Recently, the Hangzhou Development and Reform Commission issued the "Hangzhou City 2020 Key Implementation Project Image Progress Plan" (hereinafter referred to as "Key Implementation Project") and "Hangzhou City 2020 Key Preparation Project Preliminary Work Plan" (hereinafter referred to as "Key Preparation Project") , Mentioned several semiconductor projects.
The "Key Implementation Project" mentioned the core Mai IDM analog integrated circuit chip production line project, the industrialization of high-end storage chips in Qingshan Lake Science and Technology City, etc .; Circuit manufacturing and other projects. The above three projects are scheduled to start construction in 2020.
Specifically, Hangzhou Jihai Semiconductor Co., Ltd.'s monthly production of 20,000 12-inch integrated circuit manufacturing projects is planned for 2020-2021, with a planned total investment of 35 billion yuan and a total land area of about 400 acres. The planned production capacity of the first phase is 20,000 pieces / month (12-inch wafers). In order to effectively control investment risks, the first phase of the project will be implemented in two stages. Phase I and Phase I are based on the industry ’s minimum investment scale for mature major manufacturers, and with full consideration of factors such as the optimal investment in key equipment such as lithography machines. After the successful implementation of the phase, the second phase will be launched to realize the industrialization capacity of the first phase of 20,000 pieces / month. After the successful implementation of the first phase, the project chose the opportunity to start the second phase of construction, with an additional capacity of 40,000 pieces / month (12-inch wafers).
Xinmai's IDM analog integrated circuit chip production line project has a total investment of 18 billion yuan. It plans to build an IDM analog integrated circuit chip production base with a total land area of about 700 acres. The overall plan is to be implemented in two phases. The first phase uses about 360 mu. The project is expected to complete the negotiation of the land transfer agreement in the first quarter, delist the land in the second quarter, and apply for preliminary approval of the project in the third quarter, and strive to start construction in the fourth quarter of this year.
The total investment of the high-end storage chip industrialization project of Qingshan Lake Science and Technology City is 18 billion yuan. The project plans to use 180 acres of land and a total construction area of 100,000 square meters. Completed a new high-end integrated circuit production line with a monthly output of 20,000 12-inch 28-nanometer. The project is expected to sign the mass production agreement in the first quarter, deepen the mass production feasibility study plan in the second quarter, and carry out the construction drawing design in the third quarter, striving to start construction in the fourth quarter of this year.
Based on the above information, the total investment of the above three major semiconductor projects is 71 billion yuan.