integration portfolio (WLSI) solutions, which can be complementary to transistor scaling and perform system-level scaling beyond transistor scaling.
It is reported that the next-generation CoWoS interposer layer strengthened by TSMC and Broadcom is composed of two full-width photomasks, which can greatly improve computing capabilities. At the same time, more system single chips (SoCs) are used to support advanced high-performance computing systems. Ready to support TSMC's 5nm process technology.
According to TSMC, this new generation of CoWoS technology can accommodate multiple logic system single chips and up to 6 high-bandwidth memory (HBM) cubes, providing up to 96GB of memory capacity. In addition, the technology provides up to 2.7 trillion bits per second of bandwidth, which is 2.7 times faster than the CoWoS solution introduced in 2016.
CoWoS solutions have the advantage of supporting higher memory capacity and bandwidth, suitable for memory-intensive processing tasks such as deep learning, 5G networks, energy-efficient data centers, and more. In addition to providing more space to improve computing power, input / output, and HBM integration, the enhanced version of CoWoS technology can also provide higher design flexibility and better yield to support special application chip designs on advanced processes.
The report pointed out that in the CoWoS platform that TSMC cooperates with Broadcom, Broadcom defines complex upper-layer chips, interposers, and HBM structures; and TSMC is responsible for developing the production process to fully improve yield and performance, and can develop several generations of CoWoS The experience of the platform expanded the CoWoS platform beyond the integration area of a single mask size, and finally introduced this enhancement into mass production.