According to the Taiwan Media Economic Daily, SEMI International Semiconductor Industry Association and TechSearch International today (21st) announced a new version of the "Worldwide OSAT Manufacturing Sites Database".
The new version of the Global Subcontracting and Testing Factory database expands the scope of semiconductor testing and updates the process capability and service content of the plant.
The latest database has updated more than 80 projects covering packaging technology, product professional applications, ownership/new shareholders, etc.; more than 30 test plants have been added; the total number of factories tracked has reached 360, helping the semiconductor industry to master the global testing The industry services project information to meet the management needs of the supply chain.
The global outsourcing package test facility database is the only subcontracted package test database in the market. Tracking the supply of package testing services to manufacturers in the semiconductor industry is an indispensable business tool.
The global outsourced package test facility database shows that wire bond packages are still the largest internal interconnect technology, but advanced packaging technologies (including bumping, wafer level packaging (wafer-level packaging) ) and flip-chip assembly, etc.) have also seen significant growth; in terms of applications, mobile devices, high-performance computing (HPC) and 5G technologies are expected to continue to drive innovation in the OSAT industry.
Cao Shilun, president of SEMI Taiwan, pointed out that according to data from the database, the investment strength of semiconductor packaging and testing vendors in advanced packaging technology and 5G application chip testing capabilities has increased year by year.
In view of this, the global outsourcing package test plant database combined with data from SEMI and TechSearch International covers the revenue comparison of the world's top 20 outsourcing manufacturers in 2017 and 2018, as well as the facilities and technologies of the OSAT plant. The scope of the service.
It is reported that the database covers the list of factories in the world's outsourcing packaging and testing plants in mainland China, Taiwan, Korea, Japan, Southeast Asia, Europe and the Americas.
The report includes the location of the existing plant, the technology and capabilities of each plant, the packaging services provided by the supplier, and the location of the packaged test plant planned or under construction will be simultaneously disclosed.
Packaging technology can directly affect chip performance, yield and cost. To understand the development of related package testing technology, it is necessary to understand the services provided by vendors in various regions. So the focus of the report is that the database covers more than 120 companies and 360 plants worldwide; testing technology provided by more than 200 plant facilities; and leadframe CSPs provided by more than 90 plants.
SEMI noted that all materials in the global outsourced packaged test facility database were collected by SEMI and TechSearch International. Reporting authorizations are divided into single and multiple uses.